Many electronic components are made of the functioning electronic part and a package to protect and support the working bit. There are hundreds of different packages, each with specific uses, advantages and disadvantages.

All packages have a "body", usually made of plastic or ceramic and occasionally metal, and "pins" to connect the internal workings to an external circuit.

This page lists packages by components type, with basic dimensions and links to more specific pages with package dimensions, PCB footprints, etc.

Passive Components

Semiconductor Devices

Semiconductor devices are labelled according to the JEDEC prefix convention:

• MO: microelectronic outline
• TO: transistor outline
• DO: discrete outline

Where applicable, the alternative names for the same package as given by JEITA or the common abbreviation (for example, DIL for dual in-line) will be noted, as well as the category of package (for example, "flange mounted, rectangular base").

Transistors

Transistors also have a column for the kind of lead. Axial leads are lead which follow the axis of the transistor, that is, perpendicular to the seating plane. Flat leads are parallel to the seating plane.

Package			SMT/THM	Diagram	Pins	Lead Type
JEDEC	JEITA	Abbrv.
TO-92			THM		3	Axial
TO-220			THM	File:TO-220 Front.svg	2-3	Axial

ICs

Package		SMT/THM	Diagram	Pins	Pitch
Abbrv.	Name				mm	inches
CBGA	Ceramic Ball Grid Array	SMT	File:BGA VWF.svg	-	1.27	0.05
PDIP	Plastic Dual In-Line	THM		8-48	2.54	0.1

further reading

• Electronics/Component Identification
• "Guide to IC packages"
• "Howto identify computer chips or integrated circuits on circuit boards"