List of semiconductor fabrication plants
This is a list of semiconductor fabrication plants: A semiconductor fabrication plant is where integrated circuits (ICs), also known as microchips, are made. They are either operated by Integrated Device Manufacturers (IDMs) who design and manufacture ICs in-house and may also manufacture designs from design only firms (fabless companies), or by Pure Play foundries, who manufacture designs from fabless companies but do not design their own ICs. Some Pure Play foundries like TSMC offer IC design services, and others like Samsung design and manufacture ICs for their customers, while designing, manufacturing and selling their own ICs.
Notes:
- Plant location is where the plant is located,.
- Started production is when the plant officially started volume (or mass) production.
- Wafer size is the largest wafer size that the facility is capable of processing.
- Process technology node is the size of the smallest features that the facility is capable of etching onto the wafers.
- Wafer capacity per month is the plant's Nameplate capacity. It does not mean that the facility is working at that capacity. The number of wafers that a plant actually processes in relation to its nameplate capacity is referred to as the plant's utilization.
- Technology/products are the products that the facility is capable of producing, as not all plants can produce all products on the market.
Open plants are listed below; plants that are closed are below this first table.
Open
Company | Plant Name | Plant Location | Plant Cost (in US$ billions) | Started Production | Wafer Size (mm) | Process Technology Node (nm) | Production Capacity (Wafers/Month) | Technology / Products | |
---|---|---|---|---|---|---|---|---|---|
NHanced Semiconductors[1] | MNC | USA, NC, Morrisville | 2001 | 100, 150, 200 | >=500 | 1000 | MEMS, Silicon Sensors, BEoL, 2.5/3D and advanced packaging | ||
Epson[2] | T wing | Japan, Sakata | 1997 | 200 | 150-350 | 25,000 | |||
Epson[2] | S wing | Japan, Sakata | 1991 | 150 | 350-1200 | 20,000 | |||
Hanking Electronics | Fab 1 | China, Liaoning, Fushun | 2018 | 200 | 10,000 | MEMS Foundry, MEMS Design, MEMS Sensors (Inertial, Pressure, Ultrasound, Piezoelectric, LiDar, Bolometer ) | |||
Integral | Belarus, Minsk | 1963 | 100, 150, 200 | 2000, 1500, 350 | |||||
Sensera | uDev-1 | USA, MA, Woburn | 2014 | 150 | 700 | 1,000 | MEMS, MicroDevice assembly | ||
ISRO | SCL | India, Chandigarh | 200 | 180 | MEMS, CMOS, CCD, N.S. | ||||
Silterra Malaysia | Fab1 | Malaysia, Kedah, Kulim | 1.6 | 2000 | 200 | 90-180 | 28,000–30,000 | CMOS, HV, MEMS, RF, Logic, Analog, Mix Signal | |
Microchip | Fab 2 | USA, AZ, Tempe | 1994 | 200 | |||||
Microchip | Fab 4 | USA, OR, Gresham | 2004 | 200 | |||||
Microchip | Fab 5 | USA, CO, Colorado Springs | 150 | ||||||
CanSemi[3] | China, Guanzhou | 4 | 300 | 180-130 | Foundry[4] | ||||
Nanya | Fab | Taiwan, ? | 199x | 300 | DRAM | ||||
Nanya | Fab 2 | Taiwan, Linkou | 0.8 | 2000 | 200[5] | 175 | 30,000 | DRAM | |
Nanya | Fab 3A[6] | Taiwan, New Taipei City[7] | 1.85[8] | 2018 | 20 | DRAM | |||
Intel | D1B | USA, OR, Hillsboro | 1996 | 300 | 10 / 14 / 22 | Microprocessors[9] | |||
Intel | D1C[10][9] | USA, OR, Hillsboro | 2001 | 300 | 10 / 14 / 22 | Microprocessors[9] | |||
Intel | D1D[10][9] | USA, OR, Hillsboro | 2003 | 300 | 7 / 10 / 14 | Microprocessors[9] | |||
Intel | D1X[11][9] | USA, OR, Hillsboro | 2013 | 300 | 7 / 10 / 14 | Microprocessors[9] | |||
Intel | Fab 12[10][9] | USA, AZ, Chandler | 1996 | 300 | 22 / 65 | Microprocessors & chipsets[9] | |||
Intel | Fab 32[10][12] | USA, AZ, Chandler | 3 | 2007 | 300 | 45 | |||
Intel | Fab 32[10][9] | USA, AZ, Chandler | 2007 | 300 | 22 / 32 | Microprocessors[9] | |||
Intel | Fab 42[13][14][9] | USA, AZ, Chandler | 7[15] | 2020 (planned)[16] | 300 | 7 | Microprocessors[9] | ||
Intel | Fab 11x[10][9] | USA, NM, Rio Rancho | 2002 | 300 | 32 / 45 | Microprocessors[9] | |||
Intel | Fab 18[17] | Israel, Kiryat Gat | 1996 | 200 | 65 | Microprocessors and chipsets[18] | |||
Intel | Fab 10[10] | Ireland, Leixlip | 1994 | 200 | |||||
Intel | Fab 14[10] | Ireland, Leixlip | 1998 | 200 | |||||
Intel | Fab 24[10][9] | Ireland, Leixlip | 2004 | 300 | 14 / 65 / 90[19] | Microprocessors, Chipsets and Comms[9] | |||
Intel | Fab 28[10][9] | Israel, Kiryat Gat | 2008 | 300 | 22 / 45 | Microprocessors[9] | |||
Intel | Fab 68[10][20] | China, Dalian | 2.5 | 2010 | 300 | 65[21] | VNAND[9] | ||
Intel | Costa Rica, Heredia, Belén | 1997 | 300 | 22 | |||||
TowerJazz (formerly Maxim) | San Antonio[22][23] | USA, TX, San Antonio | 2003 | 200 | 180 | Al BEOL, Power, RF Analog | |||
Apple (formerly Maxim, formerly Samsung) | X3[24] | USA, CA, San Jose | ?, 1997, 2015[25] | ||||||
Maxim | MaxFabNorth[26] | USA, OR, Beaverton | |||||||
Mikron | Russia, Zelenograd | 65-180 | |||||||
VSP Mikron | WaferFab[27] | Russia, Voronezh | 1959 | 100/150 | 900+ | 6000 | Analog, power | ||
NXP Semiconductors (formerly Freescale Semiconductor) (formerly Motorola) | MOTOFAB1[28] | Mexico, Guadalajara | 2002 | ||||||
Micron | Fab 1 | USA, VA, Manassas | 1981 | 300 | DRAM | ||||
Micron | Fab 2 IMFT | USA, UT, Lehi | 300 | 25[29] | 70,000 | DRAM | |||
Micron | Micron Memory Taiwan[30] | Taiwan, Taichung | |||||||
Micron | Taiwan, Taichung[31] | ||||||||
Micron | Fab 6 | USA, VA, Manassas | 300 | 25[29] | 70,000 | DRAM, NAND FLASH, NOR | |||
Micron | Fab 4[32] | USA, ID, Boise | 300 | RnD | |||||
Micron | Fab 13[33] | Singapore, Singapore | 200 | NOR | |||||
Micron | Fab 10[34] | Singapore, Singapore | 300 | 100,000 | NAND FLASH | ||||
Micron | Fab 7 (formerly TECH Semiconductor, Singapore)[35] | Singapore, Singapore | 300 | 60,000 | NAND FLASH | ||||
Micron | Fab 15 (formerly Elpida Memory, Hiroshima)[32][30] | Japan, Hiroshima | 300 | 20 and under | 100,000 | DRAM | |||
Micron | Fab 16 (formerly Rexchip, Taichung)[32] | Taiwan, Taichung | 300 | 30 and under | 80,000 | DRAM | |||
Micron | Fab 11 (formerly Inotera)[36] | Taiwan, Taoyuan | 300 | 20 and under | 80,000 | DRAM | |||
Micron | UK, Scotland[30] | ||||||||
Micron | Singapore[30] | 200 | NOR Flash | ||||||
Micron | Micron Semiconductor Asia | Singapore[30] | |||||||
Micron | China, Xi'an[30] | ||||||||
GlobalFoundries | Fab 9 | USA, VT, Essex Junction | 200 | 90–350 | 40,000 | ||||
GlobalFoundries | Fab 10 | USA, NY, East Fishkill | 2.5 | 2002 | 300 | 22–90 | 14,000 | ||
GlobalFoundries | Fab 1 Module 1[37] | Germany, Dresden | 3.6[38] | 2005 | 300 | 22–45 | 35,000[38] | Foundry | |
