List of integrated circuit packaging types

Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers.

A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.

Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.

Through-hole packages

Through-hole technology uses holes drilled through the PCB for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.

Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
AcronymFull nameRemark
SIPSingle in-line package
DIPDual in-line package0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) or 0.6 in (15.24 mm) apart.
CDIPCeramic DIP[1]
CERDIPGlass-sealed ceramic DIP[1]
QIPQuadruple in-line packageLike DIP but with staggered (zig-zag) pins.[1]
SKDIPSkinny DIPStandard DIP with 0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) apart.[1]
SDIPShrink DIPNon-standard DIP with smaller 0.07 in (1.78 mm) pin spacing.[1]
ZIPZig-zag in-line package
MDIPMolded DIP[2]
PDIPPlastic DIP[1]

Surface mount
AcronymFull nameRemark
CCGACeramic column-grid array (CGA)[3]
CGAColumn-grid array[3]Example
CERPACKCeramic package[4]
CQGP[5]
LLPLead-less lead-frame packageA package with metric pin distribution (0.5–0.8 mm pitch)[6]
LGALand grid array[3]
LTCCLow-temperature co-fired ceramic[7]
MCMMulti-chip module[8]
MICRO SMDXTMicro surface-mount device extended technology[9]Example

Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame.

Chip carrier

A chip carrier is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.

AcronymFull nameRemark
BCCBump chip carrier[3]-
CLCCCeramic lead-less chip carrier[1]-
LCCLead-less chip carrier[3]Contacts are recessed vertically.
LCCLeaded chip carrier[3]-
LCCCLeaded ceramic-chip carrier[3]-
DLCCDual lead-less chip carrier (ceramic)[3]-
PLCCPlastic leaded chip carrier[1][3]-

Pin grid arrays
Main article: Pin grid array
AcronymFull nameRemark
OPGAOrganic pin-grid array-
FCPGAFlip-chip pin-grid array[3]-
PACPin array cartridge[10]-
PGAPin-grid arrayAlso known as PPGA[1]
CPGACeramic pin-grid array[3]-

Flat packages
Main article: Quad Flat Package
AcronymFull nameRemark
-Flat-packEarliest version metal/ceramic packaging with flat leads
CFPCeramic flat-pack[3]-
CQFPCeramic quad flat-pack[1][3]Similar to PQFP
BQFPBumpered quad flat-pack[3]-
DFNDual flat-packNo lead[3]
ETQFPExposed thin quad flat-package[11]-
PQFNPower quad flat-packNo-leads, with exposed die-pad[s] for heatsinking[12]
PQFPPlastic quad flat-package[1][3]-
LQFPLow-profile quad flat-package[3]-
QFNQuad flat no-leads packageAlso called as micro lead frame (MLF).[3][13]
QFPQuad flat package[1][3]-
MQFPMetric quad flat-packQFP with metric pin distribution[3]
HVQFNHeat-sink very-thin quad flat-pack, no-leads-
SIDEBRAZE[14][15]
TQFPThin quad flat-pack[1][3]-
VQFPVery-thin quad flat-pack[3]-
TQFNThin quad flat, no-lead-
VQFNVery-thin quad flat, no-lead-
WQFNVery-very-thin quad flat, no-lead-
UQFNUltra-thin quad flat-pack, no-lead-
ODFNOptical dual flat, no-leadIC packaged in transparent packaging used in optical sensor

Small outline packages
AcronymFull nameRemark
SOPSmall-outline package[1]
CSOPCeramic small-outline package
DSOP Dual small-outline package
HSOP Thermally-enhanced small-outline package
mini-SOICMini small-outline integrated circuit
MSOPMini small-outline package
PSOPPlastic small-outline package[3]
PSONPlastic small-outline no-lead package
QSOPQuarter-size small-outline packageThe pin spacing are width of 0.635 mm.[3]
SOICSmall-outline integrated circuitAlso known as SOIC NARROW and SOIC WIDE
SOJSmall-outline J-leaded package
SON Small-outline no-lead package
SSOPShrink small-outline package[3]
TSOPThin small-outline package[3]Example
TSSOPThin shrink small-outline package[3]
TVSOPThin very-small-outline package[3]
µMAXSimilar to a SOIC. (A Maxim trademark example)
WSONVery-very-thin small-outline no-lead package
USONVery-very-thin small-outline no-lead packageSlightly smaller than WSON

