Chlorodimethylsilane

Chlorodimethylsilane^[1]
Names
	IUPAC name Chlorodimethylsilane
	Other names Dimethylchlorosilane, DMCS
Identifiers
CAS Number	1066-35-9 ;
3D model (JSmol)	Interactive image;
ChemSpider	59496 ;
ECHA InfoCard	100.012.648
EC Number	213-912-0
PubChem CID	6327132;
UNII	XR7E4F5838 ;
UN number	2924
	InChI InChI=1S/C2H7ClSi/c1-4(2)3/h4H,1-2H3 Key: YGHUUVGIRWMJGE-UHFFFAOYSA-N ; InChI=1/C2H7ClSi/c1-4(2)3/h4H,1-2H3 Key: YGHUUVGIRWMJGE-UHFFFAOYAP;
	SMILES Cl[SiH](C)C;
Properties
Chemical formula	(CH3)2SiHCl
Molar mass	94.62 g/mol
Density	0.852 g/mL, 25 °C
Melting point	-111 °C
Boiling point	34.7 °C
Hazards
GHS pictograms
GHS signal word	Danger
GHS hazard statements	H224, H261, H314, H331
GHS precautionary statements	P210, P231+232, P233, P240, P241, P242, P243, P260, P261, P264, P271, P280, P301+330+331, P303+361+353, P304+340, P305+351+338, P310, P311, P321, P363, P370+378, P402+404, P403+233, P403+235, P405
Related compounds
Related compounds	Dichloromethylsilane, Trichlorosilane, Trimethylsilane
	Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
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	Infobox references

Chlorodimethylsilane, also called dimethylchlorosilane and abbreviated DMCS, is a chemical compound with the formula (CH₃)₂SiHCl. It is a silane, with a silicon atom bonded to two methyl groups, a chlorine atom, and a hydrogen atom.

Its structure, including bond lengths and bond angles, has been determined using Fourier transform microwave spectroscopy.^[2]

References

↑ Sigma-Aldrich Handbook of Fine Chemicals 2007, page 654.
↑ Kawashima, Y. (May 2001). "The rotational spectrum of chlorodimethylsilane using Fourier transform microwave spectroscopy". Journal of Molecular Structure. 563-564: 227–230. doi:10.1016/S0022-2860(00)00879-6. Retrieved 2008-02-08.

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[1] Sigma-Aldrich Handbook of Fine Chemicals 2007, page 654.

[2] Kawashima, Y. (May 2001). "The rotational spectrum of chlorodimethylsilane using Fourier transform microwave spectroscopy". Journal of Molecular Structure. 563-564: 227–230. doi:10.1016/S0022-2860(00)00879-6. Retrieved 2008-02-08.