GlobalFoundries | Fab 1 Module 2 | Germany, Dresden | 4.9[38] | 1999 | 300 | 22–45 | 25,000[38] | Foundry | |
GlobalFoundries | Fab 1 Module 3 | Germany, Dresden | 2.3[38] | 2011[38] | 300 | 22–45 | 6,000[38] | Foundry | |
GlobalFoundries | Fab 7[37] | Singapore | 4.6[38] | 2005[38] | 300 | 40, 90, 65, 130 | 50,000 | Bulk CMOS, SoI | |
GlobalFoundries | Fab 8[37] | USA, NY, Malta | 4.6, 2.1 | 2012, 2014[38] | 300 | 14 / 22 / 28 | 60,000 | High-K Metal Gate[39] | |
GlobalFoundries | Technology Development Center[38] | USA, NY, Malta | 1.5[38] | 2014[38] | |||||
GlobalFoundries | Fab 2[40] | Singapore | 1.3[38] | 1995[38] | 200 | 350–600 | 56,000[38] | ||
GlobalFoundries | Fab 3/5[40] | Singapore | 0.915, 1.2[38] | 1997, 1995[38] | 200 | 180–350 | 54,000 | ||
Vanguard International Semiconductor Corporation | Fab 3E[40] | Singapore | 1.3[38] | 200 | 180 | 34,000 | |||
GlobalFoundries | Fab 6[40] | Singapore | 1.4[38] | 2000[38] | 200 | 110–180 | 45,000 | ||
GlobalFoundries | Abu Dhabi[38] | UAE, Abu Dhabi[38] | 6.8[38] | 2016[38] | 110–180 | 45,000 | Foundry | ||
GlobalFoundries | China, Chengdu[41] | 10 | Planned | ||||||
Kioxia | Yokkaichi Operations[42][43] | Japan, Yokkaichi | 1992 | 173,334[44][45][46][47] | Flash Memory | ||||
Kioxia/SanDisk | Fab 5 Phase 1 (at Yokkaichi Operations) | Japan, 800 Yamanoisshikicho, Yokkaichi, Mie[48] | 2011 | Flash | |||||
Kioxia/SanDisk | Fab 5 Phase 2[48] (at Yokkaichi Operations) | Japan, Mie | 2011 | 300 | 15[49] | Flash | |||
Kioxia[50] | Fab 3 (at Yokkaichi Operations) | Japan, Yokkaichi | NAND Memory | ||||||
Kioxia[51] | Fab 4 (at Yokkaichi Operations) | Japan, Yokkaichi | 2007 | NAND Memory | |||||
Kioxia[52] | Kaga Toshiba | Japan, Ishikawa | Power semiconductor devices | ||||||
Kioxia[53] | Oita Operations | Japan, Kyushu | |||||||
Kioxia[54][55] | Fab 6 (phase 1) (at Yokkaichi Operations)[56] | Japan, Yokkaichi | 1.6, 1.7, 1.8 (estimates) (combined costs of installation of equipment at Phase 1 and construction of Phase 2)[57][43] | 2018 | BiCS FLASH™ | ||||
Kioxia[54][55] | Fab 6 (phase 2) (at Yokkaichi Operations) | Japan, Yokkaichi | 1.6, 1.7, 1.8 (estimates) (combined costs of installation of equipment at Phase 1 and construction of Phase 2)[57][43] | Planned | BiCS FLASH™ | ||||
Kioxia[54][55] | Japan, Yokkaichi | 4.6[58][59] | Planned | BiCS FLASH™ | |||||
Kioxia[54] | Fab 2 (at Yokkaichi Operations) | Japan, Yokkaichi | 1995 | 3D NAND | |||||
Kioxia[60][61] | New Fab 2 (at Yokkaichi Operations) | Japan, Yokkaichi | 2016, July 15 | 3D NAND | |||||
Kioxia[62][63][64][65] | Japan, Iwate Prefecture | Under Construction | 3D NAND | ||||||
Hitachi[66] | Rinkai Factory | Japan, 5-2-2, Omikacho, Hitachi-shi, Ibaraki, 319-1221 | MEMS Foundry | ||||||
Hitachi[66] | Haramachi Factory | Japan, 20 Aza Oohara, Shimo-Ota, Haramachi-ku, Minamisouma-shi, Fukushima, 975-0041 | Power semiconductors | ||||||
Hitachi[66] | Yamanashi Factory | Japan, 545, Itchohata, Chuo-shi, Yamanashi, 409-3813 | Power semiconductors | ||||||
TSMC | Fab 2[67] | Taiwan, Hsinchu | 0.735[38] | 1990[38] | 150 | 88,000[68][38] | Foundry | ||
TSMC | Fab 3 | Taiwan, Hsinchu | 2[38] | 1995[38] | 200 | 100,000[38] | |||
TSMC | Fab 5 | Taiwan, Hsinchu | 1.4[38] | 1997[38] | 200 | 48,000[38] | |||
TSMC | Fab 6 | Taiwan, Tainan | 2.1[38] | 2000, January; 2001[69] | 200, 300 | 180-? | 99,000[38] | Foundry | |
TSMC | Fab 7[70] | Taiwan, Tainan | 200 | ||||||
TSMC | Fab 8 | Taiwan, Hsinchu | 1.6[38] | 1998[38] | 200 | 85,000[38] | |||
TSMC | Fab 10 | China, Shanghai | 1.3[38] | 2004[38] | 200 | 74,000 | |||
TSMC | Fab 12 | Taiwan, Hsinchu | 5.2, 21.6 (total, all phases combined)[38] | 2001[38] | 300 | 150-28 | 77,500-123,800 (all phases combined)[38] | ||
TSMC | Fab 12A | Taiwan, Hsinchu | 300 | 25,000 | |||||
TSMC | Fab 12B | Taiwan, Hsinchu | 300 | 25,000 | |||||
TSMC | Fab 12 (P4) | Taiwan, Hsinchu | 6[38] | 2009[38] | 300 | 20 | 40,000[38] | ||
TSMC | Fab 12 (P5) | Taiwan, Hsinchu | 3.6[38] | 2011[38] | 300 | 20 | 6,800[38] | ||
TSMC | Fab 12 (P6) | Taiwan, Hsinchu | 4.2[38] | 2013[38] | 300 | 16 | 25,000 | ||
TSMC | Fab 12 (P7) | Taiwan, Hsinchu | (future) | 300 | 16 | ||||
TSMC | Fab 12 (P8)[38] | Taiwan, Chunan[38] | 5.1[38] | 2017[38] | 450[38] | ||||
TSMC | Fab 14 | Taiwan, Tainan | 5.1[38] | 2002,[69] 2004[38] | 300 | 20 | 82,500[38] | ||
TSMC | Fab 14 (B) | Taiwan, Tainan | 300 | 16 | 50,000+[71] | ||||
TSMC | Fab 14 (P3)[38] | Taiwan, Tainan | 3.1[38] | 2008[38] | 300 | 16 | 55,000[38] | ||
TSMC | Fab 14 (P4)[38] | Taiwan, Tainan | 3.750[38] | 2011[38] | 300 | 16 | 45,500[38] | ||
TSMC | Fab 14 (P5)[38] | Taiwan, Tainan | 3.650[38] | 2013[38] | 300 | 16 | |||
TSMC | Fab 14 (P7)[38] | Taiwan, Tainan | 4.850[38] | 2015[38] | 300 | 16 | |||
TSMC | Fab 14 (P6)[38] | Taiwan, Tainan | 4.2[38] | 2014[38] | 300 | 16 | |||
TSMC WaferTech | Fab 11 | USA, WA, Camas | 200 | ||||||
TSMC | Fab 15[72] | Taiwan, Taichung | 9.3 | 2011 | 300 | 20 | 100,000+(166,000 estimate)[73][71][74] | ||
TSMC | Fab 15 (B) | Taiwan, Taichung | 300 | ||||||
TSMC | Fab 15 (P1)[38] | Taiwan, Taichung | 3.125[38] | 2011 | 300 | 4,000[38] | |||
TSMC | Fab 15 (P2)[38] | Taiwan, Taichung | 3.150[38] | 2012[38] | 300 | ||||
TSMC | Fab 15 (P3)[38] | Taiwan, Taichung | 3.750[38] | 2013[38] | 300 | ||||
TSMC | Fab 15 (P4)[38] | Taiwan, Taichung | 3.800[38] | 2014[38] | 300 | ||||
TSMC | Fab 15 (P5)[38] | Taiwan, Taichung | 9.020[38] | 2016[38] | 300 | ||||
TSMC | Fab 18 | Taiwan, Southern Taiwan Science Park[75][76] | 17.08 | 2020 (planned), under construction | 300 | 5[77] | 120,000 | ||
TSMC[78] | NJ Fab 16 | China, Nanjing | 2018 | 300 | 20,000 | ||||
TSMC[78][79][80] | Taiwan, Tainan Science Park[81] | 20 (expected)[82] | Future | 3[83][84] | |||||
TSMC (formerly WSMC)[85] | 200 | ||||||||
TSMC (formerly Acer Semiconductor Manufacturing Inc.) (formerly Texas Instruments)[86][87][88] | 200 | Foundry (current)
DRAM (former), Logic (former) | |||||||
TSMC | 20[89] | 2022 (planned)[90] | 3 | Foundry | |||||
Epistar (formerly TSMC)[91][92][93] | Taiwan, Hsin-Chu Science Park | 0.080 | 2011, second half | LEDs | |||||
UMC | Fab 6A | Taiwan, Hsinchu | 0.35[38] | 1989[38] | 150 | 450 | 50,000 | ||
UMC | Fab 8AB | Taiwan, Hsinchu | 1[38] | 1995[38] | 200 | 250 | 70,000[94] | ||
UMC | Fab 8C | Taiwan, Hsinchu | 1[38] | 1998[38] | 200 | 350-110 | 29,000 | ||
UMC | Fab 8D | Taiwan, Hsinchu | 1.5[38] | 2000[38] | 200 | 90 | 32,000 | ||
UMC | Fab 8E | Taiwan, Hsinchu | 0.96[38] | 1998[38] | 200 | 180 | 35,000 | ||
UMC | Fab 8F | Taiwan, Hsinchu | 1.5[38] | 2000[38] | 200 | 150 | 32,000 | ||