Chip-scale packages
Example WL-CSP devices sitting on the face of a U.S. penny. A SOT-23 device is shown (top) for comparison.
AcronymFull nameRemark
BL Beam lead technology Bare silicon chip, an early chip-scale package
CSPChip-scale packagePackage size is no more than 1.2× the size of the silicon chip[16][17]
TCSPTrue chip-size packagePackage is same size as silicon[18]
TDSPTrue die-size packageSame as TCSP[18]
WCSP or WL-CSP or WLCSPWafer-level chip-scale package A WL-CSP or WLCSP package is just a bare Die with a redistribution layer (or I/O pitch) to rearrange the pins or contacts on the die so that they can be big enough and have sufficient spacing so that they can be handled just like a BGA package.[19]
PMCPPower Mount CSP (Chip Scale Package)Variation of WLCSP, for power devices like MOSFETs. Made by Panasonic. [20]
Fan-out WLCSPFan-out wafer-level packagingVariation of WLCSP. Like a BGA package but with the interposer built directly atop the die and encapsulated along the rest of the chip.
eWLBEmbedded Wafer Level Ball Grid ArrayVariation of WLCSP.
MICRO SMD-Chip-size package (CSP) developed by National Semiconductor[21]
COBChip-on-boardBare silicon chip, that is usually an integrated circuit, is supplied without a package. It can often be identified by having a blob of black Epoxy instead of a square package. Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may containin a phosphor is poured into a mold containing the LED and cured. The mold forms part of the package.
COFChip-on-flexVariation of COB, where a chip is mounted directly to a flex circuit.
TABTape-automated bondingVariation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires.
COGChip-on-glassVariation of COB, where a chip is mounted directly to a piece of glass - typically an LCD. Used by LCD and OLED driver ICs.

Ball grid array
Main article: Ball grid array

Ball Grid Array BGA uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.[1][3]

AcronymFull nameRemark
FBGAFine-pitch ball-grid arrayA square or rectangular array of solder balls on one surface[3]
LBGALow-profile ball-grid arrayAlso known as laminate ball-grid array[3]
TEPBGAThermally-enhanced plastic ball-grid array-
CBGACeramic ball-grid array[3]-
OBGAOrganic ball-grid array[3]-
TFBGAThin fine-pitch ball-grid array[3]-
PBGAPlastic ball-grid array[3]-
MAP-BGAMold array process - ball-grid array -
UCSPMicro (μ) chip-scale packageSimilar to a BGA (A Maxim trademark example)[17]
μBGAMicro ball-grid arrayBall spacing less than 1 mm
LFBGALow-profile fine-pitch ball-grid array[3]-
TBGAThin ball-grid array[3]-
SBGASuper ball-grid array[3]Above 500 balls
UFBGAUltra-fine ball-grid array[3]

Transistor, diode, small-pin-count IC packages
A drawing of a ZN414 IC in a TO-18 package
  • MELF: Metal electrode leadless face (usually for resistors and diodes)
  • SOD: Small-outline diode.
  • SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323).
  • TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes.
    • TO-3: Panel-mount with leads
    • TO-5: Metal can package with radial leads
    • TO-18: Metal can package with radial leads
    • TO-39
    • TO-46
    • TO-66: Similar shape to the TO-3 but smaller
    • TO-92: Plastic-encapsulated package with three leads
    • TO-99: Metal can package with eight radial leads
    • TO-100
    • TO-126: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
    • TO-220: Through-hole plastic package with a (usually) metal heat sink tab and three leads
    • TO-226[22]
    • TO-247:[23] Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
    • TO-251:[23] Also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting
    • TO-252:[23] (also called SOT428, DPAK):[23] SMT package similar to the DPAK but smaller
    • TO-262:[23] Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting
    • TO-263:[23] Also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole
    • TO-274:[23] Also called Super-247: SMT package similar to the TO-247 without the mounting hole

