List of AMD accelerated processing unit microprocessors

This is a list of microprocessors designed by Advanced Micro Devices, under the AMD Accelerated Processing Unit product series.

Feature overview

Brand	Llano	Trinity	Richland	Kaveri	Carrizo	Bristol Ridge	Raven Ridge	Desna, Ontario, Zacate	Kabini, Temash	Beema, Mullins	Carrizo-L	Stoney Ridge
Platform	Desktop, Mobile							Ultra-mobile
Released	Aug 2011	Oct 2012	Jun 2013	Jan 2014	Jun 2015	Jun 2016	Oct 2017	Jan 2011	May 2013	Q2 2014	May 2015	June 2016
Fab. (nm)	GlobalFoundries 32 SOI			GlobalFoundries 28 SHP			GlobalFoundries 14LPP (FinFET)	TSMC 40	28
Die size (mm²)	228	246		245	244.62	250.04	210^[1]	75 (+ 28 FCH)	~107		TBA	125
Socket	FM1, FS1	FM2, FS1+, FP2		FM2+, FP3	FM2+^{[lower-alpha 1]}, FP4	AM4, FP4	AM4, FP5	FT1	AM1, FT3	FT3b	FP4	FP4
CPU micro-architecture	AMD 10h	Piledriver		Steamroller	Excavator		Zen	Bobcat	Jaguar	Puma	Puma+^[2]	Excavator
Memory support	DDR3-1866 DDR3-1600 DDR3-1333		DDR3-2133 DDR3-1866 DDR3-1600 DDR3-1333			DDR4-2933 DDR4-2667 DDR4-2400 DDR4-2133		DDR3L-1333 DDR3L-1066	DDR3L-1866 DDR3L-1600 DDR3L-1333 DDR3L-1066		DDR3L-1866 DDR3L-1600 DDR3L-1333	Up to DDR4-2133
3D engine^{[lower-alpha 2]}	TeraScale (VLIW5)	TeraScale (VLIW4)		GCN 2nd Gen (Mantle, HSA)	GCN 3rd Gen (Mantle, HSA)		GCN 5th Gen^[3] (Mantle, HSA)	TeraScale (VLIW5)	GCN 2nd Gen			GCN 3rd Gen^[3]
	Up to 400:20:8	Up to 384:24:6		Up to 512:32:8			Up to 704:44:16^[4]	80:8:4	128:8:4			Up to 192:?:?
	IOMMUv1			IOMMUv2				IOMMUv1^[5]			TBA	TBA
Video Decoder ASIC	UVD 3.0			UVD 4.2	UVD 6.0		VCN 1.0^[6]	UVD 3.0	UVD 4.0	UVD 4.2	UVD 6.0	UVD 6.3
Video Encoding ASIC	N/A	VCE 1.0		VCE 2.0	VCE 3.1		VCN 1.0^[6]	N/A	VCE 2.0		VCE 3.1
GPU power saving	PowerPlay	PowerTune						N/A	PowerTune^[7]
Max. displays^{[lower-alpha 3]}	2–3	2–4		2–4	3	4	TBA	2			TBA	TBA
TrueAudio	N/A			^[9]				N/A^[5]				TBA
FreeSync	N/A			1 2				N/A				TBA
HDCP^{[lower-alpha 4]}	?			1.4			1.4 2.2	?	1.4
PlayReady^{[lower-alpha 4]}	?						3.0 (upcoming)	?
`/drm/radeon`^{[lower-alpha 5]}^[10]^[11]						N/A						N/A
`/drm/amdgpu`^{[lower-alpha 5]}^[12]	N/A			^[13]				N/A	^[13]

↑ No APU models. Athlon X4 845 only.
↑ Unified shaders : texture mapping units : render output units
↑ To feed more than two displays, the additional panels must have native DisplayPort support.^[8] Alternatively active DisplayPort-to-DVI/HDMI/VGA adapters can be employed.
1 2 To play protected video content, it also requires card, operating system, driver, and application support. A compatible HDCP display is also needed for this. HDCP is mandatory for the output of certain audio formats, placing additional constraints on the multimedia setup.
1 2 DRM (Direct Rendering Manager) is a component of the Linux kernel. Support in this table refers to the most current version.

Graphics API overview

The following table shows the graphics and compute APIs support across Radeon-branded GPU microarchitectures. Note that a branding series might include older generation chips.

Chip series	Micro-architecture	Fab	Supported APIs					AMD support	Year introduced	Introduced with
			Rendering			Computing
			Vulkan	OpenGL^[14]	Direct3D	HSA	OpenCL
R100	Fixed-pipeline^{[lower-alpha 1]}	180 nm 150 nm	No	1.3	7.0	No	No	Ended	2000	Original "ATI Radeon", as well as Radeon DDR, 7000, 7500, VE, and LE models
R200	Programmable pixel & vertex pipelines	150 nm		1.3	8.1				2001	8500, 9000, 9200 and 9250
R300		150 nm 130 nm 110 nm		2.0^{[lower-alpha 2]}	9.0 11 (FL 9_2)				2002	9500–9800, X300–X600, X1050
R420		130 nm 110 nm			9.0b 11 (FL 9_2)				2004	X700–X850
R520		90 nm 80 nm			9.0c 11 (FL 9_3)				2005	X1300–X1950
R600	TeraScale 1	80 nm 65 nm		3.3	10.0 11 (FL 10_0)		ATI Stream		2007	HD 2000 series, HD 3410
RV670		55 nm			10.1 11 (FL 10_1)		ATI Stream APP^[15]		2007	HD 3450–3870, Mobility HD 2000 and 3000 series
RV770		55 nm 40 nm			10.1 11 (FL 10_1)		1.0		2008	HD 4000 series
Evergreen	TeraScale 2	40 nm		4.4^{[lower-alpha 3]} 4.5 Mesa WIP 4.6 Mesa WIP without SPIR-V	11 (FL 11_0)		1.2		2009	HD 5000 series
Northern Islands	TeraScale 2 TeraScale 3	40 nm			11 (FL 11_0)		1.2		2010	HD 6000 series, and IGP 7000 series
Southern Islands	GCN 1^st gen	28 nm	1.0	4.5 4.6 possible (WIP)	11 (FL 11_1) 12 (FL11_1)	Yes	1.2 2.0 possible	Current	2012	HD 7000 series
Sea Islands	GCN 2^nd gen		1.1 ^[16]		11 (FL 12_0) 12 (FL 12_0)		2.0 2.1 Beta 2.2 possible		2013	Radeon 200 series
Volcanic Islands	GCN 3^rd gen		1.1						2015	Radeon 300 series
Arctic Islands	GCN 4^th gen	14 nm							2016	Radeon 400 series
Vega	GCN 5^th gen	14 nm 7 nm			11 (FL 12_1) 12 (FL 12_1)				2017	Radeon Vega series

↑ Radeon 7000 Series has programmable pixel shaders, but do not fully comply with DirectX 8 or Pixel Shader 1.0. See article on R100's pixel shaders.
↑ These series do not fully comply with OpenGL 2+ as the hardware does not support all types of non-power-of-two (NPOT) textures.
↑ OpenGL 4+ compliance requires supporting FP64 shaders and these are emulated on some TeraScale chips using 32-bit hardware.

^[17]^[18]^[19]

Desktop APUs

Lynx: "Llano" (2011)

Socket FM1
CPU: K10 (or Husky or K10.5) with no L3 cache cores with an upgraded architecture known as Stars
MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V
GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics.^[20]
Support for up to four DIMMs of up to DDR3-1866 memory
Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm², with 1.178 billion transistors^[21]^[22]
5 GT/s UMI
Integrated PCIe 2.0 controller
Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the current Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series

Model	Stepping	CPU				GPU			Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	Turbo	L2 cache	Model	Config²	Clock	Memory support	TDP	Released	Part number
Sempron X2 198	B0	2	2.5 GHz	N/A	2 × 512 kB	N/A			DDR3-1600	065 W	Q1 2012	SD198XOJZ22GX SD198XOJGXBOX

Athlon II X2 221			2.8 GHz									AD221XOJZ22GX AD221XOJGXBOX

Athlon II X4 631		4	2.6 GHz		4 × 1 MB				DDR3-1866	100 W	Aug 15, 2011	AD631XOJZ43GX AD631XWNZ43GX
Athlon II X4 638			2.7 GHz							065 W	Feb 8, 2012	AD638XOJZ43GX AD638XOJGXBOX
Athlon II X4 641			2.8 GHz							100 W	Feb 8, 2012	AD641XWNZ43GX AD641XWNGXBOX
Athlon II X4 651			3.0 GHz								Nov 14, 2011	AD651XWNZ43GX AD651XWNGXBOX
Athlon II X4 651K			3.0 GHz								Q1, 2012	AD651KWNZ43GX AD651KWNGXBOX

E2-3200		2	2.4 GHz		2 × 512 kB	HD 6370D	160:8:4	443 MHz	DDR3-1600	065 W	Q4 2011	ED3200OJZ22GX ED3200OJGXBOX

A4-3300			2.5 GHz			HD 6410D		443 MHz			Sep 7, 2011	AD33000OJZ22HX AD3300OJHXBOX
A4-3400			2.7 GHz					600 MHz			Sep 7, 2011	AD3400OJZ22GX AD3400OJGXBOX
A4-3420			2.8 GHz					600 MHz			Dec 20, 2011	AD3420OJZ22HX

A6-3500		3	2.1 GHz	2.4 GHz	3 × 1 MB	HD 6530D	320:16:8	443 MHz	DDR3-1866	065 W	Aug 17, 2011	AD3500OJZ33GX AD3500OJGXBOX
A6-3600		4	2.1 GHz	2.4 GHz	4 × 1 MB						Aug 17, 2011	AD3600OJZ43GX AD3600OJGXBOX
A6-3620			2.2 GHz	2.5 GHz							Dec 20, 2011	AD3620OJZ43GX
A6-3650			2.6 GHz	N/A						100 W	Jun 30, 2011	AD3650WNZ43GX AD3650WNGXBOX
A6-3670K⁴			2.7 GHz	N/A						100 W	Dec 20, 2011	AD3670WNZ43GX AD3670WNGXBOX

A8-3800		4	2.4 GHz	2.7 GHz	4 × 1 MB	HD 6550D	400:20:8	600 MHz		065 W	Aug 17, 2011	AD3800OJZ43GX AD3800OJGXBOX
A8-3820			2.5 GHz	2.8 GHz						065 W	Dec 20, 2011	AD3820OJZ43GX
A8-3850			2.9 GHz	N/A						100 W	Jun 30, 2011	AD3850WNZ43GX AD3850WNGXBOX
A8-3870K⁴			3.0 GHz	N/A						100 W	Dec 20, 2011	AD3870WNZ43GX AD3870WNGXBOX

Virgo: "Trinity" (2012)

Fabrication 32 nm on GlobalFoundries SOI process
Socket FM2
CPU: Piledriver
GPU TeraScale 3 (VLIW4)
Die Size: 246 mm², 1.303 Billion transistors^[23]
Support for up to four DIMMs of up to DDR3-1866 memory
5 GT/s UMI
GPU (based on VLIW4 architecture) instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3
Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C^[24], ABM, BMI1, TBM
Athlon models exclude integrated graphics
Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card.^[25]^[26] However, it has been found that this does not always improve 3D accelerated graphics performance.^[27]^[28]

Model number	Stepping	CPU				GPU			Memory support	TDP	Released	Part number^[29]
Model number	Stepping	Modules (cores)	Clock	Turbo	L2 cache	Model	Config²	Clock	Memory support	TDP	Released	Part number^[29]
Sempron X2 240^[30]	TN-A1	1(2)	2.9 GHz	3.3 GHz	1 MB	N/A			DDR3-1600	065 W		SD240XOKA23HJ
Athlon X2 340^[31]		1(2)	3.2 GHz	3.6 GHz	1 MB				DDR3-1600	065 W	Oct 2012	AD340XOKA23HJ

Athlon X4 740		2(4)	3.2 GHz	3.7 GHz	2× 2 MB				DDR3-1866	065 W	Oct 2012	AD740XOKA44HJ AD740XOKHJBOX
Athlon X4 750K			3.4 GHz	4.0 GHz						100 W	Oct 2012	AD750KWOA44HJ AD750KWOHJBOX