UMC | Fab 8S | Taiwan, Hsinchu | 0.8[38] | 2004[38] | 200 | 350-250 | 25,000 | ||
UMC | Fab 8N | Taiwan, Hsinchu | 0.750[38] | 2003[38] | 200 | 350-110 | 50,000 | ||
UMC | Fab 12A | Taiwan, Tainan | 4.65, 4.1, 6.6, 7.3[38] | 2001, 2010, 2014, 2017[38] | 300 | 14 | 82,000[94] | ||
UMC | Fab 12i | Singapore | 3.7[38] | 2004[38] | 300 | 130-40 | 50,000 | ||
UMC | Fab 12X | China, Xiamen | 300 | 55-28 | 50,000 | ||||
UMC | Fab 1 | Japan, Tateyama | 0.543[38] | 1997[38] | |||||
UMC | Japan[69][85] | 300 | 180-? | ||||||
Vanguard International Semiconductor | Fab 1 | Taiwan, Hsinchu | 0.997[38] | 1994[38] | 200 | 55,000 | |||
Vanguard International Semiconductor (formerly Winbond) | Fab 2 (formerly Fab 4&5)[95] | Taiwan, Hsinchu | 0.965[38] | 1998[38] | 200 | 55,000 | |||
IM Flash | IM Flash[96] | Singapore | 2011 | 300 | 25 | ||||
IM Flash | IM Flash | USA, UT, Lehi | 300 | 20 | 3D XPoint | ||||
IM Flash | IM Flash | USA, VA, Manassas | |||||||
NXP Semiconductors | ATMC[97] | USA, TX, Austin | 1995 | 200 | 90 | ||||
NXP Semiconductors | Chandler Fab[98] | USA, AZ, Chandler | 1.1[99] | 1993 | 200 | 180 | |||
NXP Semiconductors | Oak Hill Fab[100] | USA, TX, Austin | .8[101] | 1991 | 200 | 250 | |||
Nexperia | Hamburg site[102] | Germany, Hamburg | 1953 | 200 | 35,000 | Small-signal and bipolar discrete devices | |||
Nexperia | Manchester[102] | UK, Bramhall Moor Lane, Pepper Rd, Hazel Grove, Stockport SK7 5BJ | 1987? | 150 | 24,000 | TrenchMOS MOSFETs | |||
NXP Semiconductors | China, Jilin | ||||||||
NXP Semiconductors | UK, Manchester | ||||||||
NXP Semiconductors | ICN8 | Netherlands, Nijmegen | 200 | 40,000+[103] | |||||
NXP Semiconductors (formerly Freescale Semiconductor) | CHD-FAB | USA, AZ, Chandler[104] | |||||||
NXP Semiconductors (formerly Freescale Semiconductor) | ATMC | USA, AZ, Chandler[104] | |||||||
NXP Semiconductors (formerly Mullard) | Stockport | UK, Hazel Grove, Stockport | |||||||
NXP Semiconductors | SSMC | Singapore | 1.7[38] | 2001[38] | |||||
NXP Semiconductors | Japan[105] | Bipolar, Mos, Analog, Digital, Transistors, Diodes | |||||||
X-Fab France SAS (formerly Altis Semiconductor) (formerly IBM)[106] | ACL-AMF | France, Corbeil-Essonnes | 1991, 1964[38] | 200 | 130–350 | CMOS | |||
X-Fab (formerly 1st Silicon)[107][108] | Malaysia | 2000 | 200 | 130–350 | 30,000 | ||||
LFoundry (formerly Micron)[109] | Italy, Avezzano | 1995 | 200 | 90–150 | 40,000 | ||||
Raytheon Systems Ltd | UK, Glenrothes, Scotland | 1960 | 100 | CMOS on SiC | |||||
STMicroelectronics | AMK8 (second, newer fab) | Singapore, Ang Mo Kio | 1995 | 200 | |||||
STMicroelectronics | AMJ9 (first fab, initially owned by SGS Microelettronica) | Singapore, Ang Mo Kio | 1984[110] | 150, 200 | 6” 14 kpcs/day, 8” 1.4 kpcs/day | Power-MOS/ IGBT/ bipolar/ CMOS | |||
STMicroelectronics | Crolles 1 / Crolles 200 | France, Crolles | 1993 | 200 | |||||
STMicroelectronics | Crolles2 / Crolles 300 | France, Crolles | 2003 | 300 | 90, 65, 45, 32 | ||||
STMicroelectronics | Tours | France, Tours | 200 | 500 | 8": 9kpcs/W; 12" 400-1000/W | ASIC | |||
STMicroelectronics (formerly SGS-ATES) | R2 (upgraded in 2001 from R1) | Italy, Agrate Brianza | 1963 | 200 | |||||
STMicroelectronics (formerly SGS-ATES) | AG8/AGM | Italy, Agrate Brianza | 1963 | 200 | |||||
STMicroelectronics | Catania | Italy, Catania | 1997 | 200 | |||||
STMicroelectronics | Rousset | France, Rousset | 2000 | 200 | |||||
SUNY Poly CNSE | NanoFab 300 North[111] | USA, NY, Albany | .175, .050 | 2004, 2005 | 300 | 65, 45, 32, 22 | |||
SUNY Poly CNSE | NanoFab 200[112] | USA, NY, Albany | .016 | 1997 | 200 | ||||
SUNY Poly CNSE | NanoFab Central[111] | USA, NY, Albany | .150 | 2009 | 300 | 22 | |||
Powerchip Semiconductor | Memory Foundry, Fab P1[113][114] | Taiwan, Hsinchu | 2.24[38] | 2002[38] | 300 | 90, 70, 22[115] | 80,000 | Memory IC, LCD drive IC, Integrated Memory Chips, CMOS Image Sensors, and Power Management IC | |
Powerchip Semiconductor | Fab P2[114] | Taiwan, Hsinchu, Hsinchu Science Park | 1.86[38] | 2005[38] | 300 | 90, 70, 22[115] | 80,000 | Memory IC, LCD drive IC, Integrated Memory Chips, CMOS Image Sensors, and Power Management IC | |
Powerchip Semiconductor | Fab P3[114] | Taiwan, Hsinchu, Hsinchu Science Park | 300 | 90, 70, 22[115] | 20,000 | Memory IC, LCD drive IC, Integrated Memory Chips, CMOS Image Sensors, and Power Management IC | |||
ON Semiconductor (formerly Fairchild Semiconductor) | USA, PA, Mountain Top | 1960/1997 | 200 | 350 | |||||
ON Semiconductor (formerly Fairchild Semiconductor) | USA, ME, South Portland | 1960/1997 | 200 | 350 | |||||
SMIC | S1 Mega Fab (S1A/S1B/S1C)[116] | China, Shanghai | 200 | 350-90 | 114,000[117] | ||||
SMIC | S2 (Fab 8)[116] | China, Shanghai | 300 | 45/40-32/28 | 20,000[117] | ||||
SMIC | SN1[116] | China, Shanghai | (planned) | 300 | 70,000[78] | ||||
SMIC | B1 Mega Fab (Fab 4, Fab 6)[116] | China, Beijing | 2004 | 300 | 180-90/55 | 50,000[117] | |||
SMIC | B2A[116] | China, Beijing | 3.59[118] | 2014 | 300 | 45/40-32/28 | 35,000[117] | ||
SMIC | Fab 7[116] | China, Tianjin | 2004 | 200 | 350-90 | 50,000[117] | |||
SMIC | Fab 15[116] | China, Shenzhen | 2014 | 200 | 350-90 | 50,000[117] | |||
SMIC | SZ (Fab 16A/B)[116] | China, Shenzhen | 2019 | 300 | 14 | 40,000[78] | |||
SMIC[78] | B3 | China, Beijing | Under construction | 300 | 35,000 | ||||
SMIC | LF | Italy, Avezzano | 180-90 | 50,000 | |||||
Winbond | Memory Product Foundry[119] | Taiwan, Taichung | 300 | 46 | |||||
Winbond | CTSP Site[120][121] | Taiwan, No. 8, Keya 1st Rd.,Daya Dist.,Central Taiwan Science Park, Taichung City 42881 | 300 | ||||||
Winbond[122] | Planned | 300 | |||||||
MagnaChip | F-5[123] | 2005 | 200 | 130 | |||||
ProMOS | Fab 4[124][125] | Taiwan, Taichung | 1.6 | 300 | 70 | ||||
TSI Semiconductors | Heilbronn, HNO-Line | Germany, Heilbronn | 0.125[38] | 1993[38] | 150 | 10,000 | |||
TSI Semiconductors[126] | Roseville fab, M-Line, TD-Line, K-Line[127][38] | USA, CA, Roseville | 1992, 1985[38] | 200 | |||||
SK Hynix[128] | China, Chongqing | ||||||||
SK Hynix[128] | China, Chongqing | ||||||||
SK Hynix[129][130] | South Korea, Cheongju, Chungcheongbuk-do | Under construction[131] | NAND Flash | ||||||
SK Hynix[130] | South Korea, Cheongju | Under construction | NAND Flash | ||||||
SK Hynix[130] | South Korea, Incheon | Planned | NAND Flash | ||||||
SK Hynix | M8 | South Korea, Cheongju | 200 | Foundry | |||||
SK Hynix | M10 | South Korea, Icheon | 300 | DRAM | |||||
SK Hynix | M11 | South Korea, Cheongju | 300 | NAND Flash | |||||
