HiSilicon

HiSilicon Semiconductor Co., Ltd.
Native name
 海思半导体有限公司
Subsidiary
Traded as HiSilicon
Industry Fabless semiconductors, Semiconductors, Integrated circuit design
Founded 2004 (2004)
Headquarters Shenzhen, Guangdong, China
Products SoCs
Parent Huawei
Website www.hisilicon.com
HiSilicon
Simplified Chinese 海思半导体有限公司
Traditional Chinese 海思半導體有限公司
Literal meaning Haisi Semiconductor Limited Company

HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a Chinese fabless semiconductor company based in Shenzhen, Guangdong and fully owned by Huawei.

HiSilicon purchases licenses for CPU designs from ARM Holdings, including the ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,[1][2] ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics cores.[3][4] HiSilicon has also purchased licenses from Vivante Corporation for their GC4000 graphics core.

HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.[5]

Products

HiSilicon develops and manufactures SoCs based on ARM processors. Though not exclusive, these SoCs see preliminary use in handheld and tablet devices of its parent company Huawei.

K3V2

The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones[6] and Huawei MediaPad 10 FHD7 tablets.[7] This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.[8] The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V2 (Hi3620) 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB41.4 Vivante GC4000240 MHz

(15.3GFlops)

 LPDDR264-bit dual-channel7.2 (up to 8.5) N/AN/AN/AN/A 2012

K3V2E

This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V2E 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB41.5 Vivante GC4000240 MHz

(15.3GFlops)

 LPDDR264-bit dual-channel7.2 (up to 8.5) N/AN/AN/AN/A 2013

Kirin 620

• supports - USB 2.0 / 13 MP / 1080p video encode

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 620 28 nm ARMv8-A Cortex-A53 8 1.2 Mali-450 MP4 533 MHz (32GFlops) LPDDR3 ( MHz)32-bit single-channel6.4 N/A Dual SIM LTE Cat.4 (150Mbit/s)802.11 b/g/n (Wifi Direct & Hotspot) Not Supporting DLNA / MiracastBluetooth v4.0, A2DP, EDR, LE Q1 2015

Kirin 650, 655, 658, 659

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 650 16 nm FinFET+ ARMv8-A Cortex-A53
Cortex-A53		 4+4 2.0 (4xA53) 1.7 (4xA53) Mali-T830 MP2 900 MHz

(40.8GFlops)

 LPDDR3 (933MHz)64-bit dual-channel (2x32bit)[9] A-GPS, GLONASS Dual SIM LTE Cat.6 (300Mbit/s)802.11 b/g/nBluetooth v4.1 Q2 2016
Kirin 655 2.12 (4xA53) 1.7 (4xA53) Q4 2016
Kirin 658 2.35 (4xA53) 1.7 (4xA53) 802.11 b/g/n/ac Q2 2017
Kirin 659 2.36 (4xA53) 1.7 (4xA53) 802.11 b/g/nBluetooth v4.2 N/A

Kirin 710

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 710 12 nm FinFET ARMv8-A Cortex-A73
Cortex-A53		 4+4 2.2 (4xA73) 1.7 (4xA53) Mali-G51 MP4 ??? MHz ??? A-GPS, GLONASS Dual SIM LTE Cat.12 (600Mbit/s)802.11 b/g/nBluetooth v4.1 Q3 2018

Kirin 910 and 910T

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 910 28 nm HPM ARMv7 Cortex-A941.6 Mali-450 MP4533 MHz

(32GFlops)

 LPDDR332-bit single-channel6.4 N/A LTE Cat.4N/AN/A H1 2014
Kirin 910T 1.8 700 MHz

(41.8GFlops)

 N/AN/AN/A H1 2014

Kirin 920, 925 and 928

• The Kirin 920 SoC also contains an image processor that supports up to 32 megapixel

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 920 28 nm HPM ARMv7 Cortex-A15
Cortex-A7
big.LITTLE		4+41.7 (A15)
1.3 (A7)		 Mali-T628 MP4600 MHz

(76.8GFlops)

 LPDDR3 (1600 MHz)64-bit dual-channel12.8 N/A LTE Cat.6 (300Mbit/s)N/AN/A H2 2014
Kirin 925 1.8 (A15)
1.3 (A7)		 N/AN/AN/A Q3 2014
Kirin 928 2.0 (A15)
1.3 (A7)		 N/AN/A N/A N/A

Kirin 930 and 935

• supports - SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 930 28 nm HPC ARMv8-A Cortex-A53
Cortex-A53		 4+4 2.0 (A53)
1.5 (A53)		 Mali-T628 MP4 600 MHz

(76.8GFlops)

 LPDDR3 (1600 MHz)64-bit(2x32-bit) Dual-channel12.8 GB/s N/A Dual SIM LTE Cat.6 (DL:300Mbit/s UP:50Mbit/s)N/AN/A Q1 2015
Kirin 935 2.2 (A53)
1.5 (A53)		 680 MHz