FirePro A300			3.4 GHz	4.0 GHz		FirePro	384:24:8	760 MHz		065 W	Aug 7, 2012	AWA300OKA44HJ
FirePro A320			3.8 GHz	4.2 GHz		FirePro	384:24:8	800 MHz		100 W	Aug 7, 2012	AWA320WOA44HJ

A4-5300		1(2)	3.4 GHz	3.6 GHz	1 MB	HD 7480D	128:8:4	723 MHz	DDR3-1600	065 W	Oct 1, 2012	AD5300OKA23HJ AD5300OKHJBOX
A4-5300B			3.4 GHz	3.6 GHz		HD 7480D	128:8:4	723 MHz	DDR3-1600			AD530BOKA23HJ

A6-5400K			3.6 GHz	3.8 GHz		HD 7540D	192:12:4	760 MHz	DDR3-1866		Oct 1, 2012	AD540KOKA23HJ AD540KOKHJBOX
A6-5400B			3.6 GHz	3.8 GHz		HD 7540D	192:12:4	760 MHz	DDR3-1866			AD540BOKA23HJ

A8-5500		2(4)	3.2 GHz	3.7 GHz	2× 2 MB	HD 7560D	256:16:8	760 MHz	DDR3-1866	065 W	Oct 1, 2012	AD5500OKA44HJ AD5500OKHJBOX
A8-5500B			3.2 GHz	3.7 GHz						065 W		AD550BOKA44HJ
A8-5600K			3.6 GHz	3.9 GHz						100 W	Oct 1, 2012	AD560KWOA44HJ AD560KWOHJBOX

A10-5700			3.4 GHz	4.0 GHz		HD 7660D	384:24:8	760 MHz		065 W	Oct 1, 2012	AD5700OKA44HJ AD5700OKHJBOX
A10-5800K			3.8 GHz	4.2 GHz				800 MHz		100 W	Oct 1, 2012	AD580KWOA44HJ AD580KWOHJBOX
A10-5800B			3.8 GHz	4.2 GHz				800 MHz		100 W		AD580BWOA44HJ

"Richland" (2013)

Fabrication 32 nm on GlobalFoundries SOI process
Socket FM2
CPU
- Piledriver architecture
- 2 cores per module
- L1 Cache: 16 KB Data per core and 64 KB Instructions per module
- MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, AVX1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit
- PowerNow!
GPU
- TeraScale 3 architecture
- HD Media Accelerator, AMD Hybrid Graphics

Model	Stepping	CPU				GPU			Memory support	TDP	Released	Part number
Model	Stepping	Modules (cores)	Base	Turbo	L2 cache	Model	Config	Clock	Memory support	TDP	Released	Part number
Sempron X2 250^[30]	RL-A1	1(2)	3.2 GHz	3.6 GHz	1 MB	N/A				065 W		SD250XOKA23HL

Athlon X2 350^[32]			3.5 GHz	3.9 GHz					DDR3-1866	065 W		AD350XOKA23HL
Athlon X2 370K			4.0 GHz	4.2 GHz						065 W	Jun 2013	AD370KOKA23HL AD370KOKHLBOX

Athlon X4 750		2(4)	3.4 GHz	4.0 GHz	2× 2 MB					065 W		AD750XOKA44HL AD750KWOHJBOX
Athlon X4 760K			3.8 GHz	4.1 GHz						100 W	Jun 2013	AD760KWOA44HL AD760KWOHLBOX

FX-670K^[33]			3.7 GHz	4.3 GHz						065 W		FD670KOKA44HL

A4-4000		1(2)	3.0 GHz	3.2 GHz	1 MB	7480D	128	720 MHz	DDR3-1333	065 W	May 2013	AD4000OKA23HL AD4000OKHLBOX
A4-4020			3.2 GHz	3.4 GHz		7480D		720 MHz	DDR3-1333		Jan 2014	AD4000OKA23HL AD4020OKHLBOX
A4-6300			3.7 GHz	3.9 GHz		8370D		760 MHz	DDR3-1600		July 2013	AD6300OKA23HL AD6300OKHLBOX
A4-6300B			3.7 GHz	3.9 GHz							July 2013	AD630BOKA23HL
A4-6320			3.8 GHz	4.0 GHz							Dec 2013	AD6320OKA23HL AD6320OKHLBOX
A4-6320B												AD632BOKA23HL
A4-7300						8470D	192	800 MHz			Aug 2014	AD7300OKA23HL
A4 PRO-7300B											Aug 2014	AD730BOKA23HL

A6-6400B			3.9 GHz	4.1 GHz					DDR3-1866		Jun 4, 2013	AD640BOKA23HL
A6-6400K			3.9 GHz	4.1 GHz							Jun 4, 2013	AD640KOKA23HL AD640KOKHLBOX
A6-6420B			4.0 GHz	4.2 GHz							Jan 2014	AD642BOKA23HL
A6-6420K			4.0 GHz	4.2 GHz							Jan 2014	AD642KOKA23HL AD642KOKHLBOX

A8-6500T		2(4)	2.1 GHz	3.1 GHz	2× 2 MB	8550D	256	720 MHz	DDR3-1866	045 W	Sep 18, 2013	AD650TYHA44HL AD650TYHHLBOX
A8-6500			3.5 GHz	4.1 GHz		8570D		800 MHz		065 W	Jun 4, 2013	AD6500OKA44HL AD6500OKHLBOX
A8-6500B			3.5 GHz	4.1 GHz				800 MHz		065 W	Jun 4, 2013	AD650BOKA44HL
A8-6600K			3.9 GHz	4.2 GHz				844 MHz		100 W	Jun 4, 2013	AD660KWOA44HL AD660KWOHLBOX

A10-6700T			2.5 GHz	3.5 GHz		8650D	384	720 MHz	DDR3-1866	045 W	Sep 18, 2013	AD670TYHA44HL AD670TYHHLBOX
A10-6700			3.7 GHz	4.3 GHz		8670D		844 MHz		065 W	Jun 4, 2013	AD6700OKA44HL AD6700OKHLBOX
A10-6790B			4.0 GHz							100 W	Oct 29, 2013	AD679KWOA44HL AD679KWOHLBOX
A10-6790K			4.0 GHz									AD679BWOA44HL
A10-6800K			4.1 GHz	4.4 GHz					DDR3-2133		Jun 4, 2013	AD680KWOA44HL AD680KWOHLBOX
A10-6800B			4.1 GHz	4.4 GHz					DDR3-2133		Jun 4, 2013	AD680BWOA44HL

"Kabini" (2013, SoC)

Fabrication 28 nm by GlobalFoundries
Socket AM1, aka Socket FS1b (AM1 platform)
2 to 4 CPU Cores (Jaguar (microarchitecture))
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
SoC with integrated memory, PCIe, 2× USB 3.0, 6× USB 2.0, Gigabit Ethernet, and 2× SATA III (6 Gb/s) controllers
GPU based on Graphics Core Next (GCN)

Model	Stepping	CPU				GPU					Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	Turbo	L2 cache	Model	Cores	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
Sempron 2650	A1	2	1.45 GHz	N/A	1 MB	R3 (HD 8240)	2	128:8:4	400 MHz	N/A	DDR3-1333 (Single channel only)	025 W	April 9, 2014	SD2650JAH23HM SD2650JAHMBOX
Sempron 3850		4	1.30 GHz		2 MB	R3 (HD 8280)			450 MHz		DDR3-1600 (Single channel only)			SD3850JAH44HM SD3850JAHMBOX
Athlon 5150			1.60 GHz			R3 (HD 8400)			600 MHz					AD5150JAH44HM AD5150JAHMBOX
Athlon 5350			2.05 GHz											AD5350JAH44HM AD5350JAHMBOX
Athlon 5370			2.20 GHz										February, 2016	AD5370JAH44HM

"Kaveri" (2014)

Fabrication 28 nm by GlobalFoundries
Socket FM2+,^[34] support for PCIe 3.0
Two or four CPU cores based on the Steamroller microarchitecture
- Kaveri refresh models have codename Godavari^[35]
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
Three to eight Compute Units (CUs) based on GCN 2nd gen microarchitecture;^[36] 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs)
Heterogeneous System Architecture-enabled zero-copy through pointer passing
SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio^[37]
Dual-channel (2× 64 Bit) DDR3 memory controller
Integrated custom ARM Cortex-A5 co-processor^[38] with TrustZone Security Extensions^[39]
Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card^[40]
Display controller: AMD Eyefinity 2, 4K Ultra HD support, DisplayPort 1.2 Support^[41]

Model	Stepping	CPU				GPU				Memory support	TDP	Release date	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache	Model	Cores	Config	Clock	Memory support	TDP	Release date	Part number
Athlon X2 450^[32]	KV-A1	1(2)	3.5 GHz	3.9 GHz	1 MB	N/A				DDR3-1866	65 W	Jul 31, 2014	AD450XYBI23JA
Athlon X4 840^[32]		2(4)	3.1 GHz	3.8 GHz	2× 2 MB					DDR3-1866	65 W	Aug 2014	AD840XYBI44JA AD840XYBJABOX
Athlon X4 860K			3.7 GHz	4.0 GHz							95 W	Aug 2014	AD860KXBI44JA AD860KXBJABOX AD860KWOHLBOX AD860KXBJASBX
Athlon X4 870K	GV-A1		3.9 GHz	4.1 GHz								Dec 2015	AD870KXBI44JC AD870KXBJCSBX
Athlon X4 880K	GV-A1		4.0 GHz	4.2 GHz						DDR3-2133		Mar 1, 2016	AD880KXBJCSBX

FX-770K^[42]	KV-A1		3.5 GHz	3.9 GHz						DDR3-2133	65 W	Dec 2014	FD770KYBI44JA

A4 PRO-7350B		1(2)	3.4 GHz	3.8 GHz	1 MB	R5	3	192:12:8	514 MHz	DDR3-1866	65 W	Jul 31, 2014	AD735BYBI23JA
PRO A4-8350B			3.5 GHz	3.9 GHz			4	256:16:8	757 MHz			Sep 29, 2015	AD835BYBI23JC

A6-7400K			3.5 GHz	3.9 GHz					756 MHz			Jul 31, 2014	AD740KYBI23JA AD740KYBJABOX
A6 PRO-7400B			3.5 GHz	3.9 GHz					756 MHz			Jul 31, 2014	AD740BYBI23JA
A6-7470K	GV-A1		3.7 GHz	4.0 GHz					800 MHz	DDR3-2133		Feb 2, 2016	AD747KYBI23JC AD747KYBJCBOX
PRO A6-8550B	GV-A1		3.7 GHz	4.0 GHz					800 MHz	DDR3-2133		Sep 29, 2015	AD855BYBI23JC

A8-7600	KV-A1	2(4)	3.1 GHz	3.8 GHz	2× 2 MB	R7	6	384:24:8	720 MHz	DDR3-2133	65 W	Jul 31, 2014	AD7600YBI44JA AD7600YBJABOX
A8 PRO-7600B			3.1 GHz								65 W	Jul 31, 2014	AD760BYBI44JA
A8-7650K			3.3 GHz								95 W	Jan 7, 2015	AD765KXBI44JA AD765KXBJABOX
A8-7670K	GV-A1		3.6 GHz	3.9 GHz					757 MHz		95 W	Jul 20, 2015	AD767KXBI44JC AD767KXBJCSBX AD767KXBJCBOX
PRO A8-8650B	GV-A1		3.2 GHz	3.9 GHz					757 MHz		65 W	Sep 29, 2015	AD865BYBI44JC

A10-7700K	KV-A1		3.4 GHz	3.8 GHz					720 MHz		95 W	Jan 14, 2014	AD770KXBI44JA AD770KXBJABOX
A10-7800			3.5 GHz	3.9 GHz			8	512:32:8	720 MHz		65 W	Jul 31, 2014	AD7800YBI44JA AD7800YBJABOX
A10 PRO-7800B			3.5 GHz	3.9 GHz							65 W	Jul 31, 2014	AD780BYBI44JA
A10-7850K			3.7 GHz	4.0 GHz							95 W	Jan 14, 2014	AD785KXBI44JA AD785KXBJABOX
A10 PRO-7850B			3.7 GHz								95 W	Jul 31, 2014	AD785BXBI44JA
A10-7860K	GV-A1		3.6 GHz						757 MHz		65 W	Feb 2, 2016	AD786KYBI44JC AD786KYBJABOX AD786KYBJCSBX
A10-7870K			3.9 GHz	4.1 GHz					866 MHz		95 W	May 28, 2015	AD787KXDI44JC AD787KXDJCBOX AD787KXDJCSBX
A10-7890K			4.1 GHz	4.3 GHz					866 MHz		95 W	Mar 1, 2016	AD789KXDJCHBX
PRO A10-8750B			3.6 GHz	4.0 GHz					757 MHz		65 W	Sep 29, 2015	AD875BYBI44JC
PRO A10-8850B			3.9 GHz	4.1 GHz					800 MHz		95 W	Sep 29, 2015	AD885BXBI44JC