SK Hynix | M12 | South Korea, Cheongju | 300 | NAND Flash | |||||
SK Hynix | HC1 | China, Wuxi | 300 | 100,000[78] | DRAM | ||||
SK Hynix | HC2 | China, Wuxi | 300 | 70,000[78] | DRAM | ||||
SK Hynix | M14 | South Korea, Icheon | 300 | DRAM, NAND Flash | |||||
CSMC[132] | China, Wuxi | 200-300 | 130-above | ||||||
UMC(formerly Fujitsu) | Kawasaki | Japan, Kawasaki | 1966[133] | ||||||
UMC (formerly Fujitsu) | Mie (original installations)[134] | Japan, Mie | 1974 | 150, 200, 300[135] | |||||
UMC(formerly Fujitsu)[136][137] | Fab B1 (at Mie)[138] | Japan, 1500 Tadocho Mizono, Kuwana, Mie[139] | 2005 | 300 | 65, 90 | 15,000 | Foundry, Ultra-low Power ICs, Embedded Memory, RF ICs | ||
UMC(formerly Fujitsu)[136][137] | Fab B2 (at Mie)[138] | Japan, 1500 Tadocho Mizono, Kuwana, Mie[139] | 1 (total)[140] | 2007, July | 300 | 65, 90 | 25,000 | Foundry, Ultra-low Power ICs, Embedded Memory, RF ICs[141] | |
UMC(formerly Fujitsu)[136][137] | Japan, 1500 Tadocho Mizono, Kuwana, Mie[139] | 2015 | 300 | 40[142] | 5,000 | Foundry | |||
UMC(formerly Fujitsu) | Kumagaya Plant[138] | Japan, Saitama, 1224 Oaza-Nakanara, Kumagaya-shi, 360-0801 | 1974 | ||||||
UMC(formerly Fujitsu)[143] | Suzaka Plant | Japan, Nagano, 460 Oaza-Koyama, Suzaka-shi, 382-8501 | |||||||
UMC(formerly Fujitsu) | Iwate Plant[144][135] | Japan, Iwate, 4-2 Nishinemoriyama, Kanegasaki-cho, Isawa-gun, 029-4593 | |||||||
UMC(formerly Fujitsu)[145][146] | Aizu Wakamatsu Plant[147] | Japan, Fukushima, 3 Kogyo Danchi, Monden-machi, Aizuwakamatsu-shi, 965-8502 | 1970[133] | 150, 200[148][149][150][151] | Memory, Logic | ||||
Micronas | FREIBURG[152][153] | Germany, Freiburg, 19 D-79108, Hans-Bunte-Strasse | |||||||
SkyWater Technology (formerly Cypress Semiconductor fab) | Minnesota fab | USA, MN, Bloomington | 1991 | 65, 90, 130, 180, 250, 350 | |||||
Cypress Semiconductor | Fab25 | USA, TX, Austin | 1994 | 200 | Flash / Logic | ||||
ON Semiconductor | Gresham[154] | USA, OR, Gresham | 200 | 110 | |||||
ON Semiconductor (formerly AMI Semiconductor) | Pocatello[155] | USA, ID, Pocatello | 200 | 350 | |||||
ON Semiconductor | Oudenaarde | Belgium, Oudenaarde | 150 | 350 | 4,000 | ||||
ON Semiconductor | ISMF | Malaysia, Seremban | 150 | 350 | 80,000 | Discrete | |||
ON Semiconductor (formerly Sanyo)[156][157] | Niigata | Japan, Niigata | 150 | 350 | |||||
ON Semiconductor | Roznov | Czech Republic, Roznov | 150 | 5000 | |||||
ON Semiconductor | USA, RI, Cranston | ||||||||
Texas Instruments (formerly National Semiconductor) | South Portland[158] | USA, ME, South Portland | .932 | 1997 | 350, 250, 180 | ||||
Samsung | V1-Line[159] | South Korea, Hwaseong | 6 | 2020, February 20 | 300 | 7 | Microprocessors, Foundry | ||
Samsung | S3-Line[160] | South Korea, Hwaseong | 10.2, 16.2 (planned)[161][162] | 300 | 10 | 200,000 | DRAM, VNAND, Foundry | ||
Samsung | S2-Line[163] | USA, TX, Austin | 16[164][165] | 2011 | 300 | 65-11 | 92,000 | Microprocessors, Foundry | |
Samsung | S1-Line[166] | South Korea, Giheung | 33 (total) | 2005 (second phase), 1983 (first phase)[167][168] | 300 | 65-7 | 62,000 | Microprocessors, S.LSI, LEDs, Foundry[169] | |
Samsung | Pyeongtaek[170][171][161] | South Korea, Pyeongtaek | 14.7, 27 (total)[172][165][173][174][175][176][177][131] | 2017, July 6 | 300 | 14 | 450,000[178] | V-NAND, DRAM, Foundry | |
Samsung | 6 Line[179] | South Korea, Giheung | 200 | 180-65 | Foundry | ||||
Samsung | Samsung China Semiconductor[180] | China, Shaanxi Province | DDR Memory | ||||||
Samsung | Samsung Suzhou Research Center (SSCR)[166] | China, Suzhou, Suzhou Industrial Park | DDR Memory | ||||||
Samsung | Onyang Complex[180] | South Korea, Chungcheongnam-do | DDR Memory, System Logic | ||||||
Samsung | F1x1[181][161] | China, Xian | 2.3[182] | 2014 (first phase, second phase is under review)[161] | 300 | 20 | 100,000 | VNAND | |
Samsung | Giheung Campus[183] | South Korea, Gyeonggi-do, Yongin | LEDs | ||||||
Samsung | Hwasung Campus[183] | South Korea, Gyeonggi-do, Hwaseong | LEDs | ||||||
Samsung | Tianjin Samsung LED Co., Ltd.[183] | China, Tianjin, Xiqing, Micro-Electronic Industrial Park, Weisi Road | LEDs | ||||||
TowerJazz | Fab 1[184] | Israel, Migdal Haemek | 0.235[38] | 1989, 1986[38] | 150 | 1000-350 | 14,000 | Planarized BEOL, W and Oxide CMP, CMOS, CIS, Power, Power Discrete | |
TowerJazz | Fab 2[184] | Israel, Migdal Haemek | 1.226[38] | 2003 | 200 | 180-130 | 51,000[38] | Cu and Al BEOL, EPI, 193 nm Scanner, CMOS, CIS, Power, Power Discrete, MEMS, RFCMOS | |
TowerJazz | Fab 3,[184] Newport Beach[38] | USA, CA, Newport Beach | 0.165[38] | 1967, 1995[38] | 200 | 130–500 | 25,000[38] | Al BEOL, SiGe, EPI | |
TowerJazz – TPSCo | Fab 5,[184] Tonami[185] | Japan, Tonami | 1994 | 200 | 500-130 | Analog/Mixed-Signal,Power,Discrete,NVM,CCD | |||
TowerJazz – TPSCo | Fab 7,[184] Uozu[185] | Japan, Uozu | 1984 | 300 | 65. 45 | CMOS,CIS,RF,SOI, Analog/Mixed-Signal | |||
TowerJazz – TPSCo | Fab 6,[184] Arai[185] | Japan, Arai | 1976 | 200 | 130-110 | Analog/Mixed-Signal,CIS,NVM,Thick Cu RDL | |||
TowerJazz | China, Nanjing[186][187] | 200, 300 (planned) | |||||||
Texas Instruments | FFAB | Germany, Freising | 200 | ||||||
Texas Instruments | MFAB | USA, ME, ? | 200 | ||||||
Texas Instruments | RFAB | USA, TX, Richardson | 2009 | 300 | |||||
Texas Instruments | DMOS6 | USA, TX, Dallas | 300 | ||||||
Texas Instruments | DMOS5 | USA, TX, Dallas | 200 | ||||||
Texas Instruments | DFAB | USA, TX, Dallas | 1964 | 150/200 | |||||
Texas Instruments | SFAB | USA, TX, Sherman | 150 | ||||||
Texas Instruments | GFAB | UK, Scotland, Greenock | 150/200 | 40,000 | |||||
Texas Instruments | MIHO8 | Japan, Miho | 200 | ||||||
Texas Instruments | Aizu | Japan, Aizu | 200 | ||||||
Texas Instruments | Chengdu (CFAB) | China, Chengdu | 200 | ||||||
General Motors Components Holdings | Fab III | USA, IN, Kokomo | 125/200 | 500+ | |||||
Infineon Technologies | Villach | Austria, Villach | 1970[188] | 100/150/200/300 | MEMS, SiC, GaN | ||||
Infineon Technologies | Dresden | Germany, Dresden | 3[189] | 1994/2011[190] | 200/300 | 90 | |||
Infineon Technologies | Kulim[191] | Malaysia, Kulim | 2006[192] | 200/300 | 50,000 | ||||
Infineon Technologies | Kulim 2 | Malaysia, Kulim | 2015 | 200/300 | 50,000 | ||||
Infineon Technologies | Regensburg[193] | Germany, Regensburg | 1959 | ||||||
Infineon Technologies | Cegled[194] | Hungary, Cegled | |||||||
Infineon Technologies | Cheonan | South Korea, Cheonan-si | |||||||
Infineon Technologies | El Segundo | USA, CA, El Segundo[195] | |||||||