(87GFlops)

 N/AN/AN/A Q1 2015

Kirin 950 and 955

• supports - SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 950 TSMC 16 nm FinFET+[14] ARMv8-A Cortex-A72
Cortex-A53
big.LITTLE		 4+4 2.3 (A72)
1.8 (A53)		 Mali-T880 MP4 900 MHz

(122.4GFlops)

 LPDDR464-bit(2x32-bit) Dual-channel25.6 N/A Dual SIM LTE Cat.6N/AN/A Q4 2015
Kirin 955[16] 2.5 (A72)
1.8 (A53)		 LPDDR3 (3 GB) LPDDR4 (4 GB) N/AN/AN/A Q2 2016

Kirin 960

  • Interconnect: ARM CCI-550, Storage: UFS 2.1, eMMC 5.1, Sensor Hub: i6
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 960[17] TSMC 16 nm FFC ARMv8-A Cortex-A73
Cortex-A53
big.LITTLE		 4+4 2.36 (A73)
1.84 (A53)		 Mali-G71 MP8 1037 MHz

(282GFlops)

 LPDDR4-180064-bit(2x32-bit) Dual-channel28.8 N/A Dual SIM LTE Cat.12 LTE 4x CA, 4x4 MIMON/AN/A Q4 2016

Kirin 970

  • Interconnect: ARM CCI-550, Storage: UFS 2.1, Sensor Hub: i7, NPU: 1.92T FP16 OPS
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 970 TSMC 10 nm FinFET+ ARMv8-A Cortex-A73
Cortex-A53
big.LITTLE		 4+4 2.36 (A73)
1.84 (A53)		 Mali-G72 MP12 746 MHz

(330 GFlops)

 LPDDR4X-186664-bit(4x16-bit) Quad-channel29.8 N/A Dual SIM LTE Cat.18 LTE 5x CA, No 4x4 MIMON/AN/A Q4 2017

Kirin 980

  • Interconnect: ??, Storage: UFS 2.1, Sensor Hub: i8, Dual NPU
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling Availability Utilizing Devices
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 980 TSMC 7 nm FinFET ARMv8-A Cortex-A76
Cortex-A55
DynamIQ		 (2+2)+4 2.6 (A76 H)
1.92 (A76 L)
1.8 (A55)		 Mali-G76 MP10 720 MHz

(489.6 GFlops)

 LPDDR4X-213364-bit(4x16-bit) Quad-channel34.1 N/A Dual SIM LTE Cat.21 LTE 5x CA, No 4x4 MIMON/AN/A Q4 2018 Huawei Mate 20

Huawei Mate 20 Pro

Similar platforms

The Kirin processors compete with products from several other companies, including:

References

  1. ↑ HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications, 02 August 2011 on ARM.com
  2. ↑ "HiSilicon Technologies Co., Ltd. 海思半导体有限公司". ARM Holdings. Retrieved 26 April 2013.
  3. ↑ ARM Launches Cortex-A50 Series, the World’s Most Energy-Efficient 64-bit Processors on ARM.com
  4. ↑ Lai, Richard. "Huawei's HiSilicon K3V3 chipset due 2H 2013, to be based on Cortex-A15". Engadget. Retrieved 26 April 2013.
  5. ↑ "Hisilicon grown into the largest local IC design companies". Windosi. September 2012. Retrieved 26 April 2013.
  6. ↑ brightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked on ARMdevices.net
  7. ↑ Huawei introduces quad-core 10 inch tablet with 1080p display on Liliputing.com
  8. ↑ Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate on Anandtech
  9. ↑ "HiSilicon Kirin 650 SoC - Benchmarks and Specs". www.notebookcheck.net. Retrieved 2017-02-04.
  10. ↑ "Huawei MediaPad X1". DeviceSpecifications. Archived from the original on 23 July 2014. Retrieved 14 March 2014.
  11. ↑ "Huawei P6 S". Huawei. Retrieved 12 June 2014.
  12. ↑ "Huawei MediaPad M1". DeviceSpecifications. Archived from the original on 29 April 2015. Retrieved 14 March 2014.
  13. ↑ "Huawei Honor 6". DeviceSpecifications. Retrieved 25 June 2014.
  14. ↑ Huawei Ascend Mate 8/Honor 7’s Kirin 940/950 Processor Performance & Specs
  15. ↑ "HUAWEI MediaPad M3 8.0". Huawei-Consumer. Huawei. Retrieved 18 January 2017.
  16. ↑ Kirin 955, Huawei P9, P9 Plus
  17. ↑ "Huawei announces the HiSilicon Kirin 960: 4xA73 + 4xA53, G71MP8, CDMA". AnandTech. 2016-10-19.
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