"Carrizo" (2016)

Fabrication 28 nm by GlobalFoundries
Socket FM2+, AM4, support for PCIe 3.0
Two or four CPU cores based on the Excavator microarchitecture
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand, Turbo Core
Dual-channel DDR4 memory controller

Model	Stepping	CPU				GPU				Memory support	TDP	Socket	Released	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache	Model	Cores	Config	Clock	Memory support	TDP	Socket	Released	Part number
Athlon X4 845	CZ-A1	2(4)	3.5 GHz	3.8 GHz	2x 1 MB	N/A				DDR3-2133	65 W	FM2+	Feb 2, 2016	AD845XYBJCSBX AD845XACKASBX
						N/A
PRO A6-8570E		1(2)	3.0 GHz	3.4 GHz	1× 1 MB	R5	4	256:16:4	800 MHz	DDR4-2400	35 W	AM4	Oct 2016	AD857BAHM23AB
PRO A6-8570		1(2)	3.5 GHz	3.8 GHz	1× 1 MB	R5	6	384:24:6	1029 MHz		65 W			AD857BAGM23AB
PRO A10-8770E		2 4)	2.8 GHz	3.5 GHz	2× 1 MB	R7			847 MHz		35 W			AD877BAHM44AB
PRO A10-8770			3.5 GHz	3.8 GHz					1029 MHz		65 W			AD877BAGM44AB
PRO A12-8870E			2.9 GHz	3.8 GHz			8	512:32:8	900 MHz		35 W			AD887BAHM44AB
PRO A12-8870			3.7 GHz	4.2 GHz			8	512:32:8	1108 MHz		65 W			AD887BAUM44AB

"Bristol Ridge" (2016)

Fabrication 28 nm by GlobalFoundries
Socket AM4, support for PCIe 3.0
Two or Four CPU cores based on the Excavator microarchitecture
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand, Turbo Core
Dual-channel DDR4 memory controller
PCI Express 3.0 x8 (No Bifurcation support, requires a PCI-e switch for any configuration other than x8)
PCI Express 3.0 x4 as link to optional external chipset
4x USB 3.1 Gen 1
Storage: 2x SATA and 2x NVMe or 2x PCI Express
Third Generation GCN based GPU^[43] with hybrid VP9 decoding

Model	Stepping	CPU				GPU				Memory support	TDP	Released	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache	Model	Cores	Config	Clock	Memory support	TDP	Released	Part number
Athlon X4 940	BR-A1	2 (4)	3.2 GHz	3.6 GHz	2× 1 MB	N/A				DDR4-2400	65 W	July 27, 2017	AD940XAGM44AB
Athlon X4 950			3.5 GHz	3.8 GHz									AD950XAGM44AB
Athlon X4 970			3.8 GHz	4.0 GHz									AD970XAUM44AB

A6-9500E		1 (2)	3.0 GHz	3.4 GHz	1× 1 MB	R5	4	256:16:4	800 MHz		35 W	September 5, 2016	AD9500AHM23AB AD9500AHABBOX
PRO A6-9500E			3.0 GHz	3.4 GHz			4	256:16:4	800 MHz		35 W	October 3, 2016	?
A6-9500			3.5 GHz	3.8 GHz			6	384:24:6	1029 MHz		65 W	September 5, 2016	AD9500AGM23AB AD9500AGABBOX
PRO A6-9500			3.5 GHz	3.8 GHz			6	384:24:6	1029 MHz			October 3, 2016	?
A6-9550			3.8 GHz	4.0 GHz			4	256:16:4	800 MHz			July 27, 2017	AD9550AGM23AB AD9550AGABBOX

A8-9600		2 (4)	3.1 GHz	3.4 GHz	2× 1 MB	R7	6	384:24:6	900 MHz		65 W	September 5, 2016	AD9600AGM44AB AD9600AGABBOX
PRO A8-9600			3.1 GHz	3.4 GHz					900 MHz		65 W	October 3, 2016	?

A10-9700E			3.0 GHz	3.5 GHz					847 MHz		35 W	September 5, 2016	AD9700AHM44AB AD9700AHABBOX
PRO A10-9700E			3.0 GHz	3.5 GHz					847 MHz		35 W	October 3, 2016	?
A10-9700			3.5 GHz	3.8 GHz					1029 MHz		65 W	September 5, 2016	AD9700AGM44AB AD9700AGABBOX
PRO A10-9700			3.5 GHz	3.8 GHz					1029 MHz		65 W	October 3, 2016	?

A12-9800E			3.1 GHz	3.8 GHz			8	512:32:8^[44]	900 MHz		35 W	September 5, 2016	AD9800AUM44AB AD9800AHABBOX
PRO A12-9800E			3.1 GHz	3.8 GHz					900 MHz		35 W	October 3, 2016	?
A12-9800			3.8 GHz	4.2 GHz					1108 MHz		65 W	September 5, 2016	AD9800AUM44AB AD9800AUABBOX
PRO A12-9800			3.8 GHz	4.2 GHz					1108 MHz		65 W	October 3, 2016	?

"Raven Ridge" (2018)

Fabrication 14 nm by GlobalFoundries
Transistors: 4.95 billion
Die size: 210 mm²
Socket AM4
Zen CPU cores
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RdRand, Turbo Core
Fifth generation GCN based GPU
Video Core Next (VCN) 1.0

Model	CPU						GPU				Memory support	TDP	Release date	Release price
	Cores (threads)	Clock rate (GHz)			Cache^{[lower-alpha 1]}		Model	Config^{[lower-alpha 2]} (cores)	Clock	Processing power (GFLOPS)^{[lower-alpha 3]}
	Cores (threads)	Base	Boost	XFR	L2	L3	Model	Config^{[lower-alpha 2]} (cores)	Clock	Processing power (GFLOPS)^{[lower-alpha 3]}
Athlon 200GE^[46]^[47]	2 (4)	3.2	N/A	Unknown	1 MB	4 MB	Vega 3	192:12:4 (3)	1000 MHz	384	DDR4-2666 (Dual channel)	35 W	September 6, 2018	$55
Athlon Pro 200GE^[48]^[47]	2 (4)	3.2	N/A	Unknown	1 MB	4 MB	Vega 3	192:12:4 (3)	1000 MHz	384	DDR4-2666 (Dual channel)	35 W	September 6, 2018	Unknown
Ryzen 3 2200GE^[49]^[50]	4 (4)	3.2	3.6	Unknown	2 MB	4 MB	RX Vega 8	512:32:16 (8)	1100 MHz	1126	DDR4-2933 (Dual channel)^[51]^[52]	35 W	April 19, 2018	Unknown
Ryzen 3 Pro 2200GE^[53]		3.2	3.6	Unknown								35 W	May 10, 2018	Unknown
Ryzen 3 2200G^[52]^[54]		3.5	3.7	Unknown								45–65 W (configurable)	February 12, 2018^[55]	$99
Ryzen 3 Pro 2200G^[56]		3.5	3.7	Unknown								45–65 W (configurable)	May 10, 2018	Unknown
Ryzen 5 2400GE^[57]^[50]	4 (8)	3.2	3.8	Unknown			RX Vega 11	704:44:16 (11)^[58]	1250 MHz	1760		35 W	April 19, 2018	Unknown
Ryzen 5 Pro 2400GE^[59]		3.2	3.8	Unknown								35 W	May 10, 2018	Unknown
Ryzen 5 2400G^[51]^[54]		3.6	3.9	Unknown								45–65 W (configurable)	February 12, 2018^[55]^[60]	$169
Ryzen 5 Pro 2400G^[61]		3.6	3.9	Unknown								45–65 W (configurable)	May 10, 2018	Unknown

↑ AMD defines 1 kilobyte (KB) as 1024 bytes, and 1 megabyte (MB) as 1024 kilobytes.^[45]
↑ Unified Shaders : Texture Mapping Units : Render Output Units
↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Server APUs

Opteron X2100-series "Kyoto" (2013)

Fabrication 28 nm
Socket FT3 (BGA)
4 CPU Cores (Jaguar (microarchitecture))
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
Turbo Dock Technology, C6 and CC6 low power states
GPU based on GCN (Graphics Core Next) architecture

Model	Stepping	CPU						GPU				Memory support	TDP	Released	Part number	Release price (USD)
Model	Stepping	Cores	Frequency	Turbo	L2 cache	Multi	V_core	Model	Config	Frequency	Turbo	Memory support	TDP	Released	Part number	Release price (USD)
X2150	B0	4	1.9 GHz	N/A	2 MB			HD 8400		800 MHz	N/A	DDR3	22 W	May 2013	OX2150IAJ44HM	$99
X2170		4	2.4 GHz	N/A	2 MB			HD 8400		800 MHz	N/A	DDR3	25 W	September 2016	OX2170IXJ44JB

Opteron X3000-series (2017)

Fabrication 28 nm
Two or Four CPU cores based on the Excavator microarchitecture^[62]^[63]
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand
DDR4 SDRAM
GPU based on 3rd Generation GCN (Graphics Core Next) architecture

Model	Stepping	CPU						GPU				Memory support	TDP	Released	Part number	Release price (USD)
Model	Stepping	Cores	Frequency	Turbo	L2 cache	Multi	V_core	Model	Compute Units	Frequency	Turbo	Memory support	TDP	Released	Part number	Release price (USD)
X3216	Unknown	2	1.6 GHz	3.0 GHz	1 MB	Unknown	Unknown	Unknown	4	800 MHz	N/A	DDR4-1600	12-15 W	Unknown	Unknown	Unknown
X3418	Unknown	4	1.8 GHz	3.2 GHz	2 MB	Unknown	Unknown	Unknown	6	800 MHz	N/A	DDR4-2400	12-35 W	Unknown	Unknown	Unknown
X3421	Unknown	4	2.1 GHz	3.4 GHz	2 MB	Unknown	Unknown	Unknown	8	800 MHz	N/A	DDR4-2400	12-35 W	Unknown	Unknown	Unknown

Mobile APUs

Sabine: "Llano" (2011)

Fabrication 32 nm on GlobalFoundries SOI process
Socket FS1
Upgraded Stars (AMD 10h architecture) codenamed Husky CPU cores (K10.5) with no L3 cache, and with Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants)
Integrated PCIe 2.0 controller
GPU: TeraScale 2
Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
2.5 GT/s UMI
MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
PowerNow!