Infineon Technologies | Batam | Indonesia, Batam | |||||||
Infineon Technologies | Leominster | USA | |||||||
Infineon Technologies | Malacca | Malaysia | |||||||
Infineon Technologies | Mesa | USA | |||||||
Infineon Technologies | Morgan Hill | USA | |||||||
Infineon Technologies | Morrisville | USA | |||||||
Infineon Technologies | Neubiberg | Germany | |||||||
Infineon Technologies | Newport | UK | |||||||
Infineon Technologies | San Jose | USA | |||||||
Infineon Technologies | Singapore | Singapore | |||||||
Infineon Technologies | Temecula | USA | |||||||
Infineon Technologies | Tijuana | Mexico | |||||||
Infineon Technologies | Warstein | Germany | |||||||
Infineon Technologies | Wuxi | China | |||||||
Bosch | Germany, Reutlingen | 1995[196] | 150 | ASIC, analog, power | |||||
Bosch | Germany, Dresden | 1.0[197] | under construction | 300 | |||||
Bosch | WaferFab | Germany, Reutlingen | 0.708[198] | 2010[196] | 200 | 30,000 | ASIC, analog, power, MEMS | ||
Analog Devices | Limerick | Ireland, Limerick | 200 | ||||||
Analog Devices | Wilmington | USA, MA, Wilmington | 200/150 | ||||||
Analog Devices (formerly Linear Technology) | Hillview | USA, CA, Milipitas | 150 | ||||||
Analog Devices (formerly Linear Technology) | Camas | USA, WA, Camas | 150 | ||||||
X-Fab | Erfurt | Germany, Erfurt | 1985[38] | 200[199] | 600–1000[199] | 11200–[199] | |||
X-Fab | Dresden | Germany, Dresden | 0.095[38] | 1985[38] | 200[200] | 350–1000[200] | 6000–[200] | ||
X-Fab | Itzehoe | Germany, Itzehoe | 200[201] | 13000–[201] | MEMS | ||||
X-Fab | Kuching | Malaysia, Kuching | 1.89[38] | 2001[38] | 200[202] | 130–350[202] | 27000–[202] | ||
X-Fab | Lubbock | USA, TX, Lubbock | 0.197[38] | 1977[38] | 200[203] | 600–1000[203] | 15000–[203] | ||
Teledyne DALSA | Teledyne DALSA Semiconductor | Canada, Bromont, QC | 1980 | 150/200 | HV ASICs, HV CMOS, MEMS, CCD | ||||
CEITEC | Brazil, Porto Alegre | 200 | 600–1000 | RFID | |||||
Unitec Blue[204] | Argentina, Chascomús | 1.2[205] | |||||||
ams[206] | FAB B | Austria, Unterpremstaetten | 200 | 350 | |||||
HuahongGrace[207] | FAB | China, Shanghai | 300 | 90 | |||||
ASMC[208] | FAB 1/2 | China, Shanghai | 1992, 1997[38] | 200 | 600 | 78,000[38] | BCD, HV | ||
ASMC[208] | FAB 3 | China, Shanghai | 2004[38] | 200 | 250 | 12,000[38] | |||
Beilling[209] | China, Shanghai | 150 | 1200 | BiCMOS, CMOS | |||||
Diodes Incorporated[210] | OFAB | UK, Oldham | 150 | ||||||
Polar Semiconductor[211] | FAB1 | USA, MN, Bloomington | 150 | BCD, HV | |||||
Polar Semiconductor[211] | FAB2 | USA, MN, Bloomington | 200 | BCD, HV, GMR | |||||
Sony[212] | Kagoshima Technology Center | Japan, Kagoshima | 1973 | Bipolar CCD, MOS, MMIC, SXRD | |||||
Sony[212] | Oita Technology Center | Japan, Oita | 2016 | CMOS Image Sensor | |||||
Sony[212] | Nagasaki Technology Center | Japan, Nagasaki | 1987 | MOS LSI, CMOS Image Sensors, SXRD | |||||
Sony[212] | Kumamoto Technology Center | Japan, Kumamoto | 2001 | CCD Imgage Sensors, H-LCD, SXRD | |||||
Sony[212] | Shiroishi Zao Technology Center | Japan, Shiroishi | 1969 | Semiconductor Lasers | |||||
Sony (formerly Renesas) (formerly NEC Electronics) (formerly NEC)[212][213][214] | Yamagata Technology Center | Japan, Yamagata | 2014 | CMOS Image Sensor, eDRAM (formerly) | |||||
Sony | Sony Shiroishi Semiconductor Inc. | Japan, Miyagi | Semiconductor Lasers[215] | ||||||
Renesas[216] | Renesas Semiconductor (Beijing) Co., Ltd. | China, Haidian District, Beijing 100085 | |||||||
Renesas[216] | Renesas Semiconductor (Suzhou) Co., Ltd. | China, No.176, Zhongxin Avenue West, Suzhou Industrial Park, Suzhou 215021 | |||||||
Renesas[216] | Renesas Semiconductor (Malaysia) Sdn. Bhd. | Malaysia, Bayan Lepas Free Industrial Zone, 11900 Penang | |||||||
Renesas[216] | Renesas Semiconductor (Kedah) Sdn. Bhd. | Malaysia, Kulim Industrial Estate, 09000 Kulim, Kedah | |||||||
Renesas[216] | Renesas Semiconductor KL Sdn. Bhd. | Malaysia, KM 15, Jalan Banting, 42500 Telok Panglima Garang, Selangor Darul Ehsan | |||||||
Renesas[216] | Renesas Semiconductor Manufacturing Co., Ltd. | Japan, 751, Horiguchi, Hitachinaka-shi, Ibaraki, 312-8504 | |||||||
Renesas-Intersil[216] | 1 Murphy Ranch Rd | USA, CA, Milpitas | |||||||
LG Innotek[217] | Paju | South Korea, 570, Hyuam-ro, Munsan-eup, Paju-si, Gyeonggi-do, 10842 | LED Epi-wafer, Chip, Package | ||||||
Macronix[218] | Fab 5 | 300 | 50,000 | ||||||
Macronix[218] | Fab 2 | 200 | 48,000 | ||||||
Macronix[218] | Fab 1 | 150 | 40,000 | ||||||
Nuvoton[219] | Fab2 | Taiwan | 150 | 350-1000 nm | 45,000[219] | Generic Logic, Mixed Signal (Mixed Mode), High Voltage, Ultra High Voltage, Power Management, Mask ROM (Flat Cell), Embedded Logic, Non-Volatile Memory, IGBT, MOSFET, Biochip, TVS, Sensor | |||
Nuvoton | Nuvoton Technology Corporation | Taiwan, No. 4, Creation Rd. III, Hsinchu Science Park | |||||||
Mitsumi Electric[220] | Semiconductor Works #3 | Japan, Atsugi Operation Base | 2000 | ||||||
Mitsumi Electric[220] | Japan, Atsugi Operation Base | 1979 | |||||||
Rohm[221] | Shiga Factory | Japan | 200 | 150 | IGBT, MOSFET, MEMS | ||||
Rohm (Lapis Semiconductor)(formerly Oki Semiconductor)(Oki Electric Industry)[221][222] | Miyasaki | Japan | 150 | MEMS | |||||
Rohm (Lapis Semiconductor)[221] | Building No.1 | Japan | 1961[223] | Transistors | |||||
Rohm (Lapis Semiconductor)[221] | Building No.2 | Japan | 1962[223] | Transistors | |||||
Rohm (Lapis Semiconductor)[221] | Building No.3 | Japan | 1962[223] | Transistors | |||||
Rohm (Lapis Semiconductor)[221] | Building No.4 | Japan | 1969[223] | Transistors | |||||
Rohm (Lapis Semiconductor)[221] | Chichibu Plant | Japan | 1975[223] | DRAM | |||||
Rohm (Lapis Semiconductor)[221] | VLSI Laboratory No. 1 | Japan | 1977[223] | VLSI | |||||
Rohm (Lapis Semiconductor)[221] | VLSI Laboratory No. 2 | Japan | 1983[223] | ||||||
Rohm (Lapis Semiconductor)[221] | VLSI Laboratory No. 3 | Japan | 1983[223] | DRAM | |||||
Rohm (Lapis Semiconductor)[221] | Oregon Plant | USA, OR | 1990[223] | ||||||
Rohm (Lapis Semiconductor)[221] | Thailand | Thailand | 1992[223] | ||||||
Rohm (Lapis Semiconductor)[221] | ULSI Laboratory No. 1 | Japan | 1992[223] | 500 | DRAM | ||||
Rohm (Kionix)[224] | Ithaca | USA, NY, Ithaca | 150 | MEMS | |||||
Rohm (Kionix)[224] | Kyoto | Japan, Kyoto | 200 | MEMS | |||||
Fuji Electric[225] | Omachi | Japan, Nagano Prefecture | |||||||
Fuji Electric[226] | Iyama | Japan, Nagano Prefecture | |||||||
Fuji Electric[227] | Hokuriku | Japan, Toyama prefecture | |||||||