Dimension reference

Surface-mount
A general surface mount chip, with major dimensions.
C
Clearance between IC body and PCB
H
Total Height
T
Lead Thickness
L
Total carrier length
LW
Lead width
LL
Lead length
P
Pitch

Through-hole
A general through-hole pin chip, with major dimensions.
C
Clearance between IC body and board
H
Total height
T
Lead thickness
L
Total carrier length
LW
Lead width
LL
Lead length
P
Pitch
WB
IC body width
WL
Lead-to-lead width

Package dimensions

All measurements below are given in mm. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).

C
Clearance between package body and PCB.
H
Height of package from pin tip to top of package.
T
Thickness of pin.
L
Length of package body only.
LW
Pin width.
LL
Pin length from package to pin tip.
P
Pin pitch (distance between conductors to the PCB).
WB
Width of the package body only.
WL
Length from pin tip to pin tip on the opposite side.

Dual row
ImageFamilyPinNamePackageWBWLHCLPLLTLW
DIP Y Dual inline package 8-DIP6.2–6.487.627.79.2–9.82.54 (0.1 in)3.05–3.61.14–1.73
32-DIP15.242.54 (0.1 in)
LFCSPNLead-frame chip-scale package0.5
MSOP Y Mini small-outline package 8-MSOP34.91.10.1030.650.950.180.17–0.27
10-MSOP34.91.10.1030.50.950.180.17–0.27
16-MSOP34.91.10.104.040.50.950.180.17–0.27
SO
SOIC
SOP		 Y Small-outline integrated circuit 8-SOIC3.95.8–6.21.720.10–0.254.8–5.01.271.050.19–0.250.39–0.46
14-SOIC3.95.8–6.21.720.10–0.258.55–8.751.271.050.19–0.250.39–0.46
16-SOIC3.95.8–6.21.720.10–0.259.9–101.271.050.19–0.250.39–0.46
16-SOIC7.510.00–10.652.650.10–0.3010.1–10.51.271.40.23–0.320.38–0.40
SOTYSmall-outline transistorSOT-23-61.62.81.452.90.950.60.22–0.38
SSOPYShrink small-outline package0.65
TDFNNThin dual flat no-lead8-TDFN330.7–0.830.65N/A0.19–0.3
TSOPYThin small-outline package0.5
TSSOPYThin shrink small-outline package8-TSSOP4.46.41.20.1530.650.09–0.20.19–0.3
µSOPYMicro small-outline package[24]µSOP-84.91.130.65
US8[25]YUS8 package2.33.1.720.5

Quad rows
ImageFamilyPinNamePackageWBWLHCLPLLTLW
PLCCNPlastic leaded chip-carrier1.27
CLCCNCeramic leadless chip-carrier48-CLCC14.2214.222.2114.221.016N/A0.508
LQFPYLow-profile Quad Flat Package0.50
TQFPYThin quad flat-packageTQFP-4410.0012.000.35–0.500.801.000.09–0.200.30–0.45
TQFNNThin quad flat no-lead

LGA
Packagexyz
52-ULGA12 mm17 mm0.65 mm
52-ULGA14 mm18 mm0.10 mm
52-VELGA???

Multi-chip packages

A variety of techniques for interconnecting several chips within a single package have been proposed and researched:

By terminal count
Example of component sizes, metric and imperial codes and comparison included
Composite image of a 11×44 LED matrix lapel name tag display using 1608/0603-type SMD LEDs. Top: A little over half of the 21×86 mm display. Center: Close-up of LEDs in ambient light. Bottom: LEDs in their own red light.
SMD capacitors (on the left) with two through-hole capacitors (on the right)
Main article: Chip carrier

Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC).