Model	Stepping	CPU				GPU			Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	Turbo	L2 cache	Model	Config²	Clock	Memory support	TDP	Released	Part number
E2-3000M	B0	2	1.8 GHz	2.4 GHz	2 × 512 kB	HD 6380G	160:8:4	400 MHz	DDR3-1333	35 W	Jun 14, 2011	EM3000DDX22GX

A4-3300M			1.9 GHz	2.5 GHz	2 × 1 MB	HD 6480G	240:12:4	444 MHz		35 W	Jun 14, 2011	AM3300DDX23GX
A4-3305M			1.9 GHz		2 × 512 kB		160:8:4	593 MHz		35 W	Dec 7, 2011	AM3305DDX22GX
A4-3310MX			2.1 GHz		2 × 1 MB		240:12:4	444 MHz		45 W	Jun 14, 2011	AM3310HLX23GX
A4-3320M			2.0 GHz	2.6 GHz						35 W	Dec 7, 2011	AM3320DDX23GX
A4-3330MX			2.2 GHz							45 W	Dec 7, 2011	AM3330HLX23GX
A4-3330MX			2.3 GHz		2 × 512 kB		160:8:4	593 MHz		45 W		AM3330HLX23HX

A6-3400M		4	1.4 GHz	2.3 GHz	4 × 1 MB	HD 6520G	320:16:8	400 MHz	DDR3-1333	35 W	Jun 14, 2011	AM3400DDX43GX
A6-3410MX			1.6 GHz	2.3 GHz					DDR3-1600	45 W	Jun 14, 2011	AM3410HLX43GX
A6-3420M			1.5 GHz	2.4 GHz					DDR3-1333	35 W	Dec 7, 2011	AM3420DDX43GX
A6-3430MX			1.7 GHz	2.4 GHz					DDR3-1600	45 W	Dec 7, 2011	AM3430HLX43GX

A8-3500M			1.5 GHz	2.4 GHz		HD 6620G	400:20:8	444 MHz	DDR3-1333	35 W	Jun 14, 2011	AM3500DDX43GX
A8-3510MX			1.8 GHz	2.5 GHz					DDR3-1600	45 W	Jun 14, 2011	AM3510HLX43GX
A8-3520M			1.6 GHz	2.5 GHz					DDR3-1333	35 W	Dec 7, 2011	AM3520DDX43GX
A8-3530MX			1.9 GHz	2.6 GHz					DDR3-1600	45 W	Jun 14, 2011	AM3530HLX43GX
A8-3550MX			2.0 GHz	2.7 GHz					DDR3-1600	45 W	Dec 7, 2011	AM3550HLX43GX

Comal: "Trinity" (2012)

Fabrication 32 nm on GlobalFoundries SOI process
Socket FS1r2, FP2
Based on the Piledriver architecture
GPU: TeraScale 3 (VLIW4)
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
2.5 GT/s UMI
Transistors: 1.303 billion
Die size: 246 mm²

Model number	Stepping	CPU				GPU				Memory support	TDP	Socket	Released	Part number
Model number	Stepping	Modules (cores)	Clock	Turbo	L2 cache	Model	Config	Clock	Turbo	Memory support	TDP	Socket	Released	Part number
A4-4355M	TN-A1	1(2)	1.9 GHz	2.4 GHz	1 MB	HD 7400G	192:12:4	327 MHz	424 MHz	DDR3-1333	17 W	FP2	Sep 27, 2012	AM4355SHE23HJ
A6-4455M		1(2)	2.1 GHz	2.6 GHz	2 MB	HD 7500G	256:16:8	327 MHz			17 W		May 15, 2012	AM4455SHE24HJ
A8-4555M		2(4)	1.6 GHz	2.4 GHz	2× 2 MB	HD 7600G	384:24:8	320 MHz			19 W		Sep 27, 2012	AM4555SHE44HJ
A8-4557M^[64]			1.9 GHz	2.8 GHz		HD 7000	256:16:8	497 MHz	655 MHz	DDR3L-1600	35 W		March 2013	AM4557DFE44HJ
A10-4655M			2.0 GHz	2.8 GHz		HD 7620G	384:24:8	360 MHz	496 MHz	DDR3-1333	25 W		May 15, 2012	AM4655SIE44HJ
A10-4657M^[64]			2.3 GHz	3.2 GHz		HD 7000	384:24:8	497 MHz	686 MHz	DDR3L-1600	35 W		March 2013	AM4657DFE44HJ

A4-4300M		1(2)	2.5 GHz	3.0 GHz	1 MB	HD 7420G	128:8:4	480 MHz	655 MHz	DDR3-1600	35 W	FS1	May 15, 2012	AM4300DEC23HJ
A6-4400M		1(2)	2.7 GHz	3.2 GHz	1 MB	HD 7520G	192:12:4	496 MHz	685 MHz					AM4400DEC23HJ
A8-4500M		2(4)	1.9 GHz	2.8 GHz	2× 2 MB	HD 7640G	256:16:8							AM4500DEC44HJ
A10-4600M		2(4)	2.3 GHz	3.2 GHz	2× 2 MB	HD 7660G	384:24:8							AM4600DEC44HJ

"Richland" (2013)

Fabrication 32 nm on GlobalFoundries SOI process
Socket FS1r2, FP2
Elite Performance APU.^[65]^[66]
CPU: Piledriver architecture
GPU: TeraScale 3 (VLIW4)
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core

Model number	Stepping	CPU				GPU				Memory support	TDP	Socket	Released	Part number
Model number	Stepping	Modules (cores)	Clock	Turbo	L2 cache	Model	Config	Clock	Turbo	Memory support	TDP	Socket	Released	Part number
A4-5145M	RL-A1	1(2)	2.0 GHz	2.6 GHz	1 MB	HD 8310G	128	424 MHz	554 MHz	DDR3L-1333	17 W	FP2	May 2013	AM5145SIE44HL
A6-5345M		1(2)	2.2 GHz	2.8 GHz	1 MB	HD 8410G	192	450 MHz	600 MHz		17 W			AM5345SIE44HL
A8-5545M		2(4)	1.7 GHz	2.7 GHz	4 MB	HD 8510G	384	450 MHz	554 MHz		19 W			AM5545SIE44HL
A10-5745M		2(4)	2.1 GHz	2.9 GHz	4 MB	HD 8610G	384	533 MHz	626 MHz		25 W			AM5745SIE44HL

A4-5150M		1(2)	2.7 GHz	3.3 GHz	1 MB	HD 8350G	128:8:4	533 MHz	720 MHz	DDR3-1600	35 W	FS1	Q1 2013	AM5150DEC23HL
A6-5350M			2.9 GHz	3.5 GHz		HD 8450G	192:12:4	533 MHz		DDR3-1600			Q1 2013	AM5350DEC23HL
A6-5357M			2.9 GHz	3.5 GHz		HD 8450G	192:12:4	533 MHz		DDR3L-1600			May 2013	AM5357DFE23HL
A8-5550M		2(4)	2.1 GHz	3.1 GHz	4 MB	HD 8550G	256:16:8	515 MHz		DDR3-1600			Q1 2013	AM5550DEC44HL
A8-5557M			2.1 GHz	3.1 GHz		HD 8550G	256:16:8	554 MHz		DDR3L-1600			May 2013	AM5557DFE44HL
A10-5750M			2.5 GHz	3.5 GHz		HD 8650G	384:24:8	533 MHz		DDR3-1866			Q1 2013	AM5750DEC44HL
A10-5757M			2.5 GHz	3.5 GHz		HD 8650G	384:24:8	600 MHz		DDR3L-1600			May 2013	AM5757DFE44HL

"Kaveri" (2014)

Fabrication 28 nm
Socket FP3
Up to 4 "Steamroller" x86 CPU cores with 4 MB of L2 cache.^[67]
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
Three to eight Compute Units (CUs) based on Graphics Core Next (GCN)^[36] microarchitecture; 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs)
AMD Heterogeneous System Architecture (HSA) 2.0
SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio^[37]
Dual-channel (2x64-bit) DDR3 memory controller
Integrated custom ARM Cortex-A5 co-processor^[38] with TrustZone Security Extensions^[39]

Model number	CPU				GPU					Memory support	TDP	Released	Part number
Model number	Modules (Cores)	Clock	Turbo	L2 cache	Model	Cores	Config	Clock	Turbo	Memory support	TDP	Released	Part number
A6-7000	1 (2)	2.2 GHz	3.0 GHz	1 MB	R4	3	192:12:3	494 MHz	533 MHz	DDR3-1333	17W	June 2014	AM7000ECH23JA
A6 Pro-7050B	1 (2)	2.2 GHz	3.0 GHz	1 MB	R4	3	192:12:3	533 MHz	N/A	DDR3-1600	17W	June 2014	AM705BECH23JA

A8-7100	2 (4)	1.8 GHz	3.0 GHz	2× 2 MB	R5	4	256:16:4	450 MHz	514 MHz	DDR3-1600	20W	June 2014	AM7100ECH44JA
A8 Pro-7150B		1.9 GHz	3.2 GHz		R5	4	256:16:4	553 MHz	N/A				AM715BECH44JA
A10-7300		1.9 GHz	3.2 GHz		R6	6	384:24:8	464 MHz	533 MHz				AM7300ECH44JA
A10 Pro-7350B		2.1 GHz	3.3 GHz		R6			553 MHz	N/A				AM735BECH44JA
FX-7500		2.1 GHz	3.3 GHz		R7			498 MHz	553 MHz				FM7500ECH44JA

A8-7200P	2 (4)	2.4 GHz	3.3 GHz	2× 2 MB	R5	4	256:16:4	553 MHz	626 MHz	DDR3-1866	35W	June 2014	AM740PDGH44JA
A10-7400P		2.5 GHz	3.4 GHz		R6	6	384:24:8	576 MHz	654 MHz	DDR3-1866			AM740PDGH44JA
FX-7600P		2.7 GHz	3.6 GHz		R7	8	512:32:8	600 MHz	686 MHz	DDR3-2133			FM760PDGH44JA

"Carrizo" (2015)

Fabrication 28 nm
Socket FP4
Up to 4 "Excavator" x86 CPU cores
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand, Turbo Core
GPU based on Graphics Core Next 1.2

Model number	CPU				GPU					Memory support	TDP	Released	Part number
Model number	Modules (cores)	Clock	Turbo	L2 cache	Model	Cores	Config	Clock	Turbo	Memory support	TDP	Released	Part number
A6-8500P	1(2)	1.6 GHz	3.0 GHz	1 MB	R5	4	256:16:4	800 MHz	N/A	DDR3-1600	12-35W	June 2015	AM850PAAY23KA
Pro A6-8500B		1.6 GHz	3.0 GHz							DDR3-1600		June 2015	AM850BAAY23KA
Pro A6-8530B		2.3 GHz	3.2 GHz							DDR4-1866		Q3 2016	AM853BADY23AB

A8-8600P	2(4)	1.6 GHz	3.0 GHz	2× 1 MB	R6	6	384:24:8	720 MHz		DDR3-2133		June 2015	AM860PAAY43KA
Pro A8-8600B		1.6 GHz	3.0 GHz					720 MHz					AM860BAAY43KA
A10-8700P		1.8 GHz	3.2 GHz					800 MHz					AM870PAAY43KA
Pro A10-8700B		1.8 GHz	3.2 GHz					800 MHz					AM870BAAY43KA
Pro A10-8730B		2.4 GHz	3.3 GHz		R5			720 MHz		DDR4-1866		Q3 2016	AM873BADY44AB
A10-8780P		2.0 GHz	3.3 GHz		R8	8	512:32:8			DDR3		December 2015	AM878PAIY43KA
FX-8800P		2.1 GHz	3.4 GHz		R7			800 MHz		DDR3-2133		June 2015	FM880PAAY43KA
Pro A12-8800B		2.1 GHz	3.4 GHz					800 MHz		DDR3-2133		June 2015	FM880BAAY43KA
Pro A12-8830B		2.5 GHz	3.4 GHz			6	384:24:8	758 MHz		DDR4-1866		Q3 2016	AM883BADY44AB

"Bristol Ridge" (2016)

Fabrication 28 nm
Socket FP4^[68]
4 "Excavator v2" x86 CPU cores
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand, Turbo Core
GPU based on Graphics Core Next 1.2 with VP9 decoding

Model number	CPU				GPU					Memory support	TDP	Released	Part number
Model number	Modules (cores)	Clock	Turbo	L2 cache	Model	Cores	Config	Clock	Turbo	Memory support	TDP	Released	Part number
Pro A6-9500B	1(2)	2.3 GHz	3.2 GHz	1 MB	R5	4	256:16:4	800 MHz	N/A	DDR4-1866	12–15W	October 24, 2016

Pro A8-9600B	2(4)	2.4 GHz	3.3 GHz	2× 1 MB	R5	6	384:24:6	720 MHz	N/A	DDR4-1866	12–15W	October 24, 2016
A10-9600P		2.4 GHz	3.3 GHz					720 MHz				June 2016	AM960PADY44AB
A10-9620P^[69]		2.5 GHz	3.4 GHz					758 MHz				2017 (OEM)
Pro A10-9700B					R7							October 24, 2016
A12-9700P					R7							June 2016	AM970PADY44AB
Pro A8-9630B		2.6 GHz	3.3 GHz		R5			800 MHz		DDR4-2400	25–45W	October 24, 2016
A10-9630P		2.6 GHz	3.3 GHz		R5			800 MHz				June 2016	AM963PAEY44AB
Pro A10-9730B		2.8 GHz	3.5 GHz		R7			900 MHz				October 24, 2016
A12-9730P		2.8 GHz	3.5 GHz		R7			900 MHz				June 2016	AM973PAEY44AB

Pro A12-9800B		2.7 GHz	3.6 GHz		R7	8	512:32:8	758 MHz		DDR4-1866	12–15W	October 24, 2016
FX-9800P A12-9720P^[70]^[71]		2.7 GHz	3.6 GHz					758 MHz		DDR4-1866	12–15W	June 2016 2017 (OEM)	FM980PADY44AB ?
Pro A12-9830B		3.0 GHz	3.7 GHz					900 MHz		DDR4-2400	25–45W	October 24, 2016
FX-9830P		3.0 GHz	3.7 GHz					900 MHz		DDR4-2400	25–45W	June 2016	FM983PAEY44AB