Fuji Electric[228] | Matsumoto | Japan, Nagano prefecture | |||||||
Murata Manufacturing[229] | Nagano[230] | Japan | 0.100 | SAW filters[230] | |||||
Murata Manufacturing[229] | Otsuki[230] | Japan | |||||||
Murata Manufacturing[229] | Kanazawa | Japan | 0.111 | SAW filters[230] | |||||
Murata Manufacturing (formerly Fujifilm)[231][232] | Sendai | Japan, Miyagi Prefecture | 0.092[230] | MEMS[233] | |||||
Murata Manufacturing[231] | Yamanashi | Japan, Yamanashi Prefecture | |||||||
Murata Manufacturing[234] | Yasu | Japan, Yasu, Shiga Prefecture | |||||||
Olympus Corporation[235] | Nagano | Japan, Nagano Prefecture | MEMS[236] | ||||||
Micron Semiconductor Ltd.[237] | Lancing | UK, West Sussex, Lancing | Detectors | ||||||
D-Wave Systems[238] | Superconducting Foundry[239] | Quantum Processing Units (QPUs)[239] | |||||||
Mitsubishi Electric[240] | Power Device Works, Kunamoto Site | Japan | Power semiconductors | ||||||
Mitsubishi Electric[240] | Power Device Works, Fukuoka Site | Japan, Kunamoto Prefecture, Fukuoka City[241] | Power semiconductors and sensors[241] | ||||||
Mitsubishi Electric[242] | High frequency optical device manufacturing plant | Japan, Hyogo Prefecture[242] | High frequency semiconductor devices (GaAsFET, GaN, MMIC)[242] | ||||||
SiSemi[243] | China, Shenzhen, Longgang High-tech Industrial Park[244] | 130 | Power semiconductors, LED drivers, bipolar power transistors, power MOSFETs | ||||||
SiSemi[244] | 100 | Transistors | |||||||
Xinxin (XMC)[78] | F1 | China, Wuhan | 300 | 20,000 | |||||
Huali[78][245] | F1 | China, Shanghai | 300 | 193, 55, 40, 28[246] | 35,000 | Foundry | |||
Huali[78] | F2 | China, Shanghai | Under construction | 300 | 40,000 | ||||
Nexchip[78] | N1[247] | China, Hefei | Q4 2017 | 300 | 40,000 | Display Drivers IC[248] | |||
Nexchip[78] | N2[247] | China, Hefei | Under construction | 300 | 40,000 | ||||
Nexchip[78] | N3[247] | China, Hefei | Under construction | 300 | 40,000 | ||||
Nexchip[78] | N4[247] | China, Hefei | Under construction | 300 | 40,000 | ||||
Wuhan Hongxin Semiconductor Manufacturing (HSMC)[249] | China, Wuhan | 2019 | 300 | 14, 7 | Foundry | ||||
Jinhua(Fujian Jinhua Integrated Circuit Co., Ltd.)(JHICC)[250] | China, Jinjiang | 5.65[251] | 2018 | 300 | DRAM[252] | ||||
Jinhua[78][253] | F2 | China, Quanzhou | Under construction | 300 | 60,000 | ||||
United Chip[78] | Fab 12x | China, Xiamen | Under construction | 300 | 50,000 | ||||
Uni Group[78] | SZ | China, Shenzhen | Under construction | 300 | 50,000 | ||||
Xinxin (XMC)[78] | F2 | China, Wuhan | Under construction | 300 | 200,000 | ||||
Decoma[78] | F2 | China, Huaian | Under construction | 300 | 20,000 | ||||
Wandai[78] | CQ | China, Chongqing | Under construction | 300 | 20,000 | ||||
Cree Inc.[254] | Durham | USA, NC, Durham | Compound Semiconductors, LEDs | ||||||
Cree Inc.[255] | Research Triangle Park | USA, NC | GaN HEMT RF ICs | ||||||
Renesas (formerly NEC Electronics) (formerly NEC) | Roseville[256][257] | USA, CA, Roseville | 1.2[258] | 2002, April | 200 | RAM, SoCs, Multimedia Chips | |||
Denso (formerly Fujitsu)[259] | Denso Iwate[260][261][262] | Japan, Iwate Prefecture, Kanegasaki-cho | 0.088 | Under construction, 2019, May (planned) | Semiconductor wafers and sensors (since June 2017) | ||||
Rigetti Computing | Fab-1[263][264][265] | USA, CA, Fremont | 130 | Quantum Processors | |||||
Flir Systems | USA, CA, Santa Barbara[266] | 150 | IR Detectors, Thermal Imaging Sensors | ||||||
Rogue Valley Microdevices | USA, OR, Medford | 2003 | 150 | MEMS foundry | |||||
New Japan Radio | Kawagoe Works | Japan, Saitama Prefecture, Fujimino City[267][268] | 1959[105] | 100, 150 | 4000, 400, 350 | Bipolar, Mixed Signal, Analog, Hi Speed BiCMOS, BCD, 40V Hi Speed Complementary Bipolar, Analog CMOS+HV,
SAW Filters[269] | |||
New Japan Radio | Saga Electronics[270] | Japan, Saga Prefecture | 100, 150 | 4000, 400, 350[271] | Foundry, Bipolar, Mixed Signal, Analog, Hi Speed BiCMOS, BCD, 40V Hi Speed Complementary Bipolar, Analog CMOS+HV,
SAW Filters[269] | ||||
New Japan Radio | NJR FUKUOKA | Japan, Fukuoka Prefecture, Fukuoka City[270] | 2003[272] | 100, 150 | Bipolar, Analog ICs, MOSFETs LSI, BiCMOS ICs | ||||
New Japan Radio | Japan, Nagano, Nagano City[273] | ||||||||
New Japan Radio | Japan, Nagano, Ueda City[273] | ||||||||
ABB[274] | Lenzburg | Switzerland, Lenzburg | 0.140 | 2010 (second phase) | 18,750 (225,000 per year) | High power semiconductors | |||
Noel Technologies[275] | 450-51[276][275] | 500-250[277] | |||||||
Skyworks Solutions[278] | USA, CA | Compound Semiconductors | |||||||
Skyworks Solutions[278] | Japan, Osaka | SAW, TC-SAW Filters | |||||||
Skyworks Solutions[278] | USA, MA, Woburn | RF/cellular components (SiGe) | |||||||
Skyworks Solutions[278] | Japan, Kadoma | SAW, TC-SAW Filters | |||||||
Skyworks Solutions[278] | Singapore, Bedok South Road | SAW, TC-SAW Filters | |||||||
Seiko Instruments[279] | China, Shanghai | ||||||||
Seiko Instruments[279] | Japan, Akita | ||||||||
Seiko Instruments[279] | Japan, Takatsuka | ||||||||
Lite-On Optoelectronics[280] | China, Tianjin | ||||||||
Lite-On Optoelectronics[280] | Thailand, Bangkok | ||||||||
Lite-On Optoelectronics[280] | China, Jiangsu | ||||||||
Lite-On Semiconductor[281] | Keelung Plant | Taiwan, Keelung | 1990 | 100 | Thystors, DIscrete | ||||
Lite-On Semiconductor[281] | Hsinchu Plant | Taiwan, Hsinchu | 2005 | Bipolar BCD, CMOS | |||||
Lite-On Semiconductor[281] | Lite-On Semi (Wuxi) | China, Jiangsu | 2004 | 100 | Discrete | ||||
Lite-On Semiconductor[281] | Wuxi WMEC Plant | China, Jiangsu | 2005 | Discrete, Power, Optical ICs | |||||
Lite-On Semiconductor[281] | Shanghai (SSEC) Plant | China, Shanghai | 1993 | 76 | Fab, Assembly | ||||
Creative Sensor Inc.[282][283] | NanChang Creative Sensor | China, Jiangxi | 2007 | Image Sensors | |||||
Creative Sensor Inc.[282] | Wuxi Creative Sensor | China, JiangSu | 2002 | ||||||
Creative Sensor Inc.[282] | Wuxi Creative Sensor | Taiwan, Taipei City | 1998 | ||||||
Visera Technologies[284] | Headquarters Phase I | Taiwan, Hsinchu Science-based Industrial Park | 2007, September | CMOS Image Sensors | |||||
Kodenshi AUK Group[285] | Silicon FAB Line | ||||||||
Kodenshi AUK Group[285] | Compound FAB Line | ||||||||
Shindengen Electric Manufacturing[286] | Philippines, Laguna | ||||||||
Shindengen Electric Manufacturing[286] | Thailand, Lumphun | ||||||||
ABB[274] | Czech Republic | ||||||||
Philips[287] | Netherlands, Eindhoven | 200,150 | 30,000 | R&D, MEMS | |||||