The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008). Exceptions occur for imperial in the two smallest rectangular passive sizes. The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in),[27] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in × 0.0079 in) package. These increasingly small sizes, especially 0201 and 01005, can sometimes be a challenge from a manufacturability or reliability perspective.[28]

Two-terminal packages

Rectangular passive components

Mostly resistors and capacitors.

Package Approximate dimensions, length × width Typical resistor
power rating (W)
MetricImperial
02010080040.25 mm × 0.125 mm0.010 in × 0.005 in
030150090050.3 mm × 0.15 mm0.012 in × 0.006 in0.02[29]
0402010050.4 mm × 0.2 mm0.016 in × 0.008 in0.031[30]
060302010.6 mm × 0.3 mm0.02 in × 0.01 in0.05[30]
100504021.0 mm × 0.5 mm0.04 in × 0.02 in0.062[31]–0.1[30]
160806031.6 mm × 0.8 mm0.06 in × 0.03 in0.1[30]
201208052.0 mm × 1.25 mm0.08 in × 0.05 in0.125[30]
252010082.5 mm × 2.0 mm0.10 in × 0.08 in
321612063.2 mm × 1.6 mm0.125 in × 0.06 in0.25[30]
322512103.2 mm × 2.5 mm0.125 in × 0.10 in0.5[30]
451618064.5 mm × 1.6 mm0.18 in × 0.06 in[32]
453218124.5 mm × 3.2 mm0.18 in × 0.125 in0.75[30]
456418254.5 mm × 6.4 mm0.18 in × 0.25 in0.75[30]
502520105.0 mm × 2.5 mm0.20 in × 0.10 in0.75[30]
633225126.3 mm × 3.2 mm0.25 in × 0.125 in1[30]
686327256.9 mm × 6.3 mm0.27 in × 0.25 in3
745129207.4 mm × 5.1 mm0.29 in × 0.20 in[33]

Tantalum capacitors[34][35]
PackageDimensions (Length, typ. × width, typ. × height, max.)
EIA 2012-12 (KEMET R, AVX R)2.0 mm × 1.3 mm × 1.2 mm
EIA 3216-10 (KEMET I, AVX K)3.2 mm × 1.6 mm × 1.0 mm
EIA 3216-12 (KEMET S, AVX S)3.2 mm × 1.6 mm × 1.2 mm
EIA 3216-18 (KEMET A, AVX A)3.2 mm × 1.6 mm × 1.8 mm
EIA 3528-12 (KEMET T, AVX T)3.5 mm × 2.8 mm × 1.2 mm
EIA 3528-21 (KEMET B, AVX B)3.5 mm × 2.8 mm × 2.1 mm
EIA 6032-15 (KEMET U, AVX W)6.0 mm × 3.2 mm × 1.5 mm
EIA 6032-28 (KEMET C, AVX C)6.0 mm × 3.2 mm × 2.8 mm
EIA 7260-38 (KEMET E, AVX V)7.2 mm × 6.0 mm × 3.8 mm
EIA 7343-20 (KEMET V, AVX Y)7.3 mm × 4.3 mm × 2.0 mm
EIA 7343-31 (KEMET D, AVX D)7.3 mm × 4.3 mm × 3.1 mm
EIA 7343-43 (KEMET X, AVX E)7.3 mm × 4.3 mm × 4.3 mm

Aluminum capacitors[36][37][38]
PackageDimensions (Length, typ. × width, typ. × height, max.)
CDE A3.3 mm × 3.3 mm x 5.5 mm
Panasonic B, Chemi-Con D4.3 mm × 4.3 mm x 6.1 mm (5.7 mm for Chemi-Con)
Panasonic C, Chemi-Con E5.3 mm × 5.3 mm x 6.1 mm (5.7 mm for Chemi-Con)
Panasonic D, Chemi-Con F6.6 mm × 6.6 mm x 6.1 mm (5.7 mm for Chemi-Con)
Panasonic E/F, Chemi-Con H8.3 mm × 8.3 mm x 6.5 mm
Panasonic G, Chemi-Con J10.3 mm × 10.3 mm x 10.5 mm
Chemi-Con K13 mm × 13 mm x 14 mm
Panasonic H13.5 mm × 13.5 mm x 14 mm
Panasonic J, Chemi-Con L17 mm × 17 mm x 17 mm
Panasonic K, Chemi-Con M19 mm × 19 mm x 17 mm