"Raven Ridge" (2017)

Fabrication 14 nm by GlobalFoundries
Transistors: 4.95 billion
Socket AM4
Die size: 210 mm²
Zen CPU cores
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RdRand, Turbo Core
Fifth generation GCN based GPU

Model	CPU						GPU				Memory support	TDP	Release date
	Cores (threads)	Clock rate (GHz)			Cache^{[lower-alpha 1]}		Model	Config^{[lower-alpha 2]} (cores)	Clock	Processing power (GFLOPS)^{[lower-alpha 3]}
	Cores (threads)	Base	Boost	XFR	L2	L3	Model	Config^{[lower-alpha 2]} (cores)	Clock	Processing power (GFLOPS)^{[lower-alpha 3]}
Ryzen 3 2200U^[72]	2 (4)	2.5	3.4	Unknown	1 MB	4 MB	Vega 3	192:12:4 (3)^[73]	1100 MHz	422.4	DDR4-2400 (dual channel)	12–25 W (configurable)	8 January, 2018
Ryzen 3 2300U^[74]		2.0			2 MB		Vega 6	384:24:8 (6)^[75]		844.8			8 January, 2018
Ryzen 3 Pro 2300U^[76]							Vega 6	384:24:8 (6)^[75]		844.8			15 May, 2018 ^[77]
Ryzen 5 2500U^[78]	4 (8)		3.6				Vega 8	512:32:16 (8)^[79]		1126.4			26 October, 2017^[78]
Ryzen 5 Pro 2500U^[80]			3.6				Vega 8	512:32:16 (8)^[79]		1126.4			15 May, 2018 ^[77]
Ryzen 7 2700U^[81]		2.2	3.8				Vega 10	640:40:16 (10)^[82]	1300 MHz	1664			26 October, 2017^[81]
Ryzen 7 Pro 2700U^[83]		2.2	3.8				Vega 10	640:40:16 (10)^[82]	1300 MHz	1664			15 May, 2018 ^[77]
Ryzen 5 2600H^[84]	4 (8)	3.2	3.6		2 MB	4 MB	Vega 8	512:32:16 (8)	1100 MHz	1126.4	DDR4-3200 (dual channel)	35–54 W (configurable)	10 September, 2018^[85]
Ryzen 7 2800H^[84]	4 (8)	3.3	3.8		2 MB	4 MB	Vega 11	704:44:16 (11)	1300 MHz	1830.4	DDR4-3200 (dual channel)	35–54 W (configurable)	10 September, 2018^[85]

↑ AMD defines 1 kilobyte (KB) as 1024 bytes, and 1 megabyte (MB) as 1024 kilobytes.^[45]
↑ Unified Shaders : Texture Mapping Units : Render Output Units
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Ultra-mobile APUs

Brazos: "Desna", "Ontario", "Zacate" (2011)

Fabrication 40 nm by TSMC
Socket FT1 (BGA-413)
Based on the Bobcat microarchitecture^[86]
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
PowerNow!
DirectX 11 integrated graphics with UVD 3.0
Z-series denote Desna; C-series denote Ontario; and the E-series denotes Zacate
2.50 GT/s UMI (PCIe 1.0 ×4)

Model	Stepping	CPU				GPU				Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	Turbo	L2 cache	Model	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
Z-01	B0	2	1.0 GHz	N/A	2 × 512 kB	HD 6250	80:8:4	276 MHz	N/A	DDR3-1066	5.9 W	Jun 1, 2011	XMZ01AFVB22GV

C-30	B0	1	1.2 GHz	N/A	512 kB	HD 6250			N/A		9 W	Jan 4, 2011	CMC30AFPB12GT
C-50	B0	2	1.0 GHz	N/A	2 × 512 kB	HD 6250			N/A			Jan 4, 2011	CMC50AFPB22GT
C-60	C0	2	1.0 GHz	1.33 GHz	2 × 512 kB	HD 6290			400 MHz			Aug 22, 2011	CMC60AFPB22GV

E-240	B0	1	1.5 GHz	N/A	512 kB	HD 6310		500 MHz	N/A	DDR3-1066	18 W	Jan 4, 2011	EME240GBB12GT
E-300	B0?	2	1.3 GHz		2 × 512 kB			488 MHz				Aug 22, 2011	EME300GBB22GV
E-350	B0		1.6 GHz					492 MHz				Jan 4, 2011	EME350GBB22GT
E-450	B0 C0		1.65 GHz			HD 6320		508 MHz	600 MHz	DDR3-1333		Aug 22, 2011	EME450GBB22GV

Brazos 2.0: "Ontario", "Zacate" (2012)

Fabrication 40 nm by TSMC
Socket FT1 (BGA-413)
Based on the Bobcat microarchitecture^[86]
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
PowerNow!
DirectX 11 integrated graphics
C-series denote Ontario; and the E-series denotes Zacate
2.50 GT/s UMI (PCIe 1.0 ×4)

Model	Stepping	CPU				GPU				Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	Turbo	L2 cache	Model	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
C-70	C0	2	1.00 GHz	1.33 GHz	2 × 512 kB	HD 7290	80:8:4	276 MHz	400 MHz	DDR3-1066	9 W	Sep 15, 2012	CMC70AFPB22GV

E1-1200	B0?		1.40 GHz	N/A	2 × 512 kB	HD 7310		500 MHz	N/A	DDR3-1066	18 W	Jun 6, 2012	EM1200GBB22GV
E1-1500	?		1.48 GHz			HD 7310		529 MHz	N/A	DDR3-1066		Jan 7, 2013
E2-1800	B0?		1.70 GHz			HD 7340		523 MHz	680 MHz	DDR3-1333		Jun 6, 2012	EM1800GBB22GV
E2-2000	?		1.75 GHz			HD 7340		538 MHz	700 MHz	DDR3-1333		Jan 7, 2013

Brazos-T: "Hondo" (2012)

Fabrication 40 nm by TSMC
Socket FT1 (BGA-413)
Based on the Bobcat microarchitecture^[86]
Found in tablet computers
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
PowerNow!
DirectX 11 integrated graphics
2.50 GT/s UMI (PCIe 1.0 ×4)

Model	Stepping	CPU				GPU				Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	Turbo	L2 cache	Model	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
Z-60		2	1.0 GHz	N/A	2× 512 kB	HD 6250	80:8:4	276 MHz	N/A	DDR3-1066	4.5 W	Oct 9, 2012	XMZ60AFVB22GV

"Kabini", "Temash" (2013)

Fabrication 28 nm by TSMC
Socket FT3 (BGA)
2 to 4 CPU Cores (Jaguar (microarchitecture))
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
Turbo Dock Technology, C6 and CC6 low power states
GPU based on Graphics Core Next (GCN)
AMD Eyefinity multi-monitor for up to two displays

Temash, Elite Mobility APU

Model	Stepping	CPU				GPU				Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	Turbo	L2 cache	Model	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
A4-1200	B0	2	1.0 GHz	N/A	1 MB	HD 8180	128:8:4	225 MHz	N/A	DDR3L-1066	4 W		AT1200IFJ23HM
A4-1250	B0	2			1 MB	HD 8210	128:8:4	300 MHz		DDR3L-1333	8 W		AT1250IDJ23HM
A4-1350		4			2 MB	HD 8210				DDR3L-1066			AT1350IDJ44HM
A6-1450		4		1.4 GHz	2 MB	HD 8250			400 MHz	DDR3L-1066		May 2013	AT1450IDJ44HM

Kabini, Mainstream APU

Model	Stepping	CPU			GPU			Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	L2 cache	Model	Config²	Clock	Memory support	TDP	Released	Part number
E1-2100	B0	2	1.00 GHz	1 MB	HD 8210	128:8:4	300 MHz	DDR3L-1333	09 W	May 2013	EM2100ICJ23HM
E1-2200			1.05 GHz		HD 8210		300 MHz		09 W	Feb 2014	EM2200ICJ23HM
E1-2500			1.40 GHz		HD 8240		400 MHz		15 W	May 2013	EM2500IBJ23HM
E2-3000			1.65 GHz		HD 8280		450 MHz	DDR3L-1600		May 2013	EM3000IBJ23HM
E2-3800		4	1.30 GHz	2 MB	HD 8280		450 MHz			Feb 2014	EM3800IBJ44HM
A4-5000			1.50 GHz		HD 8330		497 MHz			May 2013	AM5000IBJ44HM
A4-5100			1.55 GHz		HD 8330		497 MHz			Feb 2014	AM5100IBJ44HM
A6-5200			2.00 GHz		HD 8400		600 MHz		25 W	May 2013	AM5200IAJ44HM
A4 Pro-3340B			2.20 GHz		HD 8240		400 MHz		25 W	Nov 2014	AM334BIAJ44HM

"Beema", "Mullins" (2014)

Fabrication 28 nm by GlobalFoundries
Socket FT3b (BGA)
CPU: 2 to 4 (Puma cores)
GPU based on Graphics Core Next (GCN)
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
Intelligent Turbo Boost
Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution

Mullins, Tablet/2-in-1 APU

Model	Stepping	CPU				GPU					Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	Turbo	L2 cache	Model	Cores	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
E1 Micro-6200T		2	1.0 GHz	1.4 GHz	1 MB	R2	2	128:8:4		300 MHz	DDR3L-1066	3.95 W	Q2 2014	EM620TIWJ23JB
A4 Micro-6400T		4	1.0 GHz	1.6 GHz	2 MB	R3				350 MHz	DDR3L-1333	4.5 W		AM640TIVJ44JB
A10 Micro-6700T		4	1.2 GHz	2.2 GHz	2 MB	R6				500 MHz	DDR3L-1333	4.5 W		AM670TIVJ44JB

Beema, Notebook APU

Model	Stepping	CPU				GPU					Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	Turbo	L2 cache	Model	Cores	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
E1-6010		2	1.35 GHz	N/A	1 MB	R2	2	128:8:4		350 MHz	DDR3L-1333	10 W	Q2 2014	EM6010IUJ23JB
E1-6015^[87]		2	1.40 GHz		1 MB					350 MHz	DDR3L-1333	10 W	Q2 2015
E2-6110	ML-A1	4	1.50 GHz		2 MB					500 MHz	DDR3L-1600	15 W	Q2 2014	EM6110ITJ44JB
A4-6210	ML-A1		1.80 GHz			R3				600 MHz		15 W	Q2 2014	AM6210ITJ44JB
A4-6250J^[88]			2.00 GHz			R3			267 MHz	600 MHz		25 W
A6-6310	ML-A1		1.80 GHz	2.4 GHz		R4				800 MHz	DDR3L-1866	15 W	Q2 2014	AM6310ITJ44JB
A8-6410	ML-A1		2.00 GHz			R5			300 MHz	847 MHz	DDR3L-1866		Q2 2014	AM6410ITJ44JB
A4 Pro-3350B			2.00 GHz			R4				800 MHz	DDR3-1600		May 2016	AM335BITJ44JB

"Carrizo-L" (2015)

Fabrication 28 nm by GlobalFoundries
Socket FT3b (BGA), FP4 (µBGA)^[89]
CPU: 2 to 4 (Puma+ cores)
GPU based on Graphics Core Next (GCN)
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
Intelligent Turbo Boost
Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution
All models except A8-7410 available in both laptop and all-in-one desktop versions

Model	Stepping	CPU				GPU					Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	Turbo	L2 cache	Model	Cores	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
E1-7010		2	1.5 GHz	N/A	1 MB	R2	2	128:8:4		400 MHz	DDR3L-1333	10 W	May 2015	EM7010IUJ23JB EM7010JCY23JB EM7010JCY23JBD
E2-7110		4	1.8 GHz	N/A	2 MB	R2				600 MHz	DDR3L-1600	12–25 W		EM7110ITJ44JB EM7110JBY44JB EM7110JBY44JBD
A4-7210			1.8 GHz	2.2 GHz		R3				686 MHz	DDR3L-1600			AM7210ITJ44JB AM7210JBY44JBD
A6-7310			2.0 GHz	2.4 GHz		R4				800 MHz	DDR3L-1866			AM7310ITJ44JB AM7310JBY44JB AM7310JBY44JBD
A8-7410			2.2 GHz	2.5 GHz		R5				847 MHz	DDR3L-1866			AM7410JBY44JB