Trumpf[288] | Germany, Ulm | VCSEL | |||||||
nanoPHAB | Netherlands, Eindhoven | 50-100 | 10-50 | 2-10 | MEMS | ||||
Epistar | Fab F1[289] | Taiwan, Longtan Science Park | LEDs | ||||||
Epistar | Fab A1[289] | Taiwan, Hsinchu Science Park | LEDs | ||||||
Epistar | Fab N2[289] | Taiwan, Hsinchu Science Park | LEDs | ||||||
Epistar | Fab N8[289] | Taiwan, Hsinchu Science Park | LEDs | ||||||
Epistar | Fab N1[289] | Taiwan, Hsinchu Science Park | LEDs | ||||||
Epistar | Fab N3[289] | Taiwan, Hsinchu Science Park | LEDs | ||||||
Epistar | Fab N6[289] | Taiwan, Chunan Science Park | LEDs | ||||||
Epistar | Fab N9[289] | Taiwan, Chunan Science Park | LEDs | ||||||
Epistar | Fab H1[289] | Taiwan, Central Taiwan Science Park | LEDs | ||||||
Epistar | Fab S1[289] | Taiwan, Tainan Science Park | LEDs | ||||||
Epistar | Fab S3[289] | Taiwan, Tainan Science Park | LEDs | ||||||
Nichia | YOKOHAMA TECHNOLOGY CENTER[290] | Japan, KANAGAWA | LEDs | ||||||
Nichia | SUWA TECHNOLOGY CENTER[290] | Japan, NAGANO | LEDs | ||||||
San'an Optoelectronics | Tianjin San’an Optoelectronics Co., Ltd. | China, Tianjin | LEDs | ||||||
San'an Optoelectronics | Xiamen San’an Optoelectronics Technology Co., Ltd. | China | LEDs | ||||||
San'an Optoelectronics | Xiamen San’an Integrated Circuit | China | ICs | ||||||
San'an Optoelectronics | Xiamen San’an Optoelectronics Co., Ltd. | China | LEDs | ||||||
San'an Optoelectronics | Fujian Jing’an Optoelectronics Co., Ltd. | China | LEDs | ||||||
San'an Optoelectronics | Wuhu Anrui Optoelectronics Co., Ltd. | China | LEDs | ||||||
San'an Optoelectronics | Anrui San'an Optoelectronics Co., Ltd. | China | LEDs | ||||||
San'an Optoelectronics | Anrui San'an Technology Co., Ltd. | China | LEDs | ||||||
San'an Optoelectronics | Luminus Summary | USA | LEDs | ||||||
Lextar | T01 | Taiwan, Hsinchu Science Park | LEDs | ||||||
Everlight | Yuan-Li Plant | Taiwan, Miao-Li | LEDs | ||||||
Everlight | Pan-Yu Plant | China | LEDs | ||||||
Everlight | Tu-Cheng Plant | Taiwan, Taipei Country | LEDs | ||||||
Osram (Osram Opto Semiconductors) | Malaysia, Kulim, Kulim Hi-Tech Park | 0.350, 1.18[291] | 2017, 2020 (second phase, planned)[292][293] | 150 | LEDs | ||||
Osram (Osram Opto Semiconductors) | Malaysia, Penang[294][295] | 2009 | 100 | LEDs | |||||
Osram (Osram Opto Semiconductors) | Germany, Regensburg[296] | 2003, 2005 (second phase)[297] | LEDs | ||||||
HHGrace | China, Zhangjiang | 200 | 1000-90 | 53,000 | eNVM, RF, Mixed Signal, Logic, Power Management, Power Discrete | ||||
HHGrace | China, Jinqiao | 200 | 1000-90 | 53,000 | eNVM, RF, Mixed Signal, Logic, Power Management, Power Discrete | ||||
HHGrace | China, Shanghai | 200 | 1000-90 | 53,000 | eNVM, RF, Mixed Signal, Logic, Power Management, Power Discrete | ||||
CRMicro (formerly CSMC) | Fab 1 | 1998[38] | 150[298] | 60,000[38] | HV Analog, MEMS, Power, Analog, Foundry | ||||
CRMicro (formerly CSMC) | Fab 2 | 2008[38] | 200[298] | 130 | 30,000[38] | HV Analog, Foundry | |||
CRMicro (formerly CSMC) | Fab 3 | 1995[38] | 200[298] | 130 | 20,000[38] | ||||
CRMicro (formerly CSMC) | Fab 5 | 2005[38] | 30,000[38] | ||||||
Diodes Incorporated (formerly BCD Semi)[299] | China | 150 | 4000-1000 | ||||||
HeJian | China | 1.2 | 2003, May | 200 | 4000-1000 | 60,000 | Foundry | ||
AKM Semiconductor, Inc. | FAB1 | Japan, Nobeoka | Sensors | ||||||
AKM Semiconductor, Inc. | FAB2 | Japan, Nobeoka | |||||||
AKM Semiconductor, Inc. | FAB3 | Japan, Fuji | Sensors | ||||||
AKM Semiconductor, Inc. | FAB FP | Japan, Hyuga | |||||||
AKM Semiconductor, Inc. | FAB5 | Japan, Ishinomaki | LSI | ||||||
Broadcom Limited | USA, CO, Fort Collins[300] | ||||||||
Pyongyang Semiconductor Factory | 111 Factory | North Korea, Pyongyang | 1980s | 3000[301] | |||||
Kim Il-sung Fab[301] | Il-sung | North Korea, Pyongyang | 1965s | 76 | 14/22[301] | 25000-55000 | OLEDs, Sensors, DRAM, SRAM, CMOS, Photodiodes, IGBT, MOSFET, MEMS | ||
NEC[105] | 100, 130, 150 | SRAM, DRAM | |||||||
NEC[302] | Japan | DRAM | |||||||
NEWPORT WAFER FAB [303] | FAB11 | Newport, Wales, UK | 200 [304] | 180-700 [304] | 32,000 [304] | Compound Semiconductors, IC, MOSFET, IGBT [305] | |||
NIPPON PRECISION CIRCUITS[105] | Digital | ||||||||
NKK JFE Holdings[105] | 200 | 6000 | , | ||||||
NMB SEMICONDUCTOR[105] | DRAM | ||||||||
NORTHERN TELECOM SEMICONDUCTOR
HERN TELECOM EUROPE[105] |
Semiconductor Lasers, Photodiodes | ||||||||
NORTHERN TELECOM SEMICONDUCTOR[105] | 100, 150 | NMOS, CMOS | |||||||
Oki Electric Industry[105] | Japan, Tokyo, Minato-ku | 1961 | 100, 150, 130, 76 | 7,200 | Bipolar, Mask ROM | ||||
Oki Electric Industry[105] | Miyazaki Oki Electric Co | 1981 | 100, 150, 130, 76 | 3000 | 7,200 | Bipolar, Mask ROM, DRAM[223] | |||
Oki Electric Industry[105] | Miyagi Facility | 1988[223] | 100, 150, 130, 76 | 7,200 | Bipolar, Mask ROM | ||||
Oki Electric Industry[105] | Hachioji Facility | 100, 150, 130, 76 | 7,200 | Bipolar, Mask ROM | |||||
Oki Electric Industry[306] | 150 | 180-150 | SOCs, LSI, Logic, Memory | ||||||
Optek Technology[105] | 1968 | 100, 150 | GaAs, LEDs | ||||||
Orbit Semiconductor[105] | 100 | CCD, CMOS | |||||||
APT Electronics | China, Guangzhou[38] | 2006[38] | |||||||
Aqualite | China, Wuhan[38] | 2008[38] | |||||||
Arima Optoelectronics | Taiwan, Hsinchu[38] | 1999[38] | |||||||
Aqualite | China, Guangzhou[38] | 2006[38] | |||||||
AWSC | Taiwan, Tainan[38] | 1999[38] | |||||||
BAE Systems | USA, NH, Nashua[38] | 1985[38] | MMIC | ||||||
Entrepix | USA, AZ, Tempe[38] | 2003[38] | |||||||
CSTG | UK, Glasgow[38][307] | 2003[38] | |||||||
Episil Semiconductor | Taiwan, Hsinchu[38] | 1992, 1990, 1988[38] | |||||||
GCS | USA, CA, Torrance[38] | 1999[38] | |||||||
Medtronic | USA, AZ, Tempe[38] | 1973[38] | |||||||
MIMOS Semiconductor | Malaysia, Kuala Lumpur[38] | 0.006, 0.135 | 1997, 2002[38] | ||||||
Skorpios Technologies | USA, TX, Austin[38][308] | 0.065 | 1989[38] | ||||||
Episil Semiconductor | Taiwan, Hsinchu[38] | 1992, 1990, 1988[38] | |||||||
Panjit | Taiwan, Kaohsiung[38] | 0.1 | 2003[38] | ||||||
Photonix | UK, Glasgow[38] | 0.011 | 2000[38] | ||||||
Plessey | UK, Swindon[38] | ||||||||
SensFab | Singapore[38] | 1995[38] | |||||||
Silanna | Australia, Sydney Olympic Park[38] | 0.030 | 1965,1989[38] | ||||||
Silex Microsystems | Sweden, Jarfalla[38] | 0.009, 0.032 | 2003, 2009[38] | ||||||
Technologies and Devices International | USA, FL, Silver Springs[38] | 2002[38] | |||||||
Win Semiconductor | Taiwan, Taoyuan[38] | 0.050, 0.178 | 2000, 2009[38] | ||||||