Small-outline diode (SOD)
PackageDimensions (Length, typ. × width, typ. × height, max.)
SOD-80C3.5 mm × ⌀ 1.5 mm[39]
SOD-1232.65 mm × 1.6 mm × 1.35 mm[40]
SOD-1283.8 mm × 2.5 mm × 1.1 mm[41]
SOD-323 (SC-90)1.7 mm × 1.25 mm × 1.1 mm[42]
SOD-523 (SC-79)1.2 mm × 0.8 mm × 0.65 mm[43]
SOD-7231.4 mm × 0.6 mm × 0.65 mm[44]
SOD-9230.8 mm × 0.6 mm × 0.4 mm[45]

Metal electrode leadless face[46] (MELF)

Mostly resistors and diodes; barrel shaped components, dimensions do not match those of rectangular references for identical codes.

Package Dimensions
Typical resistor rating
Power (W)Voltage (V)
MicroMelf (MMU), 01022.2 mm × ⌀ 1.1 mm0.2–0.3150
MiniMelf (MMA), 02043.6 mm × ⌀ 1.4 mm0.25–0.4200
Melf (MMB), 02075.8 mm × ⌀ 2.2 mm0.4–1.0300

DO-214

Commonly used for rectifier, Schottky, and other diodes.

PackageDimensions (incl. leads) (Length, typ. × width, typ. × height, max.)
DO-214AA (SMB)5.4 mm × 3.6 mm × 2.65 mm[47]
DO-214AB (SMC)7.95 mm × 5.9 mm × 2.25 mm[47]
DO-214AC (SMA)5.2 mm × 2.6 mm × 2.15 mm[47]

Three- and four-terminal packages

Small-outline transistor (SOT)
PackageDimensions (Length, typ. × width, typ. × height, max.)
SOT-23-3 (TO-236-3) (SC-59)2.92 mm × 1.3 mm × 1.12 mm body: three terminals.[48]
SOT-89 (TO-243)[49] (SC-62)[50]4.5 mm × 2.5 mm × 1.5 mm body: four terminals, center pin is connected to a large heat-transfer pad.[51]
SOT-143 (TO-253)2.9 mm × 1.3 mm × 1.22 mm tapered body: four terminals: one larger pad denotes terminal 1.[52]
SOT-223 (TO-261)6.5 mm × 3.5 mm × 1.8 mm body: four terminals, one of which is a large heat-transfer pad.[53]
SOT-323 (SC-70)2 mm × 1.25 mm × 1.1 mm body: three terminals.[54]
SOT-416 (SC-75)1.6 mm × 0.8 mm × 0.9 mm body: three terminals.[55]
SOT-6631.6 mm × 1.2 mm × 0.6 mm body: three terminals.[56]
SOT-7231.2 mm × 0.8 mm × 0.55 mm body: three terminals: flat lead.[57]
SOT-883 (SC-101)1 mm × 0.6 mm × 0.5 mm body: three terminals: leadless.[58]

Other
  • DPAK (TO-252, SOT-428): Discrete Packaging. Developed by Motorola to house higher powered devices. Comes in three[59] or five-terminal[60] versions.
  • D2PAK (TO-263, SOT-404): Bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions.[61]
  • D3PAK (TO-268): Even larger than D2PAK.[62]