"Stoney Ridge" (2016)

Fabrication 28 nm by GlobalFoundries
Socket FP4^[68]
2 "Excavator v2" x86 CPU cores
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand, Turbo Core
GPU based on Graphics Core Next 3rd Generation with VP9 decoding

Model number	CPU				GPU					Memory support	TDP	Released	Part number
Model number	Modules (cores)	Clock	Turbo	L2 cache	Model	Cores	Config	Clock	Turbo	Memory support	TDP	Released	Part number
E2-9000e	1 (2)	1.5 GHz	2.0 GHz	1 MB	R2	2	128:8:4	? MHz	N/A	DDR4-1866	6 W	November 2016	EM900EANN23AC
E2-9000		1.8 GHz	2.2 GHz					? MHz			10 W	June 2016	EM9000AKN23AC
E2-9010		2.0 GHz	2.2 GHz					600 MHz			10–15 W	June 2016	EM9010AVY23AC
A4-9120		2.2 GHz	2.5 GHz		R3			655 MHz		DDR4-2133	10–15 W	Q2 2017	AM9120AYN23AC
A4-9125		2.3 GHz	2.6 GHz		R3			686 MHz			10–15 W	Q2 2018	AM9125AYN23AC
A6-9200e		1.8 GHz	2.7 GHz		R4	3	192:12:8	? MHz			6 W	November 2016	AM920EANN23AC
A6-9200		2.0 GHz	2.8 GHz					? MHz			10 W	November 2016	AM9200AKN23AC
A6-9210		2.4 GHz	2.8 GHz					600 MHz			10–15 W	June 2016	AM9210AVY23AC
A6-9220		2.5 GHz	2.9 GHz					655 MHz			10–15 W	Q2 2017	AM9220AYN23AC
A6-9225		2.6 GHz	3.0 GHz					686 MHz			10–15 W	Q2 2018	AM9225AYN23AC
A9-9400		2.4 GHz	3.2 GHz		R5			800 MHz			10 W	November 2016	AM9400AKN23AC
A9-9410		2.9 GHz	3.5 GHz					800 MHz			10–25 W	June 2016	AM9410AFY23AC
A9-9420		3.0 GHz	3.6 GHz					847 MHz			10–15 W	Q2 2017	AM9420AYN23AC
A9-9425		3.1 GHz	3.7 GHz					900 MHz				Q2 2018	AM9425AYN23AC
A9-9430^[90]		3.2 GHz	3.5 GHz					? MHz

Pro A4-4350B	1 (2)	2.5 GHz	2.9 GHz	1 MB	R5	3	192:12:8	655 MHz	N/A	DDR4-2133	15 W	Q1 2018
Pro A6-7350B	1 (2)	3.0 GHz	3.6 GHz	1 MB	R5	3	192:12:8	847 MHz	N/A	DDR4-2133	15 W	Q1 2018

Embedded APUs

G-Series

Brazos: "Ontario" and "Zacate" (2011)

Fabrication 40 nm
Socket FT1 (BGA-413)
CPU microarchitecture: Bobcat^[91]
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
GPU microarchitecture: TeraScale 2 (VLIW5) "Evergreen"
Memory support: single-channel, support up to two DIMMs of DDR3-1333 or DDR3L-1066
5 GT/s UMI

Model	Stepping	CPU			GPU			Memory support	TDP	Released	Part number
Model	Stepping	Cores	Clock	L2 cache	Model	Config²	Clock	Memory support	TDP	Released	Part number
G-Series T24L	B0	1	800 MHz 1.0 GHz	512 kB	N/A			DDR3-1066	5 W	Mar 1, 2011 May 23, 2011	GET24LFPB12GTE GET24LFQB12GVE
G-Series T30L		1	1.4 GHz	512 kB					18 W	Mar 1, 2011 May 23, 2011	GET30LGBB12GTE GET30LGBB12GVE
G-Series T48L		2	1.4 GHz	2 × 512 kB					18 W	Mar 1, 2011 May 23, 2011	GET48LGBB22GTE GET48LGBB22GVE

G-Series T16R		1	615 MHz	512 kB	HD 6250	80:8:4	276 MHz	DDR3L-1066	4.5 W	Jun 25, 2012	GET16RFWB12GVE
G-Series T40R		1	1.0 GHz	512 kB			280 MHz	DDR3-1066	5.5 W	May 23, 2011	GET40RFQB12GVE
G-Series T40E		2		2 × 512 kB			280 MHz	DDR3-1066	6.4 W	May 23, 2011	GET40EFQB22GVE
G-Series T40N³	B0	2		2 × 512 kB	HD 6250 HD 6290		280 MHz 280 MHz³	DDR3-1066	9 W	Jan 19, 2011 May 23, 2011	GET40NFPB22GTE GET40NFPB22GVE
G-Series T40R		1		512 kB	HD 6250		280 MHz		5.5 W	May 23, 2011	GET40RFSB12GVE
G-Series T44R		1	1.2 GHz	512 kB					9 W	Jan 19, 2011 May 23, 2011	GET44RFPB12GTE GET44RFPB12GVE
G-Series T48E		2	1.4 GHz	2 × 512 kB				DDR3-1066	18 W	Jun 25, 2012	GET48EGBB22GVE
G-Series T48N		2	1.4 GHz	2 × 512 kB	HD 6310		500 MHz 520 MHz	DDR3-1066		Jan 19, 2011 May 23, 2011	GET48NGBB22GTE GET48NGBB22GVE
G-Series T52R		1	1.5 GHz	512 kB	HD 6310		500 MHz	DDR3-1066 DDR3-1333		Jan 19, 2011 May 23, 2011	GET52RGBB12GTE GET52RGBB12GVE
G-Series T56E		2	1.65 GHz	2 × 512 kB	HD 6250		275 MHz	DDR3-1333		Jun 25, 2012	GET56EGBB22GVE
G-Series T56N³		2	1.6 GHz 1.65 GHz	2 × 512 kB	HD 6310 HD 6320		500 MHz 500 MHz³	DDR3-1066 DDR3-1333		Jan 19, 2011 May 23, 2011	GET56NGBB22GTE GET56NGBB22GVE

"Kabini" (2013, SoC)

Fabrication 28 nm
Socket FT3 (769-BGA)^[92]
CPU microarchitecture: Jaguar
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support. No support for FMA (Fused Multiply-Accumulate).
GPU microarchitecture: Graphics Core Next (GCN)
hardware acceleration for video decode through Unified Video Decoder 3 (H.264, VC-1, MPEG2, etc.) and new video encode capability not available in previous AMD Embedded G-Series APU
Single channel DDR3-1600, 1.25 and 1.35 V voltage levels support, support for ECC memory
integrates Controller Hub functional block as well
G-Series 2.0
Trusted Platform Module (TPM) 1.2 support
integrates HD audio and 2 SATA channels
integrates USB 2.0 and USB 3.0 (GX-210JA no USB 3.0)^[93]

Model	Stepping	CPU				GPU				Memory support	TDP	Released	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache (shared)	Model	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
GX-210JA	B0	2	1.0 GHz	N/A	1 MB	HD 8180	128:8:4	225 MHz	N/A	DDR3-1066	06 W	Jul 30, 2013	GE210JIHJ23HM
GX-210HA			1.0 GHz			HD 8210E		300 MHz		DDR3-1333	09 W	Jun 1, 2013	GE210HICJ23HM
GX-217GA			1.65 GHz			HD 8280E		450 MHz		DDR3-1600	15 W		GE217GIBJ23HM
GX-415GA		4	1.5 GHz		2 MB	HD 8330E		500 MHz					GE415GIBJ44HM
GX-416RA			1.6 GHz			N/A							GE416RIBJ44HM
GX-420CA			2.0 GHz			HD 8400E	128:8:4	600 MHz	N/A		25 W		GE420CIAJ44HM

"Steppe Eagle" (2014, SoC)

Fabrication 28 nm
Socket FT3b (769-BGA)
CPU microarchitecture: Puma
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support

Model	Stepping	CPU				GPU				Memory support	TDP	Released	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache (shared)	Model	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
GX-210JC		2	1.0 GHz	N/A	1 MB		128:8:4	267 MHz	N/A	DDR3-1600	06 W	June 4, 2014	GE210JIZJ23JB
GX-212JC			1.2 GHz					300 MHz		DDR3-1333	06 W		GE212JIYJ23JB
GX-216HC			1.6 GHz					300 MHz		DDR3-1066	10 W		GE216HHBJ23JB
GX-222GC			2.2 GHz					655 MHz		DDR3-1600	15 W		GE222GITJ23JB
GX-412HC		4	1.2 GHz		2 MB			300 MHz		DDR3-1333	7 W		GE412HIYJ44JB
GX-424CC	ML-A1	4	2.4 GHz		2 MB			497 MHz		DDR3-1866	25 W		GE424CIXJ44JB

"Crowned Eagle" (2014, SoC)

Fabrication 28 nm
Socket FT3b (769-BGA)
CPU microarchitecture: Puma
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
no GPU

Model	Stepping	CPU				GPU				Memory support	TDP	Released	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache (shared)	Model	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
GX-224PC		2	2.4 GHz	N/A	1 MB	N/A				DDR3-1866	025 W	June 4, 2014	GE224PIXJ23JB
GX-410VC		4	1.0 GHz		2 MB					DDR3-1066	7 W		GE410VIZJ44JB
GX-412TC			1.2 GHz							DDR3-1600	6 W		GE412TIYJ44JB
GX-420MC			2.0 GHz							DDR3-1600	17.5 W		GE420MIXJ44JB

I-Family: "Brown Falcon" (2016, SoC)

Fabrication 28 nm
Socket FP4^[94]
2 or 4 "Excavator" x86 cores with 1MB shared L2 cache
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand
GPU microarchitecture: Graphics Core Next (GCN) (up to 4 CUs) with support for DirectX 12
Dual channel 64-bit DDR4 or DDR3 memory with ECC
4K × 2K H.265 decode capability and multi format encode and decode
Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

Model	Stepping	CPU				GPU				Memory support	TDP	Released	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache (shared)	Model	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
GX-217GI		1 (2)	1.7 GHz	2.0 GHz	1 MB	R6E	256:16:4	758 MHz	N/A	DDR3/DDR4-1600	015 W	Feb 23, 2016	GE217GAAY23KA
GX-420GI^[95]^[96]		2 (4)	2.0 GHz	2.2 GHz	2 MB	R6E R7E	256:16:4 384:24:4	758 MHz 626 MHz	N/A	DDR4-1866	016.1 W	2016	GE420GAAY43KA

J-Family: "Prairie Falcon" (2016, SoC)

Fabrication 28 nm
Socket FP4^[97]
2 "Excavator" x86 cores with 1MB shared L2 cache
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand
GPU microarchitecture: Radeon R5E Graphics Core Next (GCN) (up to 3 CUs) with support for DirectX 12
Single channel 64-bit DDR4 or DDR3 memory
4K × 2K H.265 decode capability with 10-bit compatibility and multi format encode and decode
Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

Model	Stepping	CPU				GPU				Memory support	TDP	Released	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache (shared)	Model	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
GX-212JJ		1 (2)	1.2 GHz	1.6 GHz	1 MB	R1E	64:4:1	600 MHz	N/A	DDR3-1333 DDR4-1600	6–10 W	2018	GE212JAWY23AC
GX-215JJ			1.5 GHz	2.0 GHz		R2E	128:8:2	600 MHz		DDR3-1600 DDR4-1866	6–10 W	2017	GE215JAWY23AC
GX-220IJ			2.0 GHz	2.2 GHz		R2E	128:8:2	600 MHz		DDR3-1600 DDR4-1866	10–15 W	2018	GE220IAVY23AC
GX-224IJ			2.4 GHz	2.8 GHz		R4E	192:12:3	600 MHz		DDR3-1866 DDR4-2133	10–15 W	2017	GE224IAVY23AC

LX-Family (2016, SoC)

Fabrication 28 nm
Socket FT3b (769-BGA)
2 “Puma” x86 cores with 1MB shared L2 cache
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
GPU microarchitecture: Graphics Core Next (GCN) (1CU) with support for DirectX 11.2
Single channel 64-bit DDR3 memory with ECC
Integrated Controller Hub supports: PCIe® 2.0 4×1, 2 USB3 + 4 USB2 ports, 2 SATA 2.0/3.0 ports

