Gen-Z

Gen-Z
Logo of the Gen-Z Consortium
Year created 2016
Created by Gen-Z Consortium
Website http://genzconsortium.org/

The Gen-Z consortium is a trade group of technology vendors involved in designing CPUs, random access memory, servers, storage, and accelerators. The goal was an open and royalty-free "memory-semantic" protocol, which is not limited by the memory controller of a CPU. The basic operations consist of simple loads and stores with the addition of modular extensions. It is intended to be used in a switched fabric or point-to-point where each device connects using a standard connector.[1]

The consortium was publicly announced on October 11, 2016.[2] Server vendor members include Cray, Dell Technologies, Hewlett Packard Enterprise, Huawei, IBM, and Lenovo. CPU vendor members include Advanced Micro Devices, ARM Holdings, Broadcom Limited, Cavium and IBM. Memory and storage vendor members include Micron Technology, Samsung, Seagate Technology, SK Hynix, and Western Digital. Other members include IDT Corporation, Mellanox Technologies, Microsemi, Red Hat, and Xilinx.[1] Analysts noted the absence of Intel (which announced an inter-connect technology of its own called Omni-Path a year before), Nvidia (with its own NVLink technology),[3] and Cisco Systems.[4][2] Some of the vendors also joined a group to promote the Cache coherent interconnect for accelerators (CCIX) protocol on the same day.[5] At about the same time, yet another consortium formed to work on an open specification for the Coherent Accelerator Processor Interface (CAPI).[6] The efforts followed years of delays before products were available with version 4.0 of PCI Express.[7]

References

  1. 1 2 "Gen-Z Consortium". Group's web site. Retrieved March 31, 2017.
  2. 1 2 Agam Shah (October 11, 2016). "Hardware makers unite to challenge Intel with Gen-Z spec". CIO from IDG. Retrieved March 30, 2017.
  3. ↑ Tallis, Billy (13 February 2018). "Gen-Z Core Specification 1.0 Published". Anandtech. Retrieved 21 February 2018.
  4. ↑ Chris Mellor (October 11, 2016). "HPE, IBM, ARM, Samsung and pals in plot to weave 'memory fabric': Everyone but Intel and Cisco working together to build storage-class memory". The Register. Retrieved March 30, 2017.
  5. ↑ Jeff Defilippi (October 11, 2016). "How do AMBA, CCIX and GenZ address the needs of the data center?". ARM Community blog. Retrieved March 30, 2017.
  6. ↑ Chris Mellor (October 14, 2016). "Why OpenCAPI is a declaration of interconnect fabric war: Any standard but Intel in another CPU-memory interconnect consortium". The Register. Retrieved March 30, 2017.
  7. ↑ Evan Koblentz (February 3, 2017). "New PCI Express 4.0 delay may empower next-gen alternatives". Tech Republic. Retrieved March 31, 2017.
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