Five- and six-terminal packages

Small-outline transistor (SOT)
PackageDimensions (Length, typ. × width, typ. × height, max.)
SOT-23-6 (SOT-26) (SC-74)2.9 mm × 1.3 mm × 1.3 mm body: six terminals.[63]
SOT-353 (SC-88A)2 mm × 1.25 mm × 0.95 mm body: five terminals.[64]
SOT-363 (SC-88, SC-70-6)2 mm × 1.25 mm × 0.95 mm body: six terminals.[65]
SOT-5631.6 mm × 1.2 mm × 0.6 mm body: six terminals.[66]
SOT-6651.6 mm × 1.6 mm × 0.55 mm body: five terminals.[67]
SOT-6661.6 mm × 1.2 mm × 0.6 mm body: six terminals.[68]
SOT-8861.45 mm × 1 mm × 0.5 mm body: six terminals: leadless.[69]
SOT-891 1 mm × 1 mm × 0.5 mm body: five terminals: leadless.[70]
SOT-953 1 mm × 0.8 mm × 0.5 mm body: five terminals.[71]
SOT-963 1 mm × 1 mm × 0.5 mm body: six terminals.[72]
SOT-1115 1 mm × 0.9 mm × 0.35 mm body: six terminals: leadless.[73]
SOT-1202 1 mm × 1 mm × 0.35 mm body: six terminals: leadless.[74]
Various SMD chips, desoldered
MLP package 28-pin chip, upside down to show contacts

Packages with more than six terminals

Dual-in-line
  • Flatpack was one of the earliest surface-mounted packages.
  • Small-outline integrated circuit (SOIC): dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm.
  • Small-outline package, J-leaded (SOJ): The same as SOIC except J-leaded.[75]
  • Thin small-outline package (TSOP): thinner than SOIC with smaller pin spacing of 0.5 mm.
  • Shrink small-outline package (SSOP): pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm.
  • Thin shrink small-outline package (TSSOP).
  • Quarter-size small-outline package (QSOP): with pin spacing of 0.635 mm.
  • Very small outline package (VSOP): even smaller than QSOP; 0.4-, 0.5-, or 0.65-mm pin spacing.
  • Dual flat no-lead (DFN): smaller footprint than leaded equivalent.

Quad-in-line
  • Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm
  • Quad flat package (QFP): various sizes, with pins on all four sides
  • Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides
  • Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins
  • Ceramic quad flat-pack (CQFP): similar to PQFP
  • Metric quad flat-pack (MQFP): a QFP package with metric pin distribution
  • Thin quad flat-pack (TQFP), a thinner version of LQFP
  • Quad flat no-lead (QFN): smaller footprint than leaded equivalent
  • Leadless chip carrier (LCC): contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
  • Micro leadframe package (MLP, MLF): with a 0.5 mm contact pitch, no leads (same as QFN)
  • Power quad flat no-lead (PQFN): with exposed die-pads for heatsinking

Grid arrays
  • Ball grid array (BGA): A square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm (0.050 in)
  • Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.
  • Fine-pitch ball grid array (FBGA): A square or rectangular array of solder balls on one surface
  • Low-profile fine-pitch ball grid array (LFBGA): A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
  • Thin fine-pitch ball grid array (TFBGA): A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
  • Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.
  • Ceramic column grid array (CCGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
  • Micro ball grid array (μBGA): Ball spacing less than 1 mm
  • Lead-less package (LLP): A package with metric pin distribution (0.5 mm pitch).

Non-packaged devices

Although surface-mount, these devices require specific process for assembly.

  • Chip-on-board (COB), a bare silicon chip, that is usually an integrated circuit, is supplied without a package (which is usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
  • Chip-on-flex (COF), a variation of COB, where a chip is mounted directly to a flex circuit. Tape-automated bonding process is also a chip-on-flex process as well.
  • Chip-on-glass (COG), a variation of COB, where a chip, typically a liquid crystal display (LCD) controller, is mounted directly on glass.
  • Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire. Such wire may then be covered with cotton, glass or other materials to make into smart textiles or electronic textiles.

There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.

See also

References
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