Model	Stepping	CPU				GPU					Memory support	TDP	Released	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache (shared)	Model	Cores	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
GX-208JL		2	800 MHz	N/A	1 MB	R1E	1	64:4:1	267 MHz	N/A	DDR3-1333	< 6 W	Feb 23, 2016	GE208JIVJ23JB
GX-210HL			1.0 GHz								DDR3-1066	7 W	2017	GE208HIZJ23JB
GX-210JL											DDR3-1333	6 W	Feb 23, 2016	GE210JIVJ23JB
GX-210KL											DDR3-1333	4.5 W	2017	GE210KIVJ23JB
GX-215GL			1.5 GHz						497 MHz		DDR3-1600	15 W	Feb 23, 2016	GE215GITJ23JB
GX-218GL			1.8 GHz						497 MHz		DDR3-1600	15 W	Feb 23, 2016	GE218GITJ23JB

R-Series

Comal: "Trinity" (2012)

Fabrication 32 nm
Socket FP2 (BGA-827), FS1r2
CPU microarchitecture: Piledriver
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C^[24], ABM, BMI1, TBM
GPU microarchitecture: TeraScale 3 (VLIW4) "Northern Islands"
Memory support: dual-channel 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3
2.5 GT/s UMI
Die size: 246 mm²; Transistors: 1.303 billion
OpenCL 1.1 and OpenGL 4.2 support

Model	Stepping	CPU				GPU				Memory support	TDP	Released	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache	Model	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
R-252F	B0	1(2)	1.9 GHz	2.4 GHz	1 MB	HD 7400G	192:12:4	333 MHz	417 MHz	DDR3-1333	17 W	May 21, 2012	RE252FSHE23HJE
R-260H			2.1 GHz	2.6 GHz	2? MB	HD 7500G	256:16:8	327 MHz	424 MHz	DDR3-1333	17 W		RE260HSHE24HJE
R-268D			2.5 GHz	3.0 GHz	1 MB	HD 7420G	192:12:4	470 MHz	640 MHz	DDR3-1600	35 W		RE268DDEC23HJE
R-272F			2.7 GHz	3.2 GHz	1 MB	HD 7520G	192:12:4	497 MHz	686 MHz		35 W		RE272FDEC23HJE
R-452L		2(4)	1.6 GHz	2.4 GHz	2 × 2 MB	HD 7600G	256:16:8	327 MHz	424 MHz		19 W		RE452LSHE44HJE
R-460H			1.9 GHz	2.8 GHz		HD 7640G	256:16:8	497 MHz	655 MHz		35 W		RE460HDEC44HJE
R-460L			2.0 GHz	2.8 GHz		HD 7620G	384:24:8	360 MHz	497 MHz	DDR3-1333	25 W		RE460LSIE44HJE
R-464L			2.3 GHz	3.2 GHz		HD 7660G	384:24:8	497 MHz	686 MHz	DDR3-1600	35 W		RE464LDEC44HJE

"Bald Eagle" (2014)

Fabrication 28 nm
Up to 4 "Steamroller" x86 cores^[98]
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C^[24], ABM, BMI1, TBM
GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 11.1 and OpenGL 4.2
Dual channel DDR3 memory with ECC
Unified Video Decode (UVD) 4.2 and Video Coding Engine (VCE) 2.0

Model	Stepping	CPU				GPU					Memory support	TDP	Released	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache (shared)	Model	Cores	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
RX-219NB		1(2)	2.2 GHz	3.0 GHz	1 MB	N/A					DDR3-1600	15-17 W	May 20, 2014	RE219NECH23JA
RX-225FB		1(2)	2.2 GHz	3.0 GHz	1 MB	R4	3	192:12:4	464 MHz	533 MHz	DDR3-1600	15-17 W		RE225FECH23JA
RX-425BB		2(4)	2.5 GHz	3.4 GHz	4 MB	R6	6	384:24:8	576 MHz	654 MHz	DDR3-1866	30-35 W		RE425BDGH44JA
RX-427BB			2.7 GHz	3.6 GHz		R7	8	512:32:8	600 MHz	686 MHz	DDR3-2133	30-35 W		RE427BDGH44JA
RX-427NB			2.7 GHz	3.6 GHz		N/A					DDR3-2133	30-35 W		RE427NDGH44JA

"Merlin Falcon" (2015, SoC)

Fabrication 28 nm
Up to 4 "Excavator" x86 cores^[99]
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand
GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 12
Dual channel 64-bit DDR4 or DDR3 memory with ECC
Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode) and Video Coding Engine (VCE) 3.1 (4K H.264 encode)
Dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot (HVB)
Integrated FCH featuring PCIe 3.0 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, UART

Model	Stepping	CPU				GPU					Memory support	TDP	Released	Part number
Model	Stepping	Modules (cores)	Clock	Turbo	L2 cache (shared)	Model	Cores	Config²	Clock	Turbo	Memory support	TDP	Released	Part number
RX-216GD		1(2)	1.6 GHz	3.0 GHz	1 MB	R5	4		800 MHz	N/A	DDR3/DDR4-1600	12-15 W	October 21, 2015	RE216GAAY23KA
RX-216TD		1(2)	1.6 GHz	3.0 GHz	1 MB	N/A						12-15 W	October 21, 2015	RE216TAAY23KA
RX-416GD		2(4)	1.6 GHz	2.4 GHz	2 MB	R6	6		720 MHz	N/A		15 W		RE416GATY43KA
RX-418GD			1.8 GHz	3.2 GHz		R6	6		800 MHz		DDR3-2133 DDR4-2400	12-35 W	October 21, 2015	RE418GAAY43KA
RX-421BD			2.1 GHz	3.4 GHz		R7	8		800 MHz					RE421BAAY43KA
RX-421ND			2.1 GHz	3.4 GHz		N/A								RE421NAAY43KA

Custom APUs

As of May 1, 2013, AMD opened the doors of their "semi-custom" business unit.^[100] Since these chips are custom-made for specific customer needs, they vary widely from both consumer-grade APUs and even the other custom-built ones. Some notable examples of semi-custom chips that have come from this sector include the chips from the PlayStation 4 and Xbox One.^[101] So far the size of the integrated GPU in these semi-custom APUs exceed by far the GPU size in the consumer-grade APUs.

Chip (device)	Launch	Fab (nm)	CPU				GPU						Memory			API support	Special features
Chip (device)	Launch	Fab (nm)	Archi- tecture	Cores	Clock (GHz)	L2 cache	Archi- tecture	Core config^{[lower-alpha 1]}	Clock (MHz)	GFLOPS^{[lower-alpha 2]}	Pixel fillrate (GP/s)^{[lower-alpha 3]}	Texture fillrate (GT/s)^{[lower-alpha 4]}	Size	Bus type & width	Band -width (GB/s)	API support	Special features
Liverpool (PS4)	Nov 2013	28	Jaguar	2 modules with 4 cores each	1.6	2× 2 MB	GCN 2	1152:72:32	800	1843	25.6	57.6	8 GB	GDDR5 256-bit	176	OpenGL 4.2, GNM, GNMX and PSSL	8 ACEs in the GPU and additional modules
Durango (Xbox One)	Nov 2013		Jaguar	2 modules with 4 cores each	1.75	2× 2 MB	GCN 2	768:48:16	853	1310	13.6	40.9	8 GB	DDR3 256-bit	68	Direct3D 11.2 and 12	2 ACEs in the GPU
Durango (Xbox One)	Nov 2013		Jaguar	2 modules with 4 cores each	1.75	2× 2 MB	GCN 2	768:48:16	853	1310	13.6	40.9	32 MB	ESRAM	204	Direct3D 11.2 and 12	2 ACEs in the GPU
Edmondton (Xbox One S)^[102]	Jun 2016	16	Jaguar	2 modules with 4 cores each	1.75	2× 2 MB	GCN 2	768:48:16	914	1404	14.6	43.9	8 GB	DDR3 256-bit	68	Direct3D 11.2 and 12	2 ACEs in the GPU
Edmondton (Xbox One S)^[102]	Jun 2016		Jaguar	2 modules with 4 cores each	1.75	2× 2 MB	GCN 2	768:48:16	914	1404	14.6	43.9	32 MB	ESRAM	219	Direct3D 11.2 and 12	2 ACEs in the GPU
Neo (PS4 Pro)^[103]^[104]^[105]	Nov 2016		Jaguar	"8 cores"	2.13	2× 2 MB	GCN 4 Polaris	2304:144:32	911	4198	29.15	131.2	8 GB	GDDR5 256-bit	218	OpenGL 4.2 (4.5), GNM, GNMX and PSSL	2× faster half-precision floats^{[lower-alpha 5]}
Scorpio (Xbox One X)^[106]^[107]^[108]	Nov 2017		Customized Jaguar	2 modules with 4 cores each	2.3	2× 2 MB	GCN 4 Polaris^[109]	2560:160:32	1172	6001	37.5	187.5	12 GB	GDDR5 384-bit	326	Direct3D 11.2 and 12
? (Subor Z+)^[110]^[111]	Aug 2018 planned	12	Zen	4 cores 8 threads	3.0	?	GCN 5 Vega	1536:384:32	1300	3994	41.6	499.2	8 GB	GDDR5 256-bit	256	Vulkan 1.1, Direct3D 12.1

↑ Unified Shaders : Texture Mapping Units : Render Output Units
↑ Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
↑ Pixel fillrate is calculated as the number of ROPs multiplied by the base (or boost) core clock speed.
↑ Texture fillrate is calculated as the number of TMUs multiplied by the base (or boost) core clock speed.
↑ Feature preview of Rapid Packed Math, introduced in GCN 5 Vega.

Notes

Note 1: The clock multiplier applies to the 200 MHz base clock. (AMD default clock base is 200 MHz)
Note 2: Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs
Note 3: Models enabled by Turbo Core technology, up to 10% clock speed increase is planned. With CPU boost, only one core of a dual-core model has boost enabled.
Note 4: K models feature an unlocked multiplier and overclockable GPU.
Note 5: One AMD module consists of two integer cores and two FPUs, which can be combined into one wide FPU for executing certain instructions, such as FMA. The two cores share certain resources, but are two separate units.

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↑ "Archived copy". Archived from the original on 2015-05-27. Retrieved 2015-05-26.
↑ "HP ProDesk 405 G2 Microtower-PC". Retrieved 2015-02-24.
↑ Cutress, Ian. "AMD's Carrizo-L APUs Unveiled: 12-25W Quad Core Puma+". Anandtech.com. Retrieved 20 July 2018.
↑ "HP Pavilion Desktops - HP® Official Store". Store.hp.com. Retrieved 20 July 2018.
↑ "Welcome to AMD - Processors - Graphics and Technology - AMD". Amd.com. Retrieved 20 July 2018.
↑ "Embedded Products - High Performance GPU - AMD". Amd.com. Retrieved 20 July 2018.
↑ "AMD Embedded G-Series System-on-Chip (SOC)" (PDF). AMD. Retrieved 2013-11-10.
↑ https://www.amd.com/Documents/I-Family-Product-Brief.pdf
↑ https://store.hp.com/us/en/pdp/hp-t630-thin-client-p-2zv00at-aba-1?pStoreID=epp
↑ http://www.cpu-world.com/CPUs/Bulldozer/AMD-G-Series%20GX-420GI.html
↑ https://www.amd.com/Documents/J-Family-Product-Brief.pdf
↑ https://www.amd.com/Documents/2nd_Gen_Rseries_Product_Brief.pdf
↑ https://www.amd.com/Documents/merlin-falcon-product-brief.pdf
↑ "AMD Establishes Semi-Custom Business Unit to Create Tailored Products with Customer-Specific IP". Archived from the original on 2013-10-01. Retrieved 2013-11-10.
↑ "Three for three: How AMD won the war for the heart of next-gen consoles". Retrieved 2013-11-10.
↑ MACHKOVECH, SAM (2 August 2016). "Microsoft hid performance boosts for old games in Xbox One S, told no one". Ars Technica. Retrieved 2 August 2016.
↑ Walton, Mark (10 August 2016). "PS4 Neo: Sony confirms PlayStation event for September 7". Ars Technica. Retrieved 10 August 2016.
↑ Walton, Mark (19 April 2016). "Sony PS4K is codenamed NEO, features upgraded CPU, GPU, RAM—report". Ars Technica. Retrieved 10 August 2016.
↑ Smith, Ryan (8 September 2016). "Analyzing Sony's Playstation 4 Pro Hardware Reveal: What Lies Beneath". Anandtech. Retrieved 8 September 2016.
↑ http://www.anandtech.com/show/11536/microsofts-project-scorpio-get-a-launch-date-xbox-one-x-499-november-7th
↑ https://arstechnica.com/gaming/2017/04/xbox-scorpio-hardware-specs/
↑ Cutress, Ian (21 August 2017). "Hot Chips: Microsoft Xbox One X Scoprio Engine Live Blog". Anandtech. Retrieved 21 August 2017.
↑ Freedman, Andrew (3 November 2017). "Xbox One X vs. PlayStation 4 Pro: Which Powerhouse Should You Get?". Tom's Guide. Retrieved 3 November 2017.
↑ Cutress, Ian (3 August 2018). "AMD Creates Quad Core Zen SoC with 24 Vega CUs for Chinese Consoles". Anandtech.
↑ Cutress, Ian (6 August 2018). "More Details About the ZhongShan Subor Z+ Console, with Custom AMD Ryzen SoC". Anandtech.