Xiamen Jaysun Semiconductor Manufacturing | Fab 101 | China, Xiamen[38] | 0.035 | 2011[38] | |||||
Xiyue Electronics Technology | Fab 1 | China, Xian[38] | 0.096 | 2007[38] | |||||
XMC | Fab 1 | China, Wuhan[38] | 1.9 | 2008[38] | 20,000[309] | ||||
DongbuHiTek | Fab 1 | South Korea, Bucheon[38] | 1997[38] | ||||||
DongbuHiTek | Fab 2 | South Korea, Eumsung-Kun[38] | 2001[38] | ||||||
DongbuHiTek | Fab 2 Module 2 | South Korea, Eumsung-Kun[38] | |||||||
XMC[309] | XMC Fab | 2018[38] | 200,000 | ||||||
Win Semiconductor | Fab A[310] | Taiwan, Taoyuan City | 150[311] | 2000-10 | |||||
Win Semiconductor | Fab B[310] | Taiwan, Taoyuan City | 150[311] | 2000-10 | |||||
Integrated Device Technology | USA, OR, Hillsboro | 1997 | 200 | 140-100[312] | |||||
Innovative Ion Implant | UK | 51-300[313] | |||||||
Innovative Ion Implant | France | 51-300[313] | |||||||
Olympus | Japan | MEMS[314] | |||||||
Opto Diode | USA[315] | ||||||||
Nanosystem Fabrication Facility | Hong Kong[316] | ||||||||
Data General | USA, CA, Sunnyvale[317] | ||||||||
HuaLei Optoelectronic | China | LEDs[318] | |||||||
ChangXin Memory | China | DRAM[319] | |||||||
Tsinghua Unigroup[252] | China, Nanjing | 30 | 2018 | 300 | 3D NAND Flash | ||||
Tsinghua Unigroup[252] | China, Chengdu | 28 | Planned | 300 | 500,000 | Foundry | |||
Sino King Technology[252] | China, Hefei | 2017 | DRAM | ||||||
Yangtze Memory Technologies Co., Ltd. (YMTC)[252] | China, Wuhan | 24 | 2019 | 300,000 | 3D NAND | ||||
Qorvo | USA, Greensboro[320] | ||||||||
Qorvo | USA, Apopka[320][321] | ||||||||
Qorvo | USA, Richardson[320] | ||||||||
Qorvo | USA, Hillsboro[320] | ||||||||
United Monolithic Semiconductors[322] | Germany, Ulm | Foundry | |||||||
United Monolithic Semiconductors[322] | France, Yvette | Foundry | |||||||
Peregrine Semiconductor | Australia, Sydney | CMOS | |||||||
Seagate | USA, MN[324] | ||||||||
Seagate | Northern Ireland[325][326][327][328] | ||||||||
Infinera | USA, CA[329][330] | ||||||||
Soraa Inc | USA, CA[331][332] | ||||||||
Soraa Laser Diode[331] | |||||||||
Western Digital[333][334] | |||||||||
TDK | Tsuruoka Higashi[335][336] | 125[230] | |||||||
TDK | Japan, Saku[337] | ||||||||
Tronics | USA, TX, Addison[338] | ||||||||
Taiyo Yuden | Japan, Nagano | SAW devices[230] | |||||||
Taiyo Yuden | Japan, Ome | SAW devices[230] | |||||||
Kyocera | SAW devices[230] | ||||||||
IXYS | Germany | IGBT[339] | |||||||
IXYS | UK[339] | ||||||||
IXYS | USA, MA[339] | ||||||||
IXYS | USA, CA[339] | ||||||||
Mirrorcle Technologies | USA, CA[340] | ||||||||
Crocus Nano Electronics | CNE | Russia, Moscow | 2015 | 300 | 65 | 4000 | MRAM, RRAM, MEMS, IPD, TMR, GMR Sensors | ||
Panasonic[341] | Brazil | 0.9 | |||||||
Optotech[342] | Taiwan, Hsinchu | LEDs | |||||||
OptoTeltronics Sp. z o.o. | Poland, Gdynia | 1.3[38] | 1990[38] | 200 | 65–200 | 45,000[38] | |||
Sharp Corporation | Fukuyama[343] | Japan | |||||||
Canon Inc. | Oita[344] | Japan | |||||||
Canon Inc. | Kanagawa[345] | Japan | |||||||
Canon Inc. | Ayase[344] | Japan | |||||||
Japan Semiconductor | Iwate | Japan | |||||||
Japan Semiconductor[346] | Oita | Japan | |||||||
San'an[347] | China, Xiamen | Foundry, GaN, Power, RF | |||||||
Elmos Semiconductor | Germany, Dortmund[348] | 1984 | 200 | 800, 350 | 9000 | HV-CMOS |
(NOTE: Some fabs located in Asia don't use the number 4, or any 2 digit number that adds up to 4, because it is considered bad luck; see tetraphobia.)
Closed
Defunct fabs include:
Company | Plant Name | Plant Location | Plant Cost (in US$ Billions) | Started Production | Wafer Size (mm) | Process Technology Node (nm) | Production Capacity (Wafers/Month) | Technology / Products | Ended Production |
---|---|---|---|---|---|---|---|---|---|
Agere (formerly Lucent, formerly AT&T)[349] | Spain, Madrid, Tres Cantos | 0.67[350] | 1987[351] | 300, 350, 500 | CMOS | 2001 | |||
EI Niš | Ei Poluprovodnici | Serbia, Niš | 1962 | 100 | 2000 | ||||
Fairchild Semiconductor (formerly National Semiconductor) | West Jordan | USA, UT, West Jordan | 1977 | 150 | 2015[352] | ||||
NEC | Livingston[353] | Scotland, West Lothian, Livingston | April 2001 | ||||||
Freescale Semiconductor | Toulouse Fab[354] | France, Toulouse | 1969 | 150 | 650 | 2012[355] | |||
Freescale Semiconductor | Sendai Fab[356] | Japan, Sendai | 1987 | 150 | 500 | 2009? | |||
Hynix | E-4 | USA, OR, Eugene | 1.3 | 2007 | 200 | 30,000 | 2008[357] | ||
Intel | Fab D2 | USA, CA, Santa Clara | 1989 | 200 | 130 | 8,000 | Microprocessors, Chipsets, Flash memory | 2009 | |
Intel | Fab 8[17] | Israel, Jerusalem | 1985 | 150 | Microprocessors, Chipsets, Microcontrollers[18] | 2007 | |||
Intel | Fab 17[10][9] | USA, MA, Hudson | 1998 | 200 | 130 | Chipsets and other[9] | 2014 | ||
LFoundry (formerly Renesas Electronics)[358] | Germany, Landshut | 1992 | 200 | 2011 | |||||
LFoundry (formerly Atmel)[359] | France, Rousset | ? | 200 | 25.000[360] | 2014 | ||||
MOS Technology, Commodore Semiconductor, GMT Microelectronics |
USA, PA, Audubon | 1969 1976 1995 |
1000 | 1976 1992[361] 2001 | |||||
Texas Instruments | HFAB | USA, TX, Houston | 1967 | 150 | 2013[362] | ||||
Texas Instruments (formerly National Semiconductor) | Arlington | USA, TX, Arlington | 1985 | 150 | 80000, 35000 | 2010 | |||
Texas Instruments (formerly Silicon Systems) | Santa Cruz | USA, CA Santa Cruz | 0.250 | 1980 | 150 | 800 | 80,000 | HDD | 2001 |
TowerJazz | Fab 4[184] | Japan, Nishiwaki City | 0.450[38] | 1992[38] | 60,000[38] | ? | |||
Qimonda | Richmond[363] | USA, VA, Richmond | 300 | January, 2009 | |||||
Kioxia | Fab 1 (at Yokkaichi Operations)[364] | Japan, Yokkaichi | 1992 | September, 2001 | |||||
TSMC | Fab 1[68] | Taiwan, Hsinchu | 1987 | 20,000 | March 9, 2001 | ||||
Unknown (fortune 500 company) | USA, East Coast[365] | 150 | 1,600 | MEMS | 2016 | ||||
Integrated Device Technology | USA, California, Salinas | 1985 | 150 | 350-800[312] | 2002 | ||||
NXP Semiconductors (formerly Mullard) | Southampton | UK, Hazel Grove, Stockport | |||||||
Soviet Union | Jupiter | Pripiat, Kiev, Ukraine | 1980 | Secret government semiconductor fab closed by Chernobyl disaster | 1996 | ||||
Diodes Incorporated | KFAB | USA, MO, Lee's Summit | 1994[366] | 2017[367] |
See also
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External links
- The IC Foundry Almanac. 2009 edition. Section III: IC Foundry providers // IC Insights, Global Semiconductor Alliance, 2009
- Memory and Foundry Account For More Than Half of Worldwide IC Capacity // IC Insights, Global Semiconductor Alliance, 2013-07-09
- SEMI World Fab Forecast 2013 // SEMI, 2013