IAg

IAg or Immersion Silver Plating is a surface plating technology used for Printed Circuit Boards.

Description

It consists of a thin immersion silver plating over the copper traces.

Advantages of IAg
  • Excellent surface planarity (compared to e.g. HASL)
  • Low High Frequency Signal loss due to skin effect

Disadvantages of IAg
  • Rapid degradation of surface due to oxidation or contamination (with e.g. sulfur or chlorine)
  • Silver "whiskers" form across electrical potentials and short out components [1]

Specifications

IPC Standard: IPC-4553

See also

References
  1. Slocum, Dan, Jr. (2003-09-25). "Surface Finishes Utilized in the PCB Industry" (PDF). Archived from the original (PDF) on 2013-11-05. Retrieved 2018-11-15.


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