External links

This article is issued from Wikipedia. The text is licensed under Creative Commons - Attribution - Sharealike. Additional terms may apply for the media files.

[2] No APU models. Athlon X4 845 only.

[4] Unified shaders : texture mapping units : render output units

[11] To feed more than two displays, the additional panels must have native DisplayPort support.^[8] Alternatively active DisplayPort-to-DVI/HDMI/VGA adapters can be employed.

[DRM-13] 1 2 To play protected video content, it also requires card, operating system, driver, and application support. A compatible HDCP display is also needed for this. HDCP is mandatory for the output of certain audio formats, placing additional constraints on the multimedia setup.

[drm-14] 1 2 DRM (Direct Rendering Manager) is a component of the Linux kernel. Support in this table refers to the most current version.

[r100_shader-20] Radeon 7000 Series has programmable pixel shaders, but do not fully comply with DirectX 8 or Pixel Shader 1.0. See article on R100's pixel shaders.

[nonpot-21] These series do not fully comply with OpenGL 2+ as the hardware does not support all types of non-power-of-two (NPOT) textures.

[nofp64-23] OpenGL 4+ compliance requires supporting FP64 shaders and these are emulated on some TeraScale chips using 32-bit hardware.

[54] AMD defines 1 kilobyte (KB) as 1024 bytes, and 1 megabyte (MB) as 1024 kilobytes.^[45]

[cconfig-55] Unified Shaders : Texture Mapping Units : Render Output Units

[SFLOPS-56] Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

[83] AMD defines 1 kilobyte (KB) as 1024 bytes, and 1 megabyte (MB) as 1024 kilobytes.^[45]

[cconfig-84] Unified Shaders : Texture Mapping Units : Render Output Units

[SFLOPS-85] Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

[cconfig-116] Unified Shaders : Texture Mapping Units : Render Output Units

[FLOPS-117] Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

[pixel_fillrate-118] Pixel fillrate is calculated as the number of ROPs multiplied by the base (or boost) core clock speed.

[texture_fill-119] Texture fillrate is calculated as the number of TMUs multiplied by the base (or boost) core clock speed.

[Rapid_Packed_Math-124] Feature preview of Rapid Packed Math, introduced in GCN 5 Vega.

[1] "The Mobile CPU Comparison Guide Rev. 13.0 Page 5 : AMD Mobile CPU Full List". TechARP.com. Retrieved 13 December 2017.

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[8] Larabel, Michael (17 November 2017). "Radeon VCN Encode Support Lands In Mesa 17.4 Git". Phoronix. Retrieved 20 November 2017.

[9] Tony Chen; Jason Greaves, "AMD's Graphics Core Next (GCN) Architecture" (PDF), AMD, retrieved 2016-08-13

[10] "How do I connect three or More Monitors to an AMD Radeon™ HD 5000, HD 6000, and HD 7000 Series Graphics Card?". AMD. Retrieved 2014-12-08.

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[amd-pro200ge-59] "Processor Specifications". AMD. Retrieved 2018-09-06.

[amd-2200ge-60] "2nd Gen AMD Ryzen™ 3 2200GE Desktop Processor". AMD. Retrieved 2018-04-19.

[GE_release-61] 1 2 Shilov, Anton (12 February 2018). "AMD Readies Ryzen 3 2200GE & Ryzen 5 2400GE APUs with Reduced TDP". Anandtech. Retrieved 12 February 2018.

[amd-r5g1-62] 1 2 "AMD Ryzen™ 5 2400G". Retrieved 2018-01-19.

[amd-r5g2-63] 1 2 "AMD Ryzen™ 3 2200G". Retrieved 2018-01-19.

[64] ttps://www.amd.com/en/products/apu/amd-ryzen-3-pro-2200ge

[liliputing-65] 1 2 Linder, Brad (22 January 2018). "AMD reveals specs for Ryzen desktop chips with Radeon graphics". Liliputing. Retrieved 22 January 2018.

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[67] ttps://www.amd.com/en/products/apu/amd-ryzen-3-pro-2200g

[amd-r5ge1-68] "AMD Ryzen™ 5 2400GE". Retrieved 2018-04-19.

[69] ttps://www.techpowerup.com/gpudb/3054/radeon-rx-vega-11-mobile

[70] ttps://www.amd.com/en/products/apu/amd-ryzen-5-pro-2400ge

[71] ttps://arstechnica.com/gadgets/2018/01/amds-2018-roadmap-desktop-apus-in-february-second-generation-ryzen-in-april/

[72] ttps://www.amd.com/en/products/apu/amd-ryzen-5-pro-2400g

[73] Kennedy, Patrick (5 June 2017). "New HPE ProLiant MicroServer Gen10 Powered by AMD Opteron X3000 APUs". Retrieved 5 June 2017.

[74] "Opteron". AMD Opteron. AMD. Retrieved 5 June 2017.

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[76] "AMD intros 35W Richland mobile APUs". Retrieved 2013-11-10.

[77] Poeter, Damon. (2013-03-12) AMD Bakes New Interface Capabilities Into Richland APUs | News & Opinion

[78] "Archived copy". Archived from the original on 2013-12-03. Retrieved 2013-11-26.

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[81] "AMD A12-9720P SoC - Benchmarks and Specs". Notebookcheck.net. Retrieved 20 July 2018.

[82] "HP Pavilion 17 - HP® Official Store". Store.hp.com. Retrieved 20 July 2018.

[amd-r3a-86] "AMD Ryzen™ 3 2200U". Retrieved 2018-01-21.

[87] ttps://www.techpowerup.com/gpudb/3078/radeon-vega-3

[amd-r3-88] "AMD Ryzen™ 3 2300U". Retrieved 2018-01-21.

[89] ttps://www.techpowerup.com/gpudb/3079/radeon-vega-6

[amd-r3p-90] "AMD Ryzen™ 3 PRO 2300U". 2018-01-21. Retrieved 8 January 2018.

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[amd-r5-92] 1 2 "AMD Ryzen™ 5 2500U". Retrieved 2018-01-21.

[93] ttps://www.techpowerup.com/gpudb/3042/radeon-rx-vega-8-mobile

[amd-r5p-94] "AMD Ryzen™ 5 PRO 2500U". 2018-01-21. Retrieved 8 January 2018.

[amd-r7-95] 1 2 "AMD Ryzen™ 7 2700U". Retrieved 2018-01-21.

[96] ttps://www.techpowerup.com/gpudb/3053/radeon-rx-vega-10-mobile

[amd-r7p-97] "AMD Ryzen™ 7 PRO 2700U". 2018-01-21. Retrieved 8 January 2018.

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[amd-apu-specs-99] ttps://www.amd.com/en/products/specifications/apu

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[101] "Archived copy". Archived from the original on 2015-05-27. Retrieved 2015-05-26.

[102] "HP ProDesk 405 G2 Microtower-PC". Retrieved 2015-02-24.

[103] Cutress, Ian. "AMD's Carrizo-L APUs Unveiled: 12-25W Quad Core Puma+". Anandtech.com. Retrieved 20 July 2018.

[104] "HP Pavilion Desktops - HP® Official Store". Store.hp.com. Retrieved 20 July 2018.

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[107] "AMD Embedded G-Series System-on-Chip (SOC)" (PDF). AMD. Retrieved 2013-11-10.

[108] ttps://www.amd.com/Documents/I-Family-Product-Brief.pdf

[109] ttps://store.hp.com/us/en/pdp/hp-t630-thin-client-p-2zv00at-aba-1?pStoreID=epp

[110] ttp://www.cpu-world.com/CPUs/Bulldozer/AMD-G-Series%20GX-420GI.html

[111] ttps://www.amd.com/Documents/J-Family-Product-Brief.pdf

[112] ttps://www.amd.com/Documents/2nd_Gen_Rseries_Product_Brief.pdf

[113] ttps://www.amd.com/Documents/merlin-falcon-product-brief.pdf

[114] "AMD Establishes Semi-Custom Business Unit to Create Tailored Products with Customer-Specific IP". Archived from the original on 2013-10-01. Retrieved 2013-11-10.

[115] "Three for three: How AMD won the war for the heart of next-gen consoles". Retrieved 2013-11-10.

[120] MACHKOVECH, SAM (2 August 2016). "Microsoft hid performance boosts for old games in Xbox One S, told no one". Ars Technica. Retrieved 2 August 2016.

[121] Walton, Mark (10 August 2016). "PS4 Neo: Sony confirms PlayStation event for September 7". Ars Technica. Retrieved 10 August 2016.

[122] Walton, Mark (19 April 2016). "Sony PS4K is codenamed NEO, features upgraded CPU, GPU, RAM—report". Ars Technica. Retrieved 10 August 2016.

[123] Smith, Ryan (8 September 2016). "Analyzing Sony's Playstation 4 Pro Hardware Reveal: What Lies Beneath". Anandtech. Retrieved 8 September 2016.

[125] ttp://www.anandtech.com/show/11536/microsofts-project-scorpio-get-a-launch-date-xbox-one-x-499-november-7th

[126] ttps://arstechnica.com/gaming/2017/04/xbox-scorpio-hardware-specs/

[127] Cutress, Ian (21 August 2017). "Hot Chips: Microsoft Xbox One X Scoprio Engine Live Blog". Anandtech. Retrieved 21 August 2017.

[128] Freedman, Andrew (3 November 2017). "Xbox One X vs. PlayStation 4 Pro: Which Powerhouse Should You Get?". Tom's Guide. Retrieved 3 November 2017.

[129] Cutress, Ian (3 August 2018). "AMD Creates Quad Core Zen SoC with 24 Vega CUs for Chinese Consoles". Anandtech.

[130] Cutress, Ian (6 August 2018). "More Details About the ZhongShan Subor Z+ Console, with Custom AMD Ryzen SoC". Anandtech.

List of AMD accelerated processing unit microprocessors

Feature overview

Graphics API overview

Desktop APUs

Lynx: "Llano" (2011)

Virgo: "Trinity" (2012)

"Richland" (2013)

"Kabini" (2013, SoC)

"Kaveri" (2014)

"Carrizo" (2016)

"Bristol Ridge" (2016)

"Raven Ridge" (2018)

Server APUs

Opteron X2100-series "Kyoto" (2013)

Opteron X3000-series (2017)

Mobile APUs

Sabine: "Llano" (2011)

Comal: "Trinity" (2012)

"Richland" (2013)

"Kaveri" (2014)

"Carrizo" (2015)

"Bristol Ridge" (2016)

"Raven Ridge" (2017)

Ultra-mobile APUs

Brazos: "Desna", "Ontario", "Zacate" (2011)

Brazos 2.0: "Ontario", "Zacate" (2012)

Brazos-T: "Hondo" (2012)

"Kabini", "Temash" (2013)

Temash, Elite Mobility APU

Kabini, Mainstream APU

"Beema", "Mullins" (2014)

Mullins, Tablet/2-in-1 APU

Beema, Notebook APU

"Carrizo-L" (2015)

"Stoney Ridge" (2016)

Embedded APUs

G-Series

Brazos: "Ontario" and "Zacate" (2011)

"Kabini" (2013, SoC)

"Steppe Eagle" (2014, SoC)

"Crowned Eagle" (2014, SoC)

I-Family: "Brown Falcon" (2016, SoC)

J-Family: "Prairie Falcon" (2016, SoC)

LX-Family (2016, SoC)

R-Series

Comal: "Trinity" (2012)

"Bald Eagle" (2014)

"Merlin Falcon" (2015, SoC)

Custom APUs

See also

Notes